DE3879541D1 - Pruefverfahren fuer lcd-elemente. - Google Patents
Pruefverfahren fuer lcd-elemente.Info
- Publication number
- DE3879541D1 DE3879541D1 DE8888200707T DE3879541T DE3879541D1 DE 3879541 D1 DE3879541 D1 DE 3879541D1 DE 8888200707 T DE8888200707 T DE 8888200707T DE 3879541 T DE3879541 T DE 3879541T DE 3879541 D1 DE3879541 D1 DE 3879541D1
- Authority
- DE
- Germany
- Prior art keywords
- test procedure
- lcd elements
- lcd
- elements
- procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/305—Contactless testing using electron beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S345/00—Computer graphics processing and selective visual display systems
- Y10S345/904—Display with fail/safe testing feature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL8700933A NL8700933A (nl) | 1987-04-21 | 1987-04-21 | Testmethode voor lcd-elementen. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3879541D1 true DE3879541D1 (de) | 1993-04-29 |
DE3879541T2 DE3879541T2 (de) | 1993-09-30 |
Family
ID=19849887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88200707T Expired - Fee Related DE3879541T2 (de) | 1987-04-21 | 1988-04-13 | Prüfverfahren für LCD-Elemente. |
Country Status (8)
Country | Link |
---|---|
US (1) | US4843312A (de) |
EP (1) | EP0290066B1 (de) |
JP (1) | JP2984712B2 (de) |
KR (1) | KR970000710B1 (de) |
CN (1) | CN1014359B (de) |
DE (1) | DE3879541T2 (de) |
HK (1) | HK88294A (de) |
NL (1) | NL8700933A (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8921561D0 (en) * | 1989-09-23 | 1989-11-08 | Univ Edinburgh | Designs and procedures for testing integrated circuits containing sensor arrays |
US5179345A (en) * | 1989-12-13 | 1993-01-12 | International Business Machines Corporation | Method and apparatus for analog testing |
US5057775A (en) * | 1990-05-04 | 1991-10-15 | Genrad, Inc. | Method of testing control matrices for flat-panel displays |
JPH04158238A (ja) * | 1990-10-22 | 1992-06-01 | Ezel Inc | 液晶パネルの検査方法 |
US5285150A (en) * | 1990-11-26 | 1994-02-08 | Photon Dynamics, Inc. | Method and apparatus for testing LCD panel array |
US5113134A (en) * | 1991-02-28 | 1992-05-12 | Thomson, S.A. | Integrated test circuit for display devices such as LCD's |
JP2792634B2 (ja) * | 1991-06-28 | 1998-09-03 | シャープ株式会社 | アクティブマトリクス基板の検査方法 |
EP0526734A3 (en) * | 1991-07-04 | 1993-03-03 | Advantest Corporation | Noncontact probe and active matrix array inspection apparatus using the same |
US5268638A (en) * | 1991-07-15 | 1993-12-07 | Siemens Aktiengesellschaft | Method for particle beam testing of substrates for liquid crystal displays "LCD" |
KR960002145B1 (ko) * | 1991-07-30 | 1996-02-13 | 가부시기가이샤 히다찌세이사구쇼 | 박막트랜지스터 액정기판의 검사방법 및 그 장치 |
US5184082A (en) * | 1991-09-18 | 1993-02-02 | Honeywell Inc. | Apparatus and method for testing an active matrix pixel display |
JPH09501889A (ja) * | 1992-06-02 | 1997-02-25 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 可変伸張低粘着化粘着テープによる一体化システム |
US5442282A (en) * | 1992-07-02 | 1995-08-15 | Lsi Logic Corporation | Testing and exercising individual, unsingulated dies on a wafer |
US5648661A (en) * | 1992-07-02 | 1997-07-15 | Lsi Logic Corporation | Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies |
US5389556A (en) * | 1992-07-02 | 1995-02-14 | Lsi Logic Corporation | Individually powering-up unsingulated dies on a wafer |
JPH06110069A (ja) * | 1992-09-29 | 1994-04-22 | Matsushita Electric Ind Co Ltd | 電子部品の欠陥修復方法および欠陥修復装置 |
US5546013A (en) * | 1993-03-05 | 1996-08-13 | International Business Machines Corporation | Array tester for determining contact quality and line integrity in a TFT/LCD |
US5404110A (en) * | 1993-03-25 | 1995-04-04 | International Business Machines Corporation | System using induced current for contactless testing of wiring networks |
DE69429394T2 (de) * | 1993-08-25 | 2002-08-22 | Kabushiki Kaisha Toshiba, Kawasaki | Flüssigkristall-Anzeigevorrichtung und Verfahren zu ihrer Herstellung |
US5532174A (en) * | 1994-04-22 | 1996-07-02 | Lsi Logic Corporation | Wafer level integrated circuit testing with a sacrificial metal layer |
DE19525081B4 (de) * | 1995-07-10 | 2006-06-29 | Display Products Group, Inc., Hayward | Verfahren und Vorrichtung zum Testen der Funktion von Mikrostrukturelementen |
US5751159A (en) * | 1995-09-05 | 1998-05-12 | Motorola, Inc. | Semiconductor array and switches formed on a common substrate for array testing purposes |
DE19901767A1 (de) * | 1999-01-18 | 2000-07-20 | Etec Ebt Gmbh | Verfahren und Vorrichtung zum Testen der Funktion einer Vielzahl von Mikrostrukturelementen |
US7129694B2 (en) * | 2002-05-23 | 2006-10-31 | Applied Materials, Inc. | Large substrate test system |
DE10227332A1 (de) * | 2002-06-19 | 2004-01-15 | Akt Electron Beam Technology Gmbh | Ansteuervorrichtung mit verbesserten Testeneigenschaften |
US7330583B2 (en) * | 2002-08-19 | 2008-02-12 | Photon Dynamics, Inc. | Integrated visual imaging and electronic sensing inspection systems |
US6833717B1 (en) * | 2004-02-12 | 2004-12-21 | Applied Materials, Inc. | Electron beam test system with integrated substrate transfer module |
US7355418B2 (en) * | 2004-02-12 | 2008-04-08 | Applied Materials, Inc. | Configurable prober for TFT LCD array test |
US7319335B2 (en) * | 2004-02-12 | 2008-01-15 | Applied Materials, Inc. | Configurable prober for TFT LCD array testing |
US20060038554A1 (en) * | 2004-02-12 | 2006-02-23 | Applied Materials, Inc. | Electron beam test system stage |
US7084970B2 (en) * | 2004-05-14 | 2006-08-01 | Photon Dynamics, Inc. | Inspection of TFT LCD panels using on-demand automated optical inspection sub-system |
US8013816B2 (en) * | 2004-06-30 | 2011-09-06 | Samsung Mobile Display Co., Ltd. | Light emitting display |
US7075323B2 (en) * | 2004-07-29 | 2006-07-11 | Applied Materials, Inc. | Large substrate test system |
US7256606B2 (en) * | 2004-08-03 | 2007-08-14 | Applied Materials, Inc. | Method for testing pixels for LCD TFT displays |
US7535238B2 (en) * | 2005-04-29 | 2009-05-19 | Applied Materials, Inc. | In-line electron beam test system |
JP5829376B2 (ja) * | 2006-03-14 | 2015-12-09 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | マルチカラム電子ビーム検査システムにおけるクロストークの軽減方法 |
DE102006015714B4 (de) * | 2006-04-04 | 2019-09-05 | Applied Materials Gmbh | Lichtunterstütztes Testen eines optoelektronischen Moduls |
US7786742B2 (en) * | 2006-05-31 | 2010-08-31 | Applied Materials, Inc. | Prober for electronic device testing on large area substrates |
US7602199B2 (en) * | 2006-05-31 | 2009-10-13 | Applied Materials, Inc. | Mini-prober for TFT-LCD testing |
CN104966491A (zh) * | 2015-07-28 | 2015-10-07 | 昆山国显光电有限公司 | 有机发光显示面板及其制造方法 |
CN110780472B (zh) * | 2019-10-23 | 2022-09-16 | 南方科技大学 | 一种激光扫描控制系统 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3969670A (en) * | 1975-06-30 | 1976-07-13 | International Business Machines Corporation | Electron beam testing of integrated circuits |
US4169244A (en) * | 1978-02-03 | 1979-09-25 | Plows Graham S | Electron probe testing, analysis and fault diagnosis in electronic circuits |
DE2824308A1 (de) * | 1978-06-02 | 1979-12-13 | Siemens Ag | Verfahren zum einpraegen einer spannung mit einem elektronenstrahl |
US4172228A (en) * | 1978-06-30 | 1979-10-23 | Nasa | Method for analyzing radiation sensitivity of integrated circuits |
DE2831787C2 (de) * | 1978-07-19 | 1983-02-17 | Siemens AG, 1000 Berlin und 8000 München | Mit Hilfe eines Elektronen- oder Laserstrahls prüfbare integrierte Schaltungsanordnung |
JPS5738498A (en) * | 1980-08-21 | 1982-03-03 | Suwa Seikosha Kk | Testing system for active matrix substrate |
DE3110138A1 (de) * | 1981-03-16 | 1982-09-23 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur darstellung logischer zustandsaenderungen mehrerer benachbarter schaltungsknoten in integrierten schaltungen in einem logikbild mittels einer gepulsten elektronensonde |
US4404635A (en) * | 1981-03-27 | 1983-09-13 | International Business Machines Corporation | Programmable integrated circuit and method of testing the circuit before it is programmed |
US4415851A (en) * | 1981-05-26 | 1983-11-15 | International Business Machines Corporation | System for contactless testing of multi-layer ceramics |
US4578279A (en) * | 1981-05-26 | 1986-03-25 | International Business Machines Corporation | Inspection of multilayer ceramic circuit modules by electrical inspection of unfired green sheets |
US4629898A (en) * | 1981-10-02 | 1986-12-16 | Oregon Graduate Center | Electron and ion beam apparatus and passivation milling |
JPS58178321A (ja) * | 1982-04-13 | 1983-10-19 | Seiko Epson Corp | 電気光学装置 |
DE3232671A1 (de) * | 1982-09-02 | 1984-03-08 | Siemens AG, 1000 Berlin und 8000 München | Anordnung und verfahren zur spannungsmessung an einem vergrabenen messobjekt |
DE3235100A1 (de) * | 1982-09-22 | 1984-03-22 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur messung elektrischer potentiale an vergrabener festkoerpersubstanz |
DE3235501A1 (de) * | 1982-09-24 | 1984-03-29 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zur signaleinpraegung in integrierte mos-schaltungen durch elektronenbestrahlung mit elektronen niedriger energie |
DE3235461A1 (de) * | 1982-09-24 | 1984-03-29 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur kontaktlosen pruefung eines objekts, insbesondere von mikroverdrahtungen, mit einer korpuskularstrahl-sonde |
JPS6082870A (ja) * | 1983-10-12 | 1985-05-11 | Seiko Epson Corp | アクテイブマトリクス基板の検査方法 |
FR2554622B1 (fr) * | 1983-11-03 | 1988-01-15 | Commissariat Energie Atomique | Procede de fabrication d'une matrice de composants electroniques |
US4588950A (en) * | 1983-11-15 | 1986-05-13 | Data Probe Corporation | Test system for VLSI digital circuit and method of testing |
US4985681A (en) * | 1985-01-18 | 1991-01-15 | Siemens Aktiengesellschaft | Particle beam measuring method for non-contact testing of interconnect networks |
JPS61212883A (ja) * | 1985-03-18 | 1986-09-20 | 株式会社日立製作所 | アクテイブマトリクス液晶表示装置 |
US4644264A (en) * | 1985-03-29 | 1987-02-17 | International Business Machines Corporation | Photon assisted tunneling testing of passivated integrated circuits |
JPS61234541A (ja) * | 1985-04-11 | 1986-10-18 | Canon Inc | トランジスタアレイの検査方法 |
US4755746A (en) * | 1985-04-24 | 1988-07-05 | Prometrix Corporation | Apparatus and methods for semiconductor wafer testing |
JPS61276337A (ja) * | 1985-05-31 | 1986-12-06 | Matsushita Electric Ind Co Ltd | 半導体検査装置 |
JPH0682718B2 (ja) * | 1985-08-12 | 1994-10-19 | 日本電信電話株式会社 | 電子デバイスの試験装置およびその使用方法 |
US4745360A (en) * | 1986-05-01 | 1988-05-17 | North American Phillips Corporation, Signetics Division | Electron-beam probe system utilizing test device having interdigitated conductive pattern and associated method of using the test device |
US4721910A (en) * | 1986-09-12 | 1988-01-26 | American Telephone And Telegraph Company, At&T Bell Laboratories | High speed circuit measurements using photoemission sampling |
-
1987
- 1987-04-21 NL NL8700933A patent/NL8700933A/nl not_active Application Discontinuation
-
1988
- 1988-03-29 US US07/174,564 patent/US4843312A/en not_active Expired - Lifetime
- 1988-04-13 DE DE88200707T patent/DE3879541T2/de not_active Expired - Fee Related
- 1988-04-13 EP EP88200707A patent/EP0290066B1/de not_active Expired - Lifetime
- 1988-04-18 JP JP63093606A patent/JP2984712B2/ja not_active Expired - Fee Related
- 1988-04-18 KR KR88004374A patent/KR970000710B1/ko not_active IP Right Cessation
- 1988-04-18 CN CN88102316A patent/CN1014359B/zh not_active Expired
-
1994
- 1994-08-25 HK HK88294A patent/HK88294A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3879541T2 (de) | 1993-09-30 |
KR970000710B1 (en) | 1997-01-18 |
CN1014359B (zh) | 1991-10-16 |
EP0290066A1 (de) | 1988-11-09 |
JPS63272046A (ja) | 1988-11-09 |
NL8700933A (nl) | 1988-11-16 |
US4843312A (en) | 1989-06-27 |
HK88294A (en) | 1994-09-02 |
JP2984712B2 (ja) | 1999-11-29 |
KR880013234A (ko) | 1988-11-30 |
EP0290066B1 (de) | 1993-03-24 |
CN88102316A (zh) | 1988-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |