DE3871229D1 - Bestueck- und entstueckvorrichtung fuer eine burn-in-platine. - Google Patents

Bestueck- und entstueckvorrichtung fuer eine burn-in-platine.

Info

Publication number
DE3871229D1
DE3871229D1 DE8888300559T DE3871229T DE3871229D1 DE 3871229 D1 DE3871229 D1 DE 3871229D1 DE 8888300559 T DE8888300559 T DE 8888300559T DE 3871229 T DE3871229 T DE 3871229T DE 3871229 D1 DE3871229 D1 DE 3871229D1
Authority
DE
Germany
Prior art keywords
burn
board
assembly
removal device
removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888300559T
Other languages
English (en)
Inventor
Larry J Lape
Ramon Salazar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reliability Inc
Original Assignee
Reliability Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reliability Inc filed Critical Reliability Inc
Application granted granted Critical
Publication of DE3871229D1 publication Critical patent/DE3871229D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE8888300559T 1987-04-30 1988-01-25 Bestueck- und entstueckvorrichtung fuer eine burn-in-platine. Expired - Lifetime DE3871229D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/044,873 US4817273A (en) 1987-04-30 1987-04-30 Burn-in board loader and unloader

Publications (1)

Publication Number Publication Date
DE3871229D1 true DE3871229D1 (de) 1992-06-25

Family

ID=21934792

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888300559T Expired - Lifetime DE3871229D1 (de) 1987-04-30 1988-01-25 Bestueck- und entstueckvorrichtung fuer eine burn-in-platine.

Country Status (5)

Country Link
US (1) US4817273A (de)
EP (1) EP0291144B1 (de)
JP (1) JPH0715494B2 (de)
DE (1) DE3871229D1 (de)
SG (1) SG92792G (de)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621030Y2 (ja) * 1987-09-08 1994-06-01 岡谷電機産業株式会社 ローダ・アンローダ装置
JPH0725721Y2 (ja) * 1987-09-08 1995-06-07 岡谷電機産業株式会社 ローダ・アンローダ装置
JPS6466576A (en) * 1987-09-08 1989-03-13 Okaya Electric Industry Co Loader/unloader apparatus
US4968931A (en) * 1989-11-03 1990-11-06 Motorola, Inc. Apparatus and method for burning in integrated circuit wafers
US5093984A (en) * 1990-05-18 1992-03-10 Aehr Test Systems Printed circuit board loader/unloader
US5146661A (en) * 1990-11-07 1992-09-15 At&T Bell Laboratories Packaged device handling method and apparatus
US5174016A (en) * 1991-04-25 1992-12-29 Toddco General, Inc. Chip removal apparatus and method of using same
JPH0577918A (ja) * 1991-09-18 1993-03-30 Murata Mfg Co Ltd チツプ部品の取扱い装置
US5539151A (en) * 1992-09-25 1996-07-23 Vlsi Technology, Inc. Reinforced sealing technique for an integrated-circuit package
JP3183591B2 (ja) * 1993-07-02 2001-07-09 三菱電機株式会社 半導体デバイスのテストシステム、半導体デバイスのテスト方法、半導体デバイス挿抜ステーション及びテスト用チャンバ
GB2284368B (en) * 1993-12-02 1996-01-03 Calmwaters Limited A circuit board production process
US5509193A (en) * 1994-05-06 1996-04-23 Micron Technology, Inc. Apparatus for loading and unloading burn-in boards
US5494562A (en) * 1994-06-27 1996-02-27 Ciba Corning Diagnostics Corp. Electrochemical sensors
JPH08150583A (ja) * 1994-11-29 1996-06-11 Ando Electric Co Ltd Ｉｃ移載装置つきオートハンドラ
DE19610123C1 (de) * 1996-03-14 1997-10-23 Siemens Ag Verfahren zum Testen von Burn-in-Boards und darin eingesetzten Bauteilen während des Bestückungsvorganges
JPH10160794A (ja) * 1996-12-02 1998-06-19 Mitsubishi Electric Corp Ｉｃ着脱装置及びその着脱ヘッド
JP3691195B2 (ja) * 1997-02-13 2005-08-31 株式会社ルネサステクノロジ 半導体装置の製造方法
US6305076B1 (en) 2000-01-21 2001-10-23 Cypress Semiconductor Corp. Apparatus for transferring a plurality of integrated circuit devices into and/or out of a plurality of sockets
US6476629B1 (en) * 2000-02-23 2002-11-05 Micron Technology, Inc. In-tray burn-in board for testing integrated circuit devices in situ on processing trays
US6609701B1 (en) * 2000-10-12 2003-08-26 Advanced Micro Devices, Inc. Devices and methods for integrated circuit container release
KR100392229B1 (ko) * 2001-01-09 2003-07-22 미래산업 주식회사 반도체 소자 테스트 핸들러의 인덱스헤드
US6919718B2 (en) * 2003-11-10 2005-07-19 Unisys Corporation System for testing a group of IC-chips having a chip holding subassembly that is built-in and loaded/unloaded automatically
DE502007003132D1 (de) 2007-01-24 2010-04-29 Rasco Gmbh Führungsvorrichtung und Testvorrichtung für elektronische Bauelemente
US20090153993A1 (en) * 2007-12-18 2009-06-18 Teradyne, Inc. Disk Drive Testing
US8549912B2 (en) * 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US7996174B2 (en) * 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US8117480B2 (en) 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8095234B2 (en) * 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US8238099B2 (en) * 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US7848106B2 (en) * 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8305751B2 (en) * 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US8041449B2 (en) * 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US7945424B2 (en) * 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
US8102173B2 (en) * 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US20110123301A1 (en) * 2008-04-17 2011-05-26 Scott Noble Bulk feeding storage devices to storage device testing systems
US20090262455A1 (en) * 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
MY149779A (en) * 2008-06-03 2013-10-14 Teradyne Inc Processing storage devices
DE112008002912A5 (de) * 2008-09-18 2012-01-19 Verigy (Singapore) Pte. Ltd. Verfahren zum gemeinschaftlichen Verwenden einer Testressource an einer Mehrzahl von Teststellen, automatische Testausrüstung, Handhabungseinrichtung zum Laden und Entladen von zu testenden Bauelementen und Testsystem
US8151450B2 (en) * 2008-12-31 2012-04-10 Intel Corporation Sliding package retention device for LGA sockets
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US8547123B2 (en) * 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US7920380B2 (en) * 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
JP7057499B2 (ja) * 2018-05-08 2022-04-20 山一電機株式会社 検査用ソケット
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
CN113702729B (zh) * 2021-07-16 2023-07-18 成都思科瑞微电子股份有限公司 一种压接电容老化试验系统及试验方法
CN113725142B (zh) * 2021-11-01 2021-12-31 四川旭茂微科技有限公司 一种芯片吸盘及芯片装填装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3453714A (en) * 1967-02-10 1969-07-08 Ibm Vacuum operated chip placement head
US3623637A (en) * 1969-12-29 1971-11-30 Teletype Corp Vacuum chuck and methods of transferring workpieces
US3736651A (en) * 1971-08-31 1973-06-05 Ibm Automatic pin insertion and bonding to a metallized pad on a substrate surface
US3727757A (en) * 1972-06-12 1973-04-17 C Boissicat Dip handling apparatus
US4079489A (en) * 1976-12-30 1978-03-21 Honeywell Information Systems Inc. Placement machine
US4149311A (en) * 1977-09-22 1979-04-17 Banner/Technical Devices Inc. Work station for facilitating component assembly
US4292116A (en) * 1978-04-18 1981-09-29 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on a printed circuit board
GB2034613B (en) * 1978-11-09 1983-01-19 Tokyo Shibaura Electric Co Method and apparatus for mounting electronic components
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
US4304514A (en) * 1979-11-13 1981-12-08 Thermalloy Incorporated Circuit package loader and extractor
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
US4439917A (en) * 1980-04-21 1984-04-03 Pearson Rune S Method and apparatus for automatically extracting integrated circuit packages from electrical sockets
US4459743A (en) * 1980-12-05 1984-07-17 J. Osawa Camera Sales Co., Ltd. Automatic mounting apparatus for chip components
JPS57199965A (en) * 1981-06-02 1982-12-08 Kyoei Sangyo Kk Automatic inspecting machine for printed wiring board
NL8103574A (nl) * 1981-07-29 1983-02-16 Philips Nv Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.
DE3150945A1 (de) * 1981-12-23 1983-07-07 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum ueberbringen von anschlussbeinlosen bauelementen auf eine vorgesehene setzposition einer schaltungsplatine
FR2524251A1 (fr) * 1982-03-26 1983-09-30 Outillages Scient Lab Machine pour inserer automatiquement des composants electroniques, notamment des circuits integres, sur des circuits imprimes
NL8201593A (nl) * 1982-04-16 1983-11-16 Philips Nv Inrichting voor het overbrengen van een elektrisch of elektronisch onderdeel naar een montagepaneel.
US4567652A (en) * 1982-11-18 1986-02-04 Reliability Incorporated Burn-in board loader
JPS59224279A (ja) * 1983-06-01 1984-12-17 富士機械製造株式会社 電子部品の位置決め保持方法および装置
US4584764A (en) * 1983-10-26 1986-04-29 Reliability Incorporated Automated burn-in board unloader and IC package sorter
US4588092A (en) * 1983-11-15 1986-05-13 Automated Electronic Technology, Inc. Integrated circuit handling and contact system
GB8406129D0 (en) * 1984-03-08 1984-04-11 Dyna Pert Precima Ltd Orienting electrical components
JPS60235497A (ja) * 1984-05-09 1985-11-22 シルバー精工株式会社 電子部品の装着方法
US4586252A (en) * 1985-02-15 1986-05-06 Avco Corporation Tool for removing soldered components
DE8626502U1 (de) * 1986-10-03 1987-01-08 Eltest Elektronische Testautomaten GmbH, 8000 München Vorrichtung zum Testen von elektrischen Bauelementen

Also Published As

Publication number Publication date
EP0291144B1 (de) 1992-05-20
JPH0715494B2 (ja) 1995-02-22
EP0291144A1 (de) 1988-11-17
US4817273A (en) 1989-04-04
JPS63284478A (ja) 1988-11-21
SG92792G (en) 1992-12-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee