HK1000613A1 - Coplanar die to a silicon substrate bond method - Google Patents

Coplanar die to a silicon substrate bond method

Info

Publication number
HK1000613A1
HK1000613A1 HK97102189A HK97102189A HK1000613A1 HK 1000613 A1 HK1000613 A1 HK 1000613A1 HK 97102189 A HK97102189 A HK 97102189A HK 97102189 A HK97102189 A HK 97102189A HK 1000613 A1 HK1000613 A1 HK 1000613A1
Authority
HK
Hong Kong
Prior art keywords
silicon substrate
bond method
substrate bond
coplanar
die
Prior art date
Application number
HK97102189A
Other languages
English (en)
Inventor
David J Reed
Robert K Fairbanks
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of HK1000613A1 publication Critical patent/HK1000613A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
HK97102189A 1987-06-01 1997-11-18 Coplanar die to a silicon substrate bond method HK1000613A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/056,497 US4781775A (en) 1987-06-01 1987-06-01 Coplanar die to substrate bond method

Publications (1)

Publication Number Publication Date
HK1000613A1 true HK1000613A1 (en) 1998-04-09

Family

ID=22004784

Family Applications (1)

Application Number Title Priority Date Filing Date
HK97102189A HK1000613A1 (en) 1987-06-01 1997-11-18 Coplanar die to a silicon substrate bond method

Country Status (8)

Country Link
US (1) US4781775A (de)
EP (1) EP0315655B1 (de)
JP (1) JP2524831B2 (de)
KR (1) KR950012798B1 (de)
DE (1) DE3850850T2 (de)
HK (1) HK1000613A1 (de)
MY (1) MY101956A (de)
WO (1) WO1988009724A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4941255A (en) * 1989-11-15 1990-07-17 Eastman Kodak Company Method for precision multichip assembly
US5067004A (en) * 1989-12-13 1991-11-19 Digital Equipment Corporation Module for interconnecting integrated circuits
US5380390B1 (en) * 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
US5439636A (en) * 1992-02-18 1995-08-08 International Business Machines Corporation Large ceramic articles and method of manufacturing
US5639325A (en) * 1995-02-01 1997-06-17 The Whitaker Corporation Process for producing a glass-coated article
US6399182B1 (en) * 2000-04-12 2002-06-04 Cmc Wireless Components, Inc. Die attachment utilizing grooved surfaces
US7070673B2 (en) * 2002-07-02 2006-07-04 United Technologies Corporation Method for repairing loose molded-in bushings
JP4899675B2 (ja) * 2006-07-12 2012-03-21 ソニー株式会社 実装方法、電子機器の製造方法および発光ダイオードディスプレイの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4300978A (en) * 1979-07-06 1981-11-17 Rohr Industries, Inc. Bonding tool for venting honeycomb noise attenuation structure during manufacture
US4620216A (en) * 1983-04-29 1986-10-28 International Business Machines Corporation Unitary slotted heat sink for semiconductor packages
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly

Also Published As

Publication number Publication date
US4781775A (en) 1988-11-01
KR890701363A (ko) 1989-12-20
EP0315655A4 (en) 1991-01-16
JPH01503424A (ja) 1989-11-16
MY101956A (en) 1992-02-15
JP2524831B2 (ja) 1996-08-14
KR950012798B1 (ko) 1995-10-21
DE3850850T2 (de) 1995-03-02
DE3850850D1 (de) 1994-09-01
EP0315655A1 (de) 1989-05-17
WO1988009724A1 (en) 1988-12-15
EP0315655B1 (de) 1994-07-27

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)