DE3852131D1 - Speicherkarte. - Google Patents
Speicherkarte.Info
- Publication number
- DE3852131D1 DE3852131D1 DE3852131T DE3852131T DE3852131D1 DE 3852131 D1 DE3852131 D1 DE 3852131D1 DE 3852131 T DE3852131 T DE 3852131T DE 3852131 T DE3852131 T DE 3852131T DE 3852131 D1 DE3852131 D1 DE 3852131D1
- Authority
- DE
- Germany
- Prior art keywords
- memory card
- card
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63102998A JP2664720B2 (ja) | 1988-04-26 | 1988-04-26 | Ic実装装置 |
JP63118169A JP2608915B2 (ja) | 1988-05-17 | 1988-05-17 | Ic実装装置 |
JP63136856A JPH01305554A (ja) | 1988-06-03 | 1988-06-03 | Ic実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3852131D1 true DE3852131D1 (de) | 1994-12-22 |
DE3852131T2 DE3852131T2 (de) | 1995-05-18 |
Family
ID=27309860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3852131T Expired - Fee Related DE3852131T2 (de) | 1988-04-26 | 1988-09-14 | Speicherkarte. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4942453A (de) |
EP (1) | EP0339154B1 (de) |
DE (1) | DE3852131T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03145186A (ja) * | 1989-10-30 | 1991-06-20 | Mitsubishi Electric Corp | 半導体モジュール |
JP2960560B2 (ja) * | 1991-02-28 | 1999-10-06 | 株式会社日立製作所 | 超小型電子機器 |
US5663901A (en) * | 1991-04-11 | 1997-09-02 | Sandisk Corporation | Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems |
JP3484705B2 (ja) * | 1991-07-18 | 2004-01-06 | ソニー株式会社 | 半導体ウエハ |
JP3123616B2 (ja) * | 1991-10-09 | 2001-01-15 | キヤノン株式会社 | 液晶表示装置の実装方法 |
US5243497A (en) * | 1992-09-29 | 1993-09-07 | Texas Instruments | Chip on board assembly |
US5754399A (en) * | 1992-09-30 | 1998-05-19 | International Business Machines Corporation | Direct coupled CPU package |
JP3396541B2 (ja) * | 1993-08-30 | 2003-04-14 | 株式会社東芝 | 混成集積回路装置を搭載した回路基板 |
JP3461204B2 (ja) * | 1993-09-14 | 2003-10-27 | 株式会社東芝 | マルチチップモジュール |
KR100321883B1 (ko) * | 1993-11-12 | 2002-06-20 | 구사마 사부로 | 반도체소자의실장구조및실장방법과,액정표시장치 |
JPH07142673A (ja) * | 1993-11-15 | 1995-06-02 | Matsushita Electric Ind Co Ltd | 集積回路装置 |
FR2727223B1 (fr) * | 1994-11-23 | 1997-01-17 | Fast France Adv Sys Tech Sarl | Terminal securise multifonction de saisie et de traitement, utilisable notamment dans le domaine bancaire, dans le domaine des jeux et dans le domaine de la gestion electronique de documents |
US5691569A (en) * | 1995-12-20 | 1997-11-25 | Intel Corporation | Integrated circuit package that has a plurality of staggered pins |
JP2005123362A (ja) * | 2003-10-16 | 2005-05-12 | Hitachi Ltd | 接続用取付基板及びディスクアレイ制御装置の接続用取付基板 |
JP2007059693A (ja) * | 2005-08-25 | 2007-03-08 | Toshiba Corp | 半導体メモリカードおよび半導体メモリカードの製造方法 |
KR20080031449A (ko) * | 2005-08-31 | 2008-04-08 | 산요덴키가부시키가이샤 | 회로 장치 및 그 제조 방법 |
JP2009182104A (ja) * | 2008-01-30 | 2009-08-13 | Toshiba Corp | 半導体パッケージ |
JP5193837B2 (ja) * | 2008-03-21 | 2013-05-08 | 株式会社東芝 | 半導体メモリカード |
US8472199B2 (en) * | 2008-11-13 | 2013-06-25 | Mosaid Technologies Incorporated | System including a plurality of encapsulated semiconductor chips |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3300686A (en) * | 1963-07-30 | 1967-01-24 | Ibm | Compatible packaging of miniaturized circuit modules |
US3260982A (en) * | 1963-12-31 | 1966-07-12 | Ibm | Flat cable strain relief |
US4275410A (en) * | 1978-11-29 | 1981-06-23 | Hughes Aircraft Company | Three-dimensionally structured microelectronic device |
FR2513477B1 (fr) * | 1980-09-29 | 1985-06-28 | Asea Ab | Equipement electrique du type comprenant plusieurs cartes de circuit imprime raccordees a un plan de connexions |
JPS57181161A (en) * | 1981-04-30 | 1982-11-08 | Sanyo Electric Co Ltd | Transistor |
JPS5830176A (ja) * | 1981-08-14 | 1983-02-22 | Nippon Telegr & Teleph Corp <Ntt> | 超伝導素子実装用部品の製作方法 |
US4439809A (en) * | 1982-02-22 | 1984-03-27 | Sperry Corporation | Electrostatic discharge protection system |
JPS6099566U (ja) * | 1983-12-10 | 1985-07-06 | アルプス電気株式会社 | プリント基板端子部の接続構造 |
US4704599A (en) * | 1984-06-20 | 1987-11-03 | Kimmel Arthur T | Auxiliary power connector and communication channel control circuit |
US4780792A (en) * | 1986-08-15 | 1988-10-25 | Honeywell Inc. | Sliding circuit card ejection apparatus and method |
-
1988
- 1988-09-14 EP EP88308502A patent/EP0339154B1/de not_active Expired - Lifetime
- 1988-09-14 DE DE3852131T patent/DE3852131T2/de not_active Expired - Fee Related
- 1988-09-15 US US07/244,794 patent/US4942453A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4942453A (en) | 1990-07-17 |
EP0339154A2 (de) | 1989-11-02 |
DE3852131T2 (de) | 1995-05-18 |
EP0339154A3 (en) | 1990-09-12 |
EP0339154B1 (de) | 1994-11-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |