DE3850850T2 - Koplanares verbindungsverfahren zwischen einem halbleiterwürfel und einem siliciumsubstrat. - Google Patents
Koplanares verbindungsverfahren zwischen einem halbleiterwürfel und einem siliciumsubstrat.Info
- Publication number
- DE3850850T2 DE3850850T2 DE3850850T DE3850850T DE3850850T2 DE 3850850 T2 DE3850850 T2 DE 3850850T2 DE 3850850 T DE3850850 T DE 3850850T DE 3850850 T DE3850850 T DE 3850850T DE 3850850 T2 DE3850850 T2 DE 3850850T2
- Authority
- DE
- Germany
- Prior art keywords
- silicon substrate
- connection method
- coplanar connection
- semiconductor cube
- cube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/056,497 US4781775A (en) | 1987-06-01 | 1987-06-01 | Coplanar die to substrate bond method |
PCT/US1988/000954 WO1988009724A1 (en) | 1987-06-01 | 1988-03-28 | Coplanar die to substrate bond method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3850850D1 DE3850850D1 (de) | 1994-09-01 |
DE3850850T2 true DE3850850T2 (de) | 1995-03-02 |
Family
ID=22004784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3850850T Expired - Fee Related DE3850850T2 (de) | 1987-06-01 | 1988-03-28 | Koplanares verbindungsverfahren zwischen einem halbleiterwürfel und einem siliciumsubstrat. |
Country Status (8)
Country | Link |
---|---|
US (1) | US4781775A (de) |
EP (1) | EP0315655B1 (de) |
JP (1) | JP2524831B2 (de) |
KR (1) | KR950012798B1 (de) |
DE (1) | DE3850850T2 (de) |
HK (1) | HK1000613A1 (de) |
MY (1) | MY101956A (de) |
WO (1) | WO1988009724A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4941255A (en) * | 1989-11-15 | 1990-07-17 | Eastman Kodak Company | Method for precision multichip assembly |
US5067004A (en) * | 1989-12-13 | 1991-11-19 | Digital Equipment Corporation | Module for interconnecting integrated circuits |
US5380390B1 (en) * | 1991-06-10 | 1996-10-01 | Ultimate Abras Systems Inc | Patterned abrasive material and method |
US5439636A (en) * | 1992-02-18 | 1995-08-08 | International Business Machines Corporation | Large ceramic articles and method of manufacturing |
US5639325A (en) * | 1995-02-01 | 1997-06-17 | The Whitaker Corporation | Process for producing a glass-coated article |
US6399182B1 (en) * | 2000-04-12 | 2002-06-04 | Cmc Wireless Components, Inc. | Die attachment utilizing grooved surfaces |
US7070673B2 (en) * | 2002-07-02 | 2006-07-04 | United Technologies Corporation | Method for repairing loose molded-in bushings |
JP4899675B2 (ja) * | 2006-07-12 | 2012-03-21 | ソニー株式会社 | 実装方法、電子機器の製造方法および発光ダイオードディスプレイの製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4300978A (en) * | 1979-07-06 | 1981-11-17 | Rohr Industries, Inc. | Bonding tool for venting honeycomb noise attenuation structure during manufacture |
US4620216A (en) * | 1983-04-29 | 1986-10-28 | International Business Machines Corporation | Unitary slotted heat sink for semiconductor packages |
US4630096A (en) * | 1984-05-30 | 1986-12-16 | Motorola, Inc. | High density IC module assembly |
-
1987
- 1987-06-01 US US07/056,497 patent/US4781775A/en not_active Expired - Lifetime
-
1988
- 1988-03-28 DE DE3850850T patent/DE3850850T2/de not_active Expired - Fee Related
- 1988-03-28 JP JP63503245A patent/JP2524831B2/ja not_active Expired - Lifetime
- 1988-03-28 KR KR1019890700154A patent/KR950012798B1/ko not_active IP Right Cessation
- 1988-03-28 EP EP88903627A patent/EP0315655B1/de not_active Expired - Lifetime
- 1988-03-28 WO PCT/US1988/000954 patent/WO1988009724A1/en active IP Right Grant
- 1988-04-06 MY MYPI88000349A patent/MY101956A/en unknown
-
1997
- 1997-11-18 HK HK97102189A patent/HK1000613A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0315655A1 (de) | 1989-05-17 |
HK1000613A1 (en) | 1998-04-09 |
WO1988009724A1 (en) | 1988-12-15 |
JPH01503424A (ja) | 1989-11-16 |
KR950012798B1 (ko) | 1995-10-21 |
MY101956A (en) | 1992-02-15 |
JP2524831B2 (ja) | 1996-08-14 |
EP0315655B1 (de) | 1994-07-27 |
US4781775A (en) | 1988-11-01 |
DE3850850D1 (de) | 1994-09-01 |
KR890701363A (ko) | 1989-12-20 |
EP0315655A4 (en) | 1991-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |