DE3840199C2 - Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung - Google Patents

Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung

Info

Publication number
DE3840199C2
DE3840199C2 DE3840199A DE3840199A DE3840199C2 DE 3840199 C2 DE3840199 C2 DE 3840199C2 DE 3840199 A DE3840199 A DE 3840199A DE 3840199 A DE3840199 A DE 3840199A DE 3840199 C2 DE3840199 C2 DE 3840199C2
Authority
DE
Germany
Prior art keywords
layer
metal
catalyst layer
radiation
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3840199A
Other languages
German (de)
English (en)
Other versions
DE3840199A1 (de
Inventor
Hilmar Dipl Phys Dr Esrom
Ulrich Dr Kogelschatz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Noblelight GmbH
Original Assignee
Heraeus Noblelight GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Noblelight GmbH filed Critical Heraeus Noblelight GmbH
Priority to DE3840199A priority Critical patent/DE3840199C2/de
Priority to DE89121600T priority patent/DE58907402D1/de
Priority to EP89121600A priority patent/EP0374505B1/de
Priority to JP1307843A priority patent/JPH03122287A/ja
Publication of DE3840199A1 publication Critical patent/DE3840199A1/de
Application granted granted Critical
Publication of DE3840199C2 publication Critical patent/DE3840199C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electrochemistry (AREA)
  • Catalysts (AREA)
  • Chemically Coating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
DE3840199A 1988-11-29 1988-11-29 Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung Expired - Fee Related DE3840199C2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE3840199A DE3840199C2 (de) 1988-11-29 1988-11-29 Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung
DE89121600T DE58907402D1 (de) 1988-11-29 1989-11-23 Verfahren zur Metallisierung.
EP89121600A EP0374505B1 (de) 1988-11-29 1989-11-23 Verfahren zur Metallisierung
JP1307843A JPH03122287A (ja) 1988-11-29 1989-11-29 基板の金属化方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3840199A DE3840199C2 (de) 1988-11-29 1988-11-29 Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung

Publications (2)

Publication Number Publication Date
DE3840199A1 DE3840199A1 (de) 1990-05-31
DE3840199C2 true DE3840199C2 (de) 1994-12-01

Family

ID=6368086

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3840199A Expired - Fee Related DE3840199C2 (de) 1988-11-29 1988-11-29 Verfahren zur Strukturierung von bei der stromlosen Metallisierung katalytisch aktiven Metallschichten mittels UV-Strahlung
DE89121600T Expired - Fee Related DE58907402D1 (de) 1988-11-29 1989-11-23 Verfahren zur Metallisierung.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE89121600T Expired - Fee Related DE58907402D1 (de) 1988-11-29 1989-11-23 Verfahren zur Metallisierung.

Country Status (3)

Country Link
EP (1) EP0374505B1 (ja)
JP (1) JPH03122287A (ja)
DE (2) DE3840199C2 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4035080A1 (de) * 1990-11-05 1992-05-07 Abb Patent Gmbh Verfahren und einrichtung zur herstellung von partiellen metallischen schichten
JP3259310B2 (ja) 1992-02-25 2002-02-25 株式会社デンソー めっき方法及びこのめっき方法により得られる筒状コイル
JP3153682B2 (ja) * 1993-08-26 2001-04-09 松下電工株式会社 回路板の製造方法
US6602653B1 (en) 2000-08-25 2003-08-05 Micron Technology, Inc. Conductive material patterning methods
US6451685B1 (en) 2001-02-05 2002-09-17 Micron Technology, Inc. Method for multilevel copper interconnects for ultra large scale integration
KR101507769B1 (ko) 2013-10-10 2015-04-07 경기대학교 산학협력단 산화물 환원 방법 및 이를 이용하는 산화물 환원 장치
CN110091069B (zh) * 2019-04-09 2021-09-24 大族激光科技产业集团股份有限公司 激光退镀方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
US4241105A (en) * 1979-12-17 1980-12-23 Western Electric Company, Inc. Method of plating the surface of a substrate
DE3008434A1 (de) * 1980-03-03 1981-09-17 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur selektiven chemischen und/oder galvanischen abscheidung von metallueberzuegen, insbesondere zur herstellung von gedruckten schaltungen
US4304849A (en) * 1980-05-16 1981-12-08 Western Electric Co., Inc. Methods of depositing metallic copper on substrates
US4410569A (en) * 1980-06-13 1983-10-18 Minnesota Mining And Manufacturing Company Palladium (II) bis(hexafluoroacetylacetonate), adducts derived therefrom and uses thereof
DE3337856A1 (de) * 1983-10-18 1985-04-25 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substraten fuer die stromlose metallisierung
EP0167326B1 (en) * 1984-06-29 1989-11-15 Hitachi Chemical Co., Ltd. Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
EP0349882B1 (de) * 1988-07-02 1994-03-16 Heraeus Noblelight GmbH Verfahren zur Herstellung von metallischen Schichten

Also Published As

Publication number Publication date
DE58907402D1 (de) 1994-05-11
EP0374505A2 (de) 1990-06-27
JPH03122287A (ja) 1991-05-24
EP0374505A3 (en) 1990-07-04
EP0374505B1 (de) 1994-04-06
DE3840199A1 (de) 1990-05-31

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: HERAEUS NOBLELIGHT GMBH, 63450 HANAU, DE

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee