DE3789136T2 - Optischer Messfühlerkopf vom Wellenleitertyp. - Google Patents
Optischer Messfühlerkopf vom Wellenleitertyp.Info
- Publication number
- DE3789136T2 DE3789136T2 DE3789136T DE3789136T DE3789136T2 DE 3789136 T2 DE3789136 T2 DE 3789136T2 DE 3789136 T DE3789136 T DE 3789136T DE 3789136 T DE3789136 T DE 3789136T DE 3789136 T2 DE3789136 T2 DE 3789136T2
- Authority
- DE
- Germany
- Prior art keywords
- optical sensor
- sensor head
- waveguide type
- waveguide
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
- G01L1/242—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre
- G01L1/243—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet the material being an optical fibre using means for applying force perpendicular to the fibre axis
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
- G11B7/124—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate the integrated head arrangements including waveguides
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
- H01S5/0687—Stabilising the frequency of the laser
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Head (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61264308A JP2572050B2 (ja) | 1986-11-05 | 1986-11-05 | 導波路型光ヘツド |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3789136D1 DE3789136D1 (de) | 1994-03-31 |
DE3789136T2 true DE3789136T2 (de) | 1994-05-26 |
Family
ID=17401373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3789136T Expired - Lifetime DE3789136T2 (de) | 1986-11-05 | 1987-11-05 | Optischer Messfühlerkopf vom Wellenleitertyp. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4911512A (de) |
EP (1) | EP0267036B1 (de) |
JP (1) | JP2572050B2 (de) |
DE (1) | DE3789136T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2671317B2 (ja) * | 1987-09-28 | 1997-10-29 | 日本電気株式会社 | 半導体レーザ |
JPH01118105A (ja) * | 1987-10-30 | 1989-05-10 | Brother Ind Ltd | 薄膜光機能素子 |
FR2637079B1 (fr) * | 1988-09-23 | 1990-11-23 | Rd Ctre Suisse Electro Microte | Capteur de force a guide d'ondes optique integre dans un substrat |
JPH02271586A (ja) * | 1989-04-12 | 1990-11-06 | Mitsubishi Electric Corp | 半導体レーザ装置 |
JPH03124674U (de) * | 1990-02-26 | 1991-12-17 | ||
US5157746A (en) * | 1990-06-08 | 1992-10-20 | Brother Kogyo Kabushiki Kaisha | Optical waveguide array including two-dimensional lens and its manufacturing method |
EP0463504A3 (en) * | 1990-06-25 | 1992-08-19 | Siemens Aktiengesellschaft | Optical duplexer for bidirectional optical communication |
JPH04152725A (ja) * | 1990-10-17 | 1992-05-26 | Hitachi Ltd | マスタークロック分配方法およびそれを用いた装置 |
JP3131994B2 (ja) * | 1990-11-07 | 2001-02-05 | パイオニア株式会社 | 記録情報読取装置 |
US6181673B1 (en) * | 1996-07-30 | 2001-01-30 | Read-Rite Corporation | Slider design |
US6075673A (en) * | 1997-05-05 | 2000-06-13 | Read-Rite Corporation | Composite slider design |
GB2325334B (en) * | 1998-07-10 | 1999-04-14 | Bookham Technology Ltd | External cavity laser |
US8418353B1 (en) * | 2009-12-23 | 2013-04-16 | Western Digital (Fremont), Llc | Method for providing a plurality of energy assisted magnetic recording EAMR heads |
CA2999682C (en) * | 2015-09-29 | 2020-07-14 | Nippon Telegraph And Telephone Corporation | Semiconductor laser device |
CN109883586B (zh) * | 2019-02-26 | 2021-05-11 | 山东大学 | 一种基于偏振干涉的铌酸锂晶体压力传感器及其应用 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4156206A (en) * | 1976-12-30 | 1979-05-22 | International Business Machines Corporation | Grating coupled waveguide laser apparatus |
JPS6043680B2 (ja) * | 1979-09-21 | 1985-09-30 | 日本電信電話株式会社 | 温度安定化レ−ザ装置 |
JPS58111391A (ja) * | 1981-12-25 | 1983-07-02 | Hitachi Ltd | 半導体レ−ザ装置 |
DE3231492A1 (de) * | 1982-08-25 | 1984-03-01 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Integrierte mikro-optische vorrichtung |
US4468084A (en) * | 1982-11-22 | 1984-08-28 | Honeywell Inc. | Integrated optical time integrating correlator |
JPS59143109A (ja) * | 1983-02-04 | 1984-08-16 | Sumitomo Electric Ind Ltd | 光集積回路 |
JPS6059547A (ja) * | 1983-09-12 | 1985-04-05 | Nippon Telegr & Teleph Corp <Ntt> | 光学ヘツド |
US4529876A (en) * | 1983-12-27 | 1985-07-16 | Walker Clifford G | Integrated optics transducer |
JPS60195985A (ja) * | 1984-03-16 | 1985-10-04 | Anritsu Corp | 光電変換器 |
JPS60202553A (ja) * | 1984-03-27 | 1985-10-14 | Nec Corp | 導波路型光ヘツド |
CA1255382A (en) * | 1984-08-10 | 1989-06-06 | Masao Kawachi | Hybrid optical integrated circuit with alignment guides |
EP0174008B1 (de) * | 1984-09-03 | 1992-05-20 | Omron Tateisi Electronics Co. | Vorrichtung zur Verarbeitung optischer Daten |
US4718052A (en) * | 1984-10-01 | 1988-01-05 | Mitsubishi Denki Kabushiki Kaisha | Head assembly for optical disc |
FR2574566B1 (fr) * | 1984-12-11 | 1987-01-16 | Thomson Csf | Diodes emettrices/receptrices de lumiere et elements de transmission optiques non reciproques integres, et leur procede de fabrication |
JPH0630163B2 (ja) * | 1985-04-18 | 1994-04-20 | 三菱電機株式会社 | 光情報処理装置 |
JPS61290787A (ja) * | 1985-06-18 | 1986-12-20 | Sharp Corp | 半導体レ−ザ装置 |
JPS6273437A (ja) * | 1985-09-26 | 1987-04-04 | Mitsubishi Electric Corp | 光学式ヘツド装置 |
EP0226868B1 (de) * | 1985-12-10 | 1992-11-25 | Siemens Aktiengesellschaft | Integriert-optischer Multiplex-Demultiplex-Modul für die optische Nachrichtenübertragung |
-
1986
- 1986-11-05 JP JP61264308A patent/JP2572050B2/ja not_active Expired - Fee Related
-
1987
- 1987-11-05 EP EP87309799A patent/EP0267036B1/de not_active Expired - Lifetime
- 1987-11-05 DE DE3789136T patent/DE3789136T2/de not_active Expired - Lifetime
- 1987-11-05 US US07/117,690 patent/US4911512A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3789136D1 (de) | 1994-03-31 |
EP0267036A3 (en) | 1989-07-26 |
US4911512A (en) | 1990-03-27 |
JPS63117337A (ja) | 1988-05-21 |
EP0267036A2 (de) | 1988-05-11 |
EP0267036B1 (de) | 1994-02-23 |
JP2572050B2 (ja) | 1997-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |