DE3874284D1 - Mit glasfasern verstaerktes fluorpolymer-schaltungslaminat. - Google Patents
Mit glasfasern verstaerktes fluorpolymer-schaltungslaminat.Info
- Publication number
- DE3874284D1 DE3874284D1 DE8888117300T DE3874284T DE3874284D1 DE 3874284 D1 DE3874284 D1 DE 3874284D1 DE 8888117300 T DE8888117300 T DE 8888117300T DE 3874284 T DE3874284 T DE 3874284T DE 3874284 D1 DE3874284 D1 DE 3874284D1
- Authority
- DE
- Germany
- Prior art keywords
- fiberglass
- fiber polymer
- circuit laminate
- polymer circuit
- laminate reinforced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000835 fiber Substances 0.000 title 1
- 239000011152 fibreglass Substances 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0251—Non-conductive microfibers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
- Y10T428/31544—Addition polymer is perhalogenated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/30—Woven fabric [i.e., woven strand or strip material]
- Y10T442/3382—Including a free metal or alloy constituent
- Y10T442/3415—Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
- Y10T442/3431—Plural fabric layers
- Y10T442/3439—Including a nonwoven fabric layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/113,533 US4886699A (en) | 1987-10-26 | 1987-10-26 | Glass fiber reinforced fluoropolymeric circuit laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3874284D1 true DE3874284D1 (de) | 1992-10-08 |
Family
ID=22349978
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8888117300T Expired - Lifetime DE3874284D1 (de) | 1987-10-26 | 1988-10-18 | Mit glasfasern verstaerktes fluorpolymer-schaltungslaminat. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4886699A (de) |
EP (1) | EP0313961B1 (de) |
JP (1) | JPH01136739A (de) |
DE (1) | DE3874284D1 (de) |
IL (1) | IL88049A (de) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE36396E (en) * | 1987-02-17 | 1999-11-16 | Rogers Corporation | Electrical substrate material comprising amorphous fused silica powder |
US5384181B1 (en) * | 1987-02-17 | 2000-06-13 | World Properties Inc | Low volume fraction ceramic filled fluoropolymeric composite material |
JPH01149833A (ja) * | 1987-12-07 | 1989-06-12 | Kurimoto Ltd | 強化高導電性膜状成形体および製造方法 |
JPH02197190A (ja) * | 1989-01-26 | 1990-08-03 | Shin Kobe Electric Mach Co Ltd | 多層印刷配線板 |
US5055342A (en) * | 1990-02-16 | 1991-10-08 | International Business Machines Corporation | Fluorinated polymeric composition, fabrication thereof and use thereof |
JP2942389B2 (ja) * | 1990-06-23 | 1999-08-30 | 住友電気工業株式会社 | 弗素樹脂被覆物 |
US5229550A (en) * | 1990-10-30 | 1993-07-20 | International Business Machines Corporation | Encapsulated circuitized power core alignment and lamination |
US5103293A (en) * | 1990-12-07 | 1992-04-07 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
US5311406A (en) * | 1991-10-30 | 1994-05-10 | Honeywell Inc. | Microstrip printed wiring board and a method for making same |
US5296287A (en) * | 1992-11-25 | 1994-03-22 | Textiles Coated Incorporated | Single membrane insulation material |
JP2762386B2 (ja) * | 1993-03-19 | 1998-06-04 | 三井金属鉱業株式会社 | 銅張り積層板およびプリント配線板 |
US5534337A (en) * | 1993-04-05 | 1996-07-09 | Cobale Company, L.L.C. | Thermoset reinforced corrosion resistant laminates |
US5427741A (en) * | 1993-05-19 | 1995-06-27 | Cem Corporation | Pressure resistant reinforcing means for containers for materials to be microwave heated |
US5468561A (en) * | 1993-11-05 | 1995-11-21 | Texas Instruments Incorporated | Etching and patterning an amorphous copolymer made from tetrafluoroethylene and 2,2-bis(trifluoromethyl)-4,5-difluoro-1,3-dioxole (TFE AF) |
EP0695116B1 (de) * | 1994-07-29 | 2004-01-28 | World Properties, Inc. | Fluorpolymer-Verbundmaterialien mit zwei oder mehreren keramischen Füllern zur unabhängigen Kontrolle über Dimensionsstabilität und Dielektrizitätskonstante |
US6291374B1 (en) | 1994-10-13 | 2001-09-18 | World Properties, Inc. | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
US5552210A (en) * | 1994-11-07 | 1996-09-03 | Rogers Corporation | Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant |
TW341022B (en) * | 1995-11-29 | 1998-09-21 | Nippon Electric Co | Interconnection structures and method of making same |
EP0795907A1 (de) * | 1996-03-14 | 1997-09-17 | Dassault Electronique | Mehrlagige Hochfrequenzschaltung mit integrierten aktiven Elementen |
US5759658A (en) * | 1996-04-26 | 1998-06-02 | Tables International Corporation | Composite panels, articles incorporating same and method |
AU3735797A (en) * | 1996-06-26 | 1998-01-14 | Park Electrochemical Corporation | A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates |
US5679444A (en) * | 1996-07-15 | 1997-10-21 | International Business Machines Corporation | Method for producing multi-layer circuit board and resulting article of manufacture |
SE513022C2 (sv) * | 1998-08-19 | 2000-06-19 | Ericsson Telefon Ab L M | Dielelektriskt material för mikrovågor |
US6417593B1 (en) | 1999-01-07 | 2002-07-09 | Siemens Westinghouse Power Corporation | Composite electrical insulation with contacting layer and method of making the same |
US6254972B1 (en) | 1999-06-29 | 2001-07-03 | International Business Machines Corporation | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |
EP1117281A4 (de) * | 1999-07-05 | 2006-12-13 | Nippon Pillar Packing | Gedruckte leiterplatte und prepreg für gedruckte leiterplatte |
DE60004559T2 (de) | 1999-09-15 | 2004-04-15 | Textiles Coated Inc. | Dehnungsfugen-verbundmaterial |
US6757176B1 (en) * | 2000-08-22 | 2004-06-29 | Micron Technology, Inc. | Circuit board |
JP2004515610A (ja) | 2000-12-12 | 2004-05-27 | シュリ ディクシャ コーポレイション | 伝導性制約コアを含む軽量回路板 |
US6500529B1 (en) | 2001-09-14 | 2002-12-31 | Tonoga, Ltd. | Low signal loss bonding ply for multilayer circuit boards |
US6783841B2 (en) | 2001-09-14 | 2004-08-31 | Tonoga, Inc. | Low signal loss bonding ply for multilayer circuit boards |
US20030118836A1 (en) * | 2001-10-24 | 2003-06-26 | Lee Jeong Chang | Fluoropolymer laminates and a process for manufacture thereof |
WO2004026009A1 (en) * | 2002-09-16 | 2004-03-25 | World Properties, Inc. | Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
TWI243751B (en) * | 2003-10-21 | 2005-11-21 | Park Electrochemical Corp | Laminates having a low dielectric, low dissipation factor bond core and method of making same |
US7648607B2 (en) * | 2005-08-17 | 2010-01-19 | Innegrity, Llc | Methods of forming composite materials including high modulus polyolefin fibers |
JP5153632B2 (ja) * | 2005-08-17 | 2013-02-27 | イネグリティ・リミテッド・ライアビリティ・カンパニー | 高弾性ポリオレフィンファイバーを含む複合材料と、それを製造する方法 |
US8057887B2 (en) * | 2005-08-17 | 2011-11-15 | Rampart Fibers, LLC | Composite materials including high modulus polyolefin fibers |
US7892633B2 (en) * | 2005-08-17 | 2011-02-22 | Innegrity, Llc | Low dielectric composite materials including high modulus polyolefin fibers |
JP4827460B2 (ja) * | 2005-08-24 | 2011-11-30 | 三井・デュポンフロロケミカル株式会社 | 含フッ素樹脂積層体 |
US7730613B2 (en) | 2005-08-29 | 2010-06-08 | Stablcor, Inc. | Processes for manufacturing printed wiring boards |
USRE45637E1 (en) | 2005-08-29 | 2015-07-28 | Stablcor Technology, Inc. | Processes for manufacturing printed wiring boards |
US20070107837A1 (en) * | 2005-11-04 | 2007-05-17 | Dutton Steven L | Process for making high count multi-layered circuits |
WO2008008552A2 (en) | 2006-07-14 | 2008-01-17 | Stablcor, Inc. | Build-up printed wiring board substrate having a core layer that is part of a circuit |
JP5292027B2 (ja) * | 2008-09-09 | 2013-09-18 | 信越ポリマー株式会社 | 光トランシーバ |
JP2011029488A (ja) * | 2009-07-28 | 2011-02-10 | Kyocera Corp | 配線基板 |
JP2011258838A (ja) * | 2010-06-10 | 2011-12-22 | Fujitsu Ltd | 積層回路基板、接着シート、積層回路基板の製造方法および接着シートの製造方法 |
US8309210B1 (en) * | 2010-09-13 | 2012-11-13 | Rockell Collins, Inc. | Printed wiring board pad cratering inhibitor |
WO2012161162A1 (ja) * | 2011-05-23 | 2012-11-29 | 住友電工ファインポリマー株式会社 | 高周波回路基板 |
JP2016004888A (ja) * | 2014-06-17 | 2016-01-12 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
JP2017135135A (ja) * | 2016-01-25 | 2017-08-03 | 京セラ株式会社 | 配線基板 |
TWI611069B (zh) * | 2016-02-16 | 2018-01-11 | 聖高拜塑膠製品公司 | 複合物及製備方法 |
TWI636885B (zh) | 2017-05-24 | 2018-10-01 | 台燿科技股份有限公司 | 金屬箔積層板的製造方法及其應用 |
WO2019031071A1 (ja) | 2017-08-08 | 2019-02-14 | 住友電気工業株式会社 | 高周波プリント配線板用基材 |
TWI715995B (zh) * | 2019-06-10 | 2021-01-11 | 南亞塑膠工業股份有限公司 | 氟系基板、銅箔基板及印刷電路板 |
TWI686293B (zh) * | 2019-06-21 | 2020-03-01 | 台燿科技股份有限公司 | 金屬箔積層板及其製法 |
CN112318970A (zh) * | 2020-11-17 | 2021-02-05 | 中国电子科技集团公司第四十六研究所 | 一种玻璃纤维增强含氟聚合物电路层压板结构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL267988A (de) * | 1960-08-15 | 1900-01-01 | ||
US3393117A (en) * | 1964-02-13 | 1968-07-16 | Cincinnati Milling Machine Co | Copper-clad glass reinforced thermoset resin panel |
US3617613A (en) * | 1968-10-17 | 1971-11-02 | Spaulding Fibre Co | Punchable printed circuit board base |
US4610918A (en) * | 1984-04-13 | 1986-09-09 | Chemical Fabrics Corporation | Novel wear resistant fluoropolymer-containing flexible composites |
JPS60225750A (ja) * | 1984-04-24 | 1985-11-11 | 株式会社 潤工社 | プリント基板 |
US4634631A (en) * | 1985-07-15 | 1987-01-06 | Rogers Corporation | Flexible circuit laminate and method of making the same |
US4803115A (en) * | 1985-09-27 | 1989-02-07 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Glass fiber-reinforced electrical laminates and a continuous production method therefor |
JPS62193824A (ja) * | 1986-02-20 | 1987-08-26 | セントラル硝子株式会社 | 柔軟性のあるガラス繊維強化フツ素樹脂複合材料 |
-
1987
- 1987-10-26 US US07/113,533 patent/US4886699A/en not_active Expired - Fee Related
-
1988
- 1988-10-06 JP JP63252882A patent/JPH01136739A/ja active Pending
- 1988-10-14 IL IL88049A patent/IL88049A/xx unknown
- 1988-10-18 DE DE8888117300T patent/DE3874284D1/de not_active Expired - Lifetime
- 1988-10-18 EP EP88117300A patent/EP0313961B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
IL88049A (en) | 1991-05-12 |
US4886699A (en) | 1989-12-12 |
JPH01136739A (ja) | 1989-05-30 |
IL88049A0 (en) | 1989-06-30 |
EP0313961A2 (de) | 1989-05-03 |
EP0313961A3 (en) | 1990-09-05 |
EP0313961B1 (de) | 1992-09-02 |
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