DE3879441D1 - Verfahren zur herstellung von koerpern mit einem kupferueberzug. - Google Patents
Verfahren zur herstellung von koerpern mit einem kupferueberzug.Info
- Publication number
- DE3879441D1 DE3879441D1 DE8888121504T DE3879441T DE3879441D1 DE 3879441 D1 DE3879441 D1 DE 3879441D1 DE 8888121504 T DE8888121504 T DE 8888121504T DE 3879441 T DE3879441 T DE 3879441T DE 3879441 D1 DE3879441 D1 DE 3879441D1
- Authority
- DE
- Germany
- Prior art keywords
- copper cover
- producing bodies
- bodies
- producing
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62325567A JPH01168865A (ja) | 1987-12-24 | 1987-12-24 | 銅膜形成物品の製造法 |
JP62325570A JPH01168868A (ja) | 1987-12-24 | 1987-12-24 | 銅膜形成物品の製造法 |
JP62325568A JPH01168866A (ja) | 1987-12-24 | 1987-12-24 | 銅膜形成物品の製造法 |
JP62325569A JPH01168867A (ja) | 1987-12-24 | 1987-12-24 | 銅膜形成物品の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3879441D1 true DE3879441D1 (de) | 1993-04-22 |
DE3879441T2 DE3879441T2 (de) | 1993-09-09 |
Family
ID=27480357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8888121504T Expired - Fee Related DE3879441T2 (de) | 1987-12-24 | 1988-12-22 | Verfahren zur herstellung von koerpern mit einem kupferueberzug. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4913938A (de) |
EP (1) | EP0322764B1 (de) |
KR (1) | KR960010822B1 (de) |
DE (1) | DE3879441T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0137370B1 (ko) * | 1988-11-07 | 1998-04-27 | 니시가와 레이치 | 구리 도금된 수지 제품의 제조방법 |
US6060175A (en) * | 1990-09-13 | 2000-05-09 | Sheldahl, Inc. | Metal-film laminate resistant to delamination |
US5137791A (en) * | 1990-09-13 | 1992-08-11 | Sheldahl Inc. | Metal-film laminate resistant to delamination |
US5112462A (en) * | 1990-09-13 | 1992-05-12 | Sheldahl Inc. | Method of making metal-film laminate resistant to delamination |
US5552221A (en) * | 1994-12-29 | 1996-09-03 | The Dow Chemical Company | Polybenzazole fibers having improved tensile strength retention |
US5759230A (en) * | 1995-11-30 | 1998-06-02 | The United States Of America As Represented By The Secretary Of The Navy | Nanostructured metallic powders and films via an alcoholic solvent process |
US6165309A (en) * | 1998-02-04 | 2000-12-26 | General Electric Co. | Method for improving the adhesion of metal films to polyphenylene ether resins |
AU2002337822A1 (en) * | 2001-10-05 | 2003-04-22 | Superior Micropowders Llc | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
US7785397B2 (en) * | 2005-03-11 | 2010-08-31 | National Research Council Of Canada | Highly microporous thermoplastic/bismaleimide semi-interpenetrating polymer network |
JP5923351B2 (ja) | 2012-03-16 | 2016-05-24 | 株式会社Adeka | 銅膜形成用組成物及び該組成物を用いた銅膜の製造方法 |
TW201920515A (zh) | 2017-08-01 | 2019-06-01 | 加拿大國家研究委員會 | 銅墨水 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU921124A1 (ru) * | 1979-06-19 | 1982-04-15 | Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср | Способ металлизации отверстий печатных плат |
US4327131A (en) * | 1980-12-05 | 1982-04-27 | The United States Of America As Represented By The Secretary Of The Army | Method of coating a ceramic substrate |
-
1988
- 1988-12-22 DE DE8888121504T patent/DE3879441T2/de not_active Expired - Fee Related
- 1988-12-22 EP EP88121504A patent/EP0322764B1/de not_active Expired - Lifetime
- 1988-12-22 KR KR1019880017274A patent/KR960010822B1/ko not_active IP Right Cessation
- 1988-12-23 US US07/288,928 patent/US4913938A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR960010822B1 (ko) | 1996-08-09 |
DE3879441T2 (de) | 1993-09-09 |
EP0322764B1 (de) | 1993-03-17 |
KR890009583A (ko) | 1989-08-02 |
US4913938A (en) | 1990-04-03 |
EP0322764A3 (en) | 1989-11-02 |
EP0322764A2 (de) | 1989-07-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |