DE3883761D1 - Vorrichtung zur herstellung einer lötverbindung. - Google Patents

Vorrichtung zur herstellung einer lötverbindung.

Info

Publication number
DE3883761D1
DE3883761D1 DE88903885T DE3883761T DE3883761D1 DE 3883761 D1 DE3883761 D1 DE 3883761D1 DE 88903885 T DE88903885 T DE 88903885T DE 3883761 T DE3883761 T DE 3883761T DE 3883761 D1 DE3883761 D1 DE 3883761D1
Authority
DE
Germany
Prior art keywords
solder
producing
soldered connection
flowed
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE88903885T
Other languages
English (en)
Other versions
DE3883761T2 (de
Inventor
Jacques Delalle
Mahrez Ouaniche
Philippe Roucaute
Michele Lamothe
Frederic Passa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commscope Connectivity Belgium BVBA
Raychem SA
Original Assignee
Raychem NV SA
Raychem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem NV SA, Raychem SA filed Critical Raychem NV SA
Publication of DE3883761D1 publication Critical patent/DE3883761D1/de
Application granted granted Critical
Publication of DE3883761T2 publication Critical patent/DE3883761T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H01R4/72—Insulation of connections using a heat shrinking insulating sleeve
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H01R4/72—Insulation of connections using a heat shrinking insulating sleeve
    • H01R4/723—Making a soldered electrical connection simultaneously with the heat shrinking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/08—Shrinkable tubes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE88903885T 1987-05-02 1988-04-29 Vorrichtung zur herstellung einer lötverbindung. Expired - Lifetime DE3883761T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB878710489A GB8710489D0 (en) 1987-05-02 1987-05-02 Solder connector device

Publications (2)

Publication Number Publication Date
DE3883761D1 true DE3883761D1 (de) 1993-10-07
DE3883761T2 DE3883761T2 (de) 1994-01-20

Family

ID=10616768

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88903885T Expired - Lifetime DE3883761T2 (de) 1987-05-02 1988-04-29 Vorrichtung zur herstellung einer lötverbindung.

Country Status (12)

Country Link
US (2) US5086967A (de)
EP (1) EP0360811B1 (de)
JP (1) JP2843346B2 (de)
KR (1) KR0159759B1 (de)
AT (1) ATE93994T1 (de)
AU (1) AU1685788A (de)
BR (1) BR8807492A (de)
CA (1) CA1337030C (de)
DE (1) DE3883761T2 (de)
GB (1) GB8710489D0 (de)
IL (1) IL86238A (de)
WO (1) WO1988009068A1 (de)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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GB8710489D0 (en) * 1987-05-02 1987-06-03 Raychem Pontoise Sa Solder connector device
GB8817192D0 (en) * 1988-07-19 1988-08-24 Raychem Pontoise Sa Solder & connection device incorporating solder
GB8903311D0 (en) * 1989-02-14 1989-04-05 Raychem Pontoise Sa Composite solder article
US4940179A (en) * 1989-06-20 1990-07-10 Raychem Corporation Device for forming a solder connection
GB9014119D0 (en) * 1990-06-25 1990-08-15 Raychem Pontoise Sa Electrical connector
ES2102398T3 (es) * 1990-06-25 1997-08-01 Raychem Sa Nv Conector electrico.
DE69220211T2 (de) * 1991-02-07 1998-01-29 Raychem S.A., Cergy-Saint-Christophe Elektrischer verbinder
GB9118841D0 (en) * 1991-09-03 1991-10-16 Raychem Sa Nv Electrical connector
US5221815A (en) * 1991-07-26 1993-06-22 Raychem Corporation Heat recoverable soldering device
GB9116523D0 (en) * 1991-07-31 1991-09-11 Raychem Sa Nv Electrical component
US5393932A (en) * 1992-02-14 1995-02-28 Minnesota Mining And Manufacturing Company Wire connector
US5369225A (en) * 1993-04-20 1994-11-29 Minnesota Mining And Manufacturing Company Wire connector
GB9203289D0 (en) * 1992-02-17 1992-04-01 Raychem Sa Nv Coaxial cable termination arrangement
GB9203591D0 (en) * 1992-02-20 1992-04-08 Raychem Sa Nv Electrical connector
GB9207868D0 (en) * 1992-04-09 1992-05-27 Raychem Sa Nv Electrical connector
US5331113A (en) * 1992-10-30 1994-07-19 Raychem Corporation Electrical connector
JP3161673B2 (ja) * 1994-05-30 2001-04-25 松下電器産業株式会社 マイクロスピーカ用磁気回路ユニット及びその製造方法
US6135342A (en) * 1997-03-28 2000-10-24 Kennedy; Georgia Lee Method and tool for imprinting a pattern in a solder
US5928404A (en) * 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
US5961032A (en) * 1997-06-30 1999-10-05 International Business Machines Corporation Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold
JP3335896B2 (ja) * 1997-12-26 2002-10-21 株式会社東芝 ハンダ材及びハンダ材の製造方法
GB9809387D0 (en) 1998-05-02 1998-07-01 Raychem Sa Nv A support for a splice in an elongate element
US6196442B1 (en) * 1998-05-18 2001-03-06 Visteon Global Technologies, Inc. Method for brazing aluminum tube assemblies
US6319617B1 (en) 1999-12-17 2001-11-20 Agere Systems Gaurdian Corp. Oxide-bondable solder
US6609651B1 (en) * 2000-11-20 2003-08-26 Delphi Technologies, Inc Method of soldering a leaded circuit component
US6869007B2 (en) * 2001-01-26 2005-03-22 Lucent Technologies Inc. Oxidation-resistant reactive solders and brazes
DE10258824B3 (de) * 2002-12-06 2004-05-06 Hjb Rolling Mill Technology Gmbh Verfahren zum Herstellen eines Bandes mit einem in dessen Querschnitt verlaufenden Stufenprofil
KR100595888B1 (ko) * 2004-05-11 2006-07-03 심종대 소프트빔을 이용한 솔더링 방법
DE102005040819A1 (de) * 2005-08-27 2007-03-08 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Lot sowie Verfahren zu dessen Anbringung
US20070152321A1 (en) * 2005-12-29 2007-07-05 Wei Shi Fluxless heat spreader bonding with cold form solder
JP4341654B2 (ja) * 2006-09-14 2009-10-07 セイコーエプソン株式会社 液体噴射ヘッドユニットの製造方法
EP2078578A1 (de) * 2008-01-10 2009-07-15 Siemens Aktiengesellschaft Belotung von Löchern, Verfahren zum Beschichten und Lotgutstäbchen
USD713585S1 (en) 2011-09-16 2014-09-16 Nord Light S.P.A. Downlight
US9272371B2 (en) 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
USD749287S1 (en) * 2014-11-10 2016-02-09 Dennis T. Thompson, Sr. Hydraulic jack extension
JP6613147B2 (ja) * 2016-01-14 2019-11-27 住友電気工業株式会社 熱回復部品、電線束、及び絶縁電線被覆方法
DE102016102948A1 (de) * 2016-02-19 2017-08-24 PKC SEGU Systemelektrik GmbH Verfahren und Vorrichtung zur Abdichtung von Kontaktstellen an elektrischen Leitungsverbindungen
US11239639B2 (en) 2016-09-30 2022-02-01 TE Connectivity Services Gmbh Assembly and method for sealing a bundle of wires
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections
USD891520S1 (en) * 2017-08-04 2020-07-28 Aristocrat Technologies Australia Pty Limited Gaming machine topper
USD907235S1 (en) * 2017-09-18 2021-01-05 University Of Hertfordshire Higher Education Corporation Enclosure for dissolution system
WO2020016699A1 (en) * 2018-07-17 2020-01-23 Te Connectivity Corporation System and method for sealing electrical terminals
US11257612B2 (en) 2018-07-26 2022-02-22 TE Connectivity Services Gmbh Assembly and method for sealing a bundle of wires
USD888021S1 (en) * 2019-06-27 2020-06-23 Jose Luis Telle Faraday shield for loud speakers
USD935910S1 (en) * 2019-08-16 2021-11-16 Brandon Turk Floor height gauge
USD951784S1 (en) * 2019-08-16 2022-05-17 Brandon Turk Floor height gauge
USD969626S1 (en) * 2021-02-01 2022-11-15 Brandon Turk Floor height gauge

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GB190924932A (en) * 1908-11-02 Peter Bentzen Niels Improvements in Envelopes.
US1248506A (en) * 1916-08-05 1917-12-04 Jacob Lavine Solder for soldering metals.
GB282007A (en) * 1926-12-10 1928-04-05 Hermann Aloys Meinhardt Improvements in and relating to solder bars
GB400817A (en) * 1932-02-04 1933-11-02 Hans Kanz Improvements relating to the manufacture of an additional material for hard-soldering and welding purposes
US2503564A (en) * 1944-09-02 1950-04-11 Bell Telephone Labor Inc Soldering composition
GB734195A (en) * 1952-05-19 1955-07-27 John Cockbain Briggs Improvements in and relating to solders
US3384951A (en) * 1965-04-23 1968-05-28 Aluminum Co Of America Composite aluminous product and method
US3464617A (en) * 1965-06-09 1969-09-02 Rand Dev Corp Sweat solder form
DE1263460B (de) * 1965-10-06 1968-03-14 Josef Klein Loetzwischenlage
US3305625A (en) * 1966-02-10 1967-02-21 Raychem Corp Heat shrinkable solder sleeve
US3525799A (en) * 1968-05-17 1970-08-25 Raychem Corp Heat recoverable connector
DE7123387U (de) * 1971-06-18 1972-10-05 Rosenthal Stemag Techn Keramik Gmbh Ummanteltes Lötmittel in Draht- oder Bandform
GB1470049A (en) * 1973-03-21 1977-04-14 Rachem Corp Splicing method and heat-recoverable article
US3957382A (en) * 1973-06-11 1976-05-18 Raychem Corporation Method of processing fusible inserts
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US4431465A (en) * 1981-06-04 1984-02-14 Gte Products Corporation Brazing alloy paste
JPS57202994A (en) * 1981-06-09 1982-12-13 Senjiyu Kinzoku Kogyo Kk Solder clad material containing flux and its manufacture
JPS588535U (ja) * 1981-07-06 1983-01-20 株式会社ダイフク 組立て作業ラインからの被搬送物搬出装置
JPS5842793A (ja) * 1981-09-04 1983-03-12 Nippon Kokan Kk <Nkk> 鋼ストリツプの電気めつき方法
JPS5846806A (ja) * 1981-09-11 1983-03-18 富士電機株式会社 しや断器のインタロツク装置
JPS5966993A (ja) * 1982-10-08 1984-04-16 Senjiyu Kinzoku Kogyo Kk 高温クリ−ムはんだ
GB2149468B (en) * 1983-11-08 1988-10-12 Raychem Ltd Device for connecting elongate objects
EP0172072B1 (de) * 1984-07-18 1989-04-05 Raychem Pontoise S.A. Vorrichtung zur Herstellung einer Lötverbindung
US4727633A (en) * 1985-08-08 1988-03-01 Tektronix, Inc. Method of securing metallic members together
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US4832248A (en) * 1986-11-20 1989-05-23 Raychem Corporation Adhesive and solder connection device
GB8710489D0 (en) * 1987-05-02 1987-06-03 Raychem Pontoise Sa Solder connector device

Also Published As

Publication number Publication date
AU1685788A (en) 1988-12-06
US5086967A (en) 1992-02-11
EP0360811B1 (de) 1993-09-01
WO1988009068A1 (en) 1988-11-17
KR0159759B1 (ko) 1998-12-15
BR8807492A (pt) 1990-03-27
GB8710489D0 (en) 1987-06-03
CA1337030C (en) 1995-09-19
EP0360811A1 (de) 1990-04-04
KR890700938A (ko) 1989-04-28
DE3883761T2 (de) 1994-01-20
JP2843346B2 (ja) 1999-01-06
JPH02503653A (ja) 1990-11-01
ATE93994T1 (de) 1993-09-15
IL86238A (en) 1991-12-12
IL86238A0 (en) 1988-11-15
US5350105A (en) 1994-09-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition