DE3887801D1 - Mit einer Wärmeabfuhrvorrichtung versehene gedruckte Schaltung. - Google Patents
Mit einer Wärmeabfuhrvorrichtung versehene gedruckte Schaltung.Info
- Publication number
- DE3887801D1 DE3887801D1 DE88402237T DE3887801T DE3887801D1 DE 3887801 D1 DE3887801 D1 DE 3887801D1 DE 88402237 T DE88402237 T DE 88402237T DE 3887801 T DE3887801 T DE 3887801T DE 3887801 D1 DE3887801 D1 DE 3887801D1
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- heat dissipation
- circuit provided
- dissipation device
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8712805A FR2620587B1 (fr) | 1987-09-16 | 1987-09-16 | Circuit imprime equipe d'un drain thermique |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3887801D1 true DE3887801D1 (de) | 1994-03-24 |
DE3887801T2 DE3887801T2 (de) | 1994-07-28 |
Family
ID=9354938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3887801T Expired - Fee Related DE3887801T2 (de) | 1987-09-16 | 1988-09-06 | Mit einer Wärmeabfuhrvorrichtung versehene gedruckte Schaltung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4945451A (de) |
EP (1) | EP0308296B1 (de) |
CA (1) | CA1297595C (de) |
DE (1) | DE3887801T2 (de) |
FR (1) | FR2620587B1 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2649578B1 (fr) * | 1989-07-10 | 1991-09-20 | Alcatel Business Systems | Dispositif de dissipation thermique pour composant de type cms monte sur plaque de circuit imprime |
US5019941A (en) * | 1989-11-03 | 1991-05-28 | Motorola, Inc. | Electronic assembly having enhanced heat dissipating capabilities |
US5031071A (en) * | 1990-04-30 | 1991-07-09 | Motorola, Inc. | Heat spreading device for component leads |
JP2982126B2 (ja) * | 1991-03-20 | 1999-11-22 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
JPH06503210A (ja) † | 1991-09-21 | 1994-04-07 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 電気装置、特に車両用の切換−及び制御装置 |
DE4220966C2 (de) * | 1992-06-25 | 1995-12-21 | Siemens Ag | Verfahren zum Herstellen einer Trägerplatte für elektrische Bauteile |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
US5365399A (en) * | 1992-08-03 | 1994-11-15 | Motorola, Inc. | Heat sinking apparatus for surface mountable power devices |
DE4302917C1 (de) * | 1993-02-03 | 1994-07-07 | Bosch Gmbh Robert | Anordnung zur Wärmeableitung von auf Leiterplatten montierten Leistungsbauelementen |
JPH06252285A (ja) * | 1993-02-24 | 1994-09-09 | Fuji Xerox Co Ltd | 回路基板 |
DE4335946C2 (de) * | 1993-10-21 | 1997-09-11 | Bosch Gmbh Robert | Anordnung bestehend aus einer Leiterplatte |
DE4337866A1 (de) * | 1993-11-05 | 1995-05-11 | Siemens Ag | Steuergerät, insbesondere für ein Kraftfahrzeug |
KR0126781Y1 (ko) * | 1994-08-23 | 1999-05-01 | 이형도 | 반도체소자 방열장치 |
US6073684A (en) | 1998-02-23 | 2000-06-13 | Applied Thermal Technology | Clad casting for laptop computers and the like |
JP3514221B2 (ja) * | 2000-08-10 | 2004-03-31 | 株式会社デンソー | プリント配線基板 |
US6718619B2 (en) | 2000-12-15 | 2004-04-13 | Atheros Communications, Inc. | Method of manufacturing a central stem monopole antenna |
US6883227B2 (en) | 2000-12-15 | 2005-04-26 | Atheros Communications, Inc. | Method of manufacturing a side stem monopole antenna |
AU2002239546A1 (en) * | 2000-12-15 | 2002-06-24 | Atheros Communications, Inc. | Methods of manufacturing and mounting a side stem or central-stem monopole antenna |
US6538605B2 (en) | 2000-12-15 | 2003-03-25 | Atheros Communications, Inc. | Method and system for mounting a monopole antenna |
US6377462B1 (en) | 2001-01-09 | 2002-04-23 | Deere & Company | Circuit board assembly with heat sinking |
DE10129511A1 (de) * | 2001-06-19 | 2003-01-16 | Hella Kg Hueck & Co | Vorrichtung für die Kühlung einer elektronischen Schaltung, insbesondere für den Einsatz in einem Kraftfahrzeug |
JP2004172459A (ja) * | 2002-11-21 | 2004-06-17 | Advics:Kk | 電子制御装置における電子部品の放熱構造 |
US20040108130A1 (en) * | 2002-12-09 | 2004-06-10 | Yazaki Corporation | Mounting structure for electronic component |
DE10351826A1 (de) * | 2003-11-06 | 2005-06-09 | Conti Temic Microelectronic Gmbh | Leiterplatte mit mindestens einem elektronischen Bauelement |
TWI273379B (en) * | 2004-09-30 | 2007-02-11 | Asustek Comp Inc | Heat sink module |
US20070074897A1 (en) * | 2005-09-08 | 2007-04-05 | Ronald Lashley | Thermal event detection on printed wire boards |
GB2448270B (en) * | 2006-02-10 | 2012-02-08 | Innovatech Ltd | Circuit board and radiating heat system for circuit board |
US20090091889A1 (en) * | 2007-10-09 | 2009-04-09 | Oman Todd P | Power electronic module having improved heat dissipation capability |
EP2276329A1 (de) * | 2009-07-16 | 2011-01-19 | ABB Research Ltd. | Elektronische Platine mit Wärmekondensator |
EP2323465B1 (de) | 2009-11-10 | 2013-02-20 | OSRAM GmbH | Elektrischer Schaltkreis mit Kühlkörper |
US9107296B2 (en) * | 2011-06-01 | 2015-08-11 | Telefonaktiebolaget L M Ericsson (Publ) | Thermo/electrical conductor arrangement for multilayer printed circuit boards |
US8729398B2 (en) * | 2012-03-28 | 2014-05-20 | Deere & Company | Electrical assembly with compliant pins for heat dissipation |
DE202014002060U1 (de) * | 2014-03-06 | 2015-04-08 | HKR Seuffer Automotive GmbH & Co. KG | Kühleinrichtung und Kühlanordnung mit der Kühleinrichtung |
DE102014117943B4 (de) | 2014-12-05 | 2022-12-08 | Infineon Technologies Austria Ag | Vorrichtung mit einer Leiterplatte und einem Metallwerkstück |
US10561045B2 (en) | 2018-03-19 | 2020-02-11 | Dolby Laboratories Licensing Corporation | Surface mount heatsink attachment |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3222580A (en) * | 1963-10-29 | 1965-12-07 | Philco Corp | Heat exchange apparatus |
NL7207899A (de) * | 1972-06-09 | 1973-12-11 | ||
US4254447A (en) * | 1979-04-10 | 1981-03-03 | Rca Corporation | Integrated circuit heat dissipator |
US4344106A (en) * | 1980-11-26 | 1982-08-10 | Rca Corporation | Transistor heat sink assembly |
DE3203609C2 (de) * | 1982-02-03 | 1985-02-14 | Siemens AG, 1000 Berlin und 8000 München | Kühlelement für integrierte Bauelemente |
GB2126014A (en) * | 1982-08-14 | 1984-03-14 | Int Computers Ltd | Heat sink for electronic circuit assemblies |
FR2560731B1 (fr) * | 1984-03-05 | 1989-05-12 | Telecommunications Sa | Carte imprimee multicouche thermoconductrice |
US4729061A (en) * | 1985-04-29 | 1988-03-01 | Advanced Micro Devices, Inc. | Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
-
1987
- 1987-09-16 FR FR8712805A patent/FR2620587B1/fr not_active Expired - Fee Related
-
1988
- 1988-09-06 DE DE3887801T patent/DE3887801T2/de not_active Expired - Fee Related
- 1988-09-06 EP EP88402237A patent/EP0308296B1/de not_active Revoked
- 1988-09-14 CA CA000577342A patent/CA1297595C/fr not_active Expired - Lifetime
- 1988-09-16 US US07/245,260 patent/US4945451A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA1297595C (fr) | 1992-03-17 |
FR2620587B1 (fr) | 1993-07-02 |
EP0308296B1 (de) | 1994-02-16 |
EP0308296A1 (de) | 1989-03-22 |
DE3887801T2 (de) | 1994-07-28 |
US4945451A (en) | 1990-07-31 |
FR2620587A1 (fr) | 1989-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3887801T2 (de) | Mit einer Wärmeabfuhrvorrichtung versehene gedruckte Schaltung. | |
DE3672521D1 (de) | Thermische verbindung fuer eine mit elektronischen komponenten bestueckte schaltungsplatte. | |
DE3583629D1 (de) | Integrierte schaltung mit einer schmelzsicherungsschaltung. | |
DE3684039D1 (de) | Elektronisches kamerageraet. | |
DE3775625D1 (de) | Gedruckte leiterplatte. | |
DE3880385D1 (de) | Gedruckte leiterplatte. | |
DE3888343D1 (de) | Elektronische reproduktionsvorrichtung mit hervorhebender farbe. | |
DE3669431D1 (de) | Gedruckte schaltungsplatte mit hoher dichte. | |
DE69010034D1 (de) | Halbleiteranordnung mit einer Schutzschaltung. | |
DE58907795D1 (de) | Baugruppe mit einer Leiterplatte. | |
DE3852073D1 (de) | Angepasste gedruckte Schaltung. | |
DE69009786D1 (de) | Schaltungsanordnung mit Mehrfachrückkopplung. | |
DE3771707D1 (de) | Gedruckte leiterplatte. | |
DE3750185D1 (de) | Dickschicht-Schaltungsanordnung mit einer keramischen Substratplatte. | |
DE69016803T2 (de) | Thermotransfer-Druckeinrichtung. | |
DE3878027D1 (de) | Leistungsversorgungseinrichtung mit sperr-schwingkreis. | |
NL186468C (nl) | Koelinrichting met een stuurschakeling. | |
DE68921155T2 (de) | Elektrische Schaltungsvorrichtung mit einer Kassettenverbindungsschaltung. | |
DE3872865D1 (de) | Gedruckte leiterkarte. | |
DE3784634T2 (de) | Gedruckte schaltungsplatte. | |
DE3688008T2 (de) | Gegossenes Produkt mit einer gedruckten Schaltungsplatte. | |
IT8983431A0 (it) | Circuito stampato a connessioni circonferenziali. | |
DE3854199T2 (de) | Druckvorrichtung mit punktanschlag. | |
DE3888231D1 (de) | Videoausarbeitung mit einer Software-Lineartastschaltung. | |
DE3669618D1 (de) | Mos-integrierte schaltung mit einer schutzschaltung die geteilte schutzwiderstaende beinhaltet. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8339 | Ceased/non-payment of the annual fee |