DE3835767A1 - Kuehlvorrichtung fuer halbleitermodul - Google Patents

Kuehlvorrichtung fuer halbleitermodul

Info

Publication number
DE3835767A1
DE3835767A1 DE3835767A DE3835767A DE3835767A1 DE 3835767 A1 DE3835767 A1 DE 3835767A1 DE 3835767 A DE3835767 A DE 3835767A DE 3835767 A DE3835767 A DE 3835767A DE 3835767 A1 DE3835767 A1 DE 3835767A1
Authority
DE
Germany
Prior art keywords
cooling
cooling plate
housing
bellows
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3835767A
Other languages
German (de)
English (en)
Other versions
DE3835767C2 (https=
Inventor
Ryoichi Kajiwara
Takao Funamoto
Mituo Kato
Hiroshi Wachi
Tomohiko Shida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62263856A external-priority patent/JPH01107564A/ja
Priority claimed from JP62283318A external-priority patent/JPH0680757B2/ja
Priority claimed from JP63067436A external-priority patent/JPH01241154A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3835767A1 publication Critical patent/DE3835767A1/de
Application granted granted Critical
Publication of DE3835767C2 publication Critical patent/DE3835767C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/772—Bellows
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE3835767A 1987-10-21 1988-10-20 Kuehlvorrichtung fuer halbleitermodul Granted DE3835767A1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62263856A JPH01107564A (ja) 1987-10-21 1987-10-21 半導体装置の冷却装置
JP62283318A JPH0680757B2 (ja) 1987-11-11 1987-11-11 半導体モジュール
JP63067436A JPH01241154A (ja) 1988-03-23 1988-03-23 半導体冷却装置

Publications (2)

Publication Number Publication Date
DE3835767A1 true DE3835767A1 (de) 1989-05-03
DE3835767C2 DE3835767C2 (https=) 1992-12-10

Family

ID=27299439

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3835767A Granted DE3835767A1 (de) 1987-10-21 1988-10-20 Kuehlvorrichtung fuer halbleitermodul

Country Status (3)

Country Link
US (1) US4996589A (https=)
KR (1) KR890007419A (https=)
DE (1) DE3835767A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4121447A1 (de) * 1990-06-29 1992-01-23 Digital Equipment Corp Luftgekuehlter waermeaustauscher fuer vielchip-baugruppen
EP0538818A1 (en) * 1991-10-21 1993-04-28 Nec Corporation Cooling unit capable of speedily cooling an integrated circuit chip
DE102007051798B3 (de) * 2007-10-26 2009-01-15 Jenoptik Laserdiode Gmbh Mikrokanalwärmesenke zur Kühlung von Halbleiterbauelementen und Verfahren zur Oberflächenbehandlung derselben

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung
JPH04196395A (ja) * 1990-11-28 1992-07-16 Hitachi Ltd 冷却装置を備えた電子計算機
JPH04206555A (ja) * 1990-11-30 1992-07-28 Hitachi Ltd 電子機器の冷却装置
JP2927010B2 (ja) * 1991-03-01 1999-07-28 株式会社日立製作所 半導体パッケージ
US5294830A (en) * 1991-05-21 1994-03-15 International Business Machines Corporation Apparatus for indirect impingement cooling of integrated circuit chips
JPH0824222B2 (ja) * 1992-04-10 1996-03-06 インターナショナル・ビジネス・マシーンズ・コーポレイション エア・ミキサ冷却板を備えた冷却装置
US5557501A (en) * 1994-11-18 1996-09-17 Tessera, Inc. Compliant thermal connectors and assemblies incorporating the same
US5923086A (en) * 1997-05-14 1999-07-13 Intel Corporation Apparatus for cooling a semiconductor die
JP4275806B2 (ja) * 1999-06-01 2009-06-10 株式会社ルネサステクノロジ 半導体素子の実装方法
US6665187B1 (en) * 2002-07-16 2003-12-16 International Business Machines Corporation Thermally enhanced lid for multichip modules
JP3847691B2 (ja) * 2002-09-26 2006-11-22 三菱電機株式会社 電力用半導体装置
US6992382B2 (en) * 2003-12-29 2006-01-31 Intel Corporation Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
JP2005228954A (ja) * 2004-02-13 2005-08-25 Fujitsu Ltd 熱伝導機構、放熱システムおよび通信装置
JP2006190707A (ja) * 2004-12-28 2006-07-20 Toshiba Corp 電子機器とこの電子機器が適用されるテレビジョン受像装置
US7403393B2 (en) * 2005-12-28 2008-07-22 International Business Machines Corporation Apparatus and system for cooling heat producing components
US9190341B2 (en) * 2012-06-05 2015-11-17 Texas Instruments Incorporated Lidded integrated circuit package
US20170321966A1 (en) * 2014-12-03 2017-11-09 Ge Intelligent Platforms, Inc. Combined energy dissipation apparatus and method
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
CN108231653B (zh) * 2018-01-04 2020-08-04 厦门大学 一种MicroLED芯片转印方法及装置
US10976119B2 (en) * 2018-07-30 2021-04-13 The Boeing Company Heat transfer devices and methods of transfering heat
GB2615775B (en) * 2022-02-17 2025-01-15 Iceotope Group Ltd Apparatus and system for cooling electronic devices

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
EP0151068A2 (en) * 1984-01-26 1985-08-07 Fujitsu Limited Cooling system for electronic circuit device
EP0151546A2 (en) * 1984-01-26 1985-08-14 Fujitsu Limited Printed circuit board assembly having a liquid-cooling module system
US4593342A (en) * 1984-11-15 1986-06-03 General Electric Company Heat sink assembly for protecting pins of electronic devices
EP0196054A2 (en) * 1985-03-26 1986-10-01 Hitachi, Ltd. Semiconductor module cooling structure
EP0196863A1 (en) * 1985-03-28 1986-10-08 Fujitsu Limited Cooling system for electronic circuit components
EP0217676A2 (en) * 1985-10-04 1987-04-08 Fujitsu Limited Cooling system for electronic circuit device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60253248A (ja) * 1984-05-30 1985-12-13 Hitachi Ltd 熱伝導冷却モジユ−ル装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
EP0151068A2 (en) * 1984-01-26 1985-08-07 Fujitsu Limited Cooling system for electronic circuit device
EP0151546A2 (en) * 1984-01-26 1985-08-14 Fujitsu Limited Printed circuit board assembly having a liquid-cooling module system
US4593342A (en) * 1984-11-15 1986-06-03 General Electric Company Heat sink assembly for protecting pins of electronic devices
EP0196054A2 (en) * 1985-03-26 1986-10-01 Hitachi, Ltd. Semiconductor module cooling structure
EP0196863A1 (en) * 1985-03-28 1986-10-08 Fujitsu Limited Cooling system for electronic circuit components
EP0217676A2 (en) * 1985-10-04 1987-04-08 Fujitsu Limited Cooling system for electronic circuit device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-B.: HÜTTE, Des Ingenieurs Taschenbuch, Theoretische Grundlagen, 28. Aufl., Berlin 1955, Verlag von Wilhelm Ernst & Sohn, S. 1069-1077 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4121447A1 (de) * 1990-06-29 1992-01-23 Digital Equipment Corp Luftgekuehlter waermeaustauscher fuer vielchip-baugruppen
EP0538818A1 (en) * 1991-10-21 1993-04-28 Nec Corporation Cooling unit capable of speedily cooling an integrated circuit chip
US5360993A (en) * 1991-10-21 1994-11-01 Nec Corporation Cooling unit capable of speedily cooling an integrated circuit chip
DE102007051798B3 (de) * 2007-10-26 2009-01-15 Jenoptik Laserdiode Gmbh Mikrokanalwärmesenke zur Kühlung von Halbleiterbauelementen und Verfahren zur Oberflächenbehandlung derselben
WO2009052815A3 (de) * 2007-10-26 2009-08-27 Dirk Lorenzen Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben

Also Published As

Publication number Publication date
US4996589A (en) 1991-02-26
KR890007419A (ko) 1989-06-19
DE3835767C2 (https=) 1992-12-10

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8128 New person/name/address of the agent

Representative=s name: STREHL, P., DIPL.-ING. DIPL.-WIRTSCH.-ING. SCHUEBE

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee