DE3786840T2 - Vorrichtung und Verfahren zur Oberflächenbehandlung mit Plasma. - Google Patents

Vorrichtung und Verfahren zur Oberflächenbehandlung mit Plasma.

Info

Publication number
DE3786840T2
DE3786840T2 DE87107321T DE3786840T DE3786840T2 DE 3786840 T2 DE3786840 T2 DE 3786840T2 DE 87107321 T DE87107321 T DE 87107321T DE 3786840 T DE3786840 T DE 3786840T DE 3786840 T2 DE3786840 T2 DE 3786840T2
Authority
DE
Germany
Prior art keywords
plasma
surface treatment
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE87107321T
Other languages
English (en)
Other versions
DE3786840D1 (de
Inventor
Yuichi Kokaku
Makoto Kitoh
Yoshinori Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3786840D1 publication Critical patent/DE3786840D1/de
Publication of DE3786840T2 publication Critical patent/DE3786840T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C2037/90—Measuring, controlling or regulating

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
DE87107321T 1986-05-21 1987-05-20 Vorrichtung und Verfahren zur Oberflächenbehandlung mit Plasma. Expired - Fee Related DE3786840T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61114562A JPS62274080A (ja) 1986-05-21 1986-05-21 プラズマ処理方法

Publications (2)

Publication Number Publication Date
DE3786840D1 DE3786840D1 (de) 1993-09-09
DE3786840T2 true DE3786840T2 (de) 1994-01-20

Family

ID=14640917

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87107321T Expired - Fee Related DE3786840T2 (de) 1986-05-21 1987-05-20 Vorrichtung und Verfahren zur Oberflächenbehandlung mit Plasma.

Country Status (5)

Country Link
US (1) US5300189A (de)
EP (1) EP0248274B1 (de)
JP (1) JPS62274080A (de)
KR (1) KR910000290B1 (de)
DE (1) DE3786840T2 (de)

Families Citing this family (46)

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US5190703A (en) * 1990-12-24 1993-03-02 Himont, Incorporated Plasma reactor chamber
US5224441A (en) * 1991-09-27 1993-07-06 The Boc Group, Inc. Apparatus for rapid plasma treatments and method
IL107827A0 (en) * 1992-12-08 1994-04-12 Hughes Aircraft Co Plasma pressure control assembly
DE4308632B4 (de) * 1993-03-18 2007-10-04 Applied Materials Gmbh & Co. Kg Verfahren und Vorrichtung zum Nachbehandeln von Aluminium-beschichteten Kunststoff-Folien
DE4308631A1 (de) * 1993-03-18 1994-09-22 Leybold Ag Verfahren und Vorrichtung zur Behandlung unbeschichteter Kunststoff-Folien
US6835523B1 (en) * 1993-05-09 2004-12-28 Semiconductor Energy Laboratory Co., Ltd. Apparatus for fabricating coating and method of fabricating the coating
JP3175894B2 (ja) * 1994-03-25 2001-06-11 株式会社半導体エネルギー研究所 プラズマ処理装置及びプラズマ処理方法
US5534232A (en) * 1994-08-11 1996-07-09 Wisconsin Alumini Research Foundation Apparatus for reactions in dense-medium plasmas
FR2751664B1 (fr) * 1996-07-23 1998-09-04 Air Liquide Procede et dispositif de commande du fonctionnement d'un systeme de traitement de surface d'un substrat solide en defilement
FR2751665B1 (fr) * 1996-07-23 1998-09-04 Air Liquide Procede et dispositif de commande du fonctionnement d'un systeme de traitement de surface
KR100296692B1 (ko) * 1996-09-10 2001-10-24 사토 도리 플라즈마cvd장치
JP4344019B2 (ja) * 1997-05-28 2009-10-14 キヤノンアネルバ株式会社 イオン化スパッタ方法
US6106659A (en) * 1997-07-14 2000-08-22 The University Of Tennessee Research Corporation Treater systems and methods for generating moderate-to-high-pressure plasma discharges for treating materials and related treated materials
CA2295729A1 (en) * 1997-07-14 1999-01-28 John Lynch Plasma treater systems and treatment methods
DK0908535T3 (da) * 1997-10-08 2003-11-10 Cockerill Rech & Dev Fremgangsmåde til at dekapere et substrat og anlæg til at udføre fremgangsmåden
US6082292A (en) * 1999-01-05 2000-07-04 Wisconsin Alumni Research Foundation Sealing roller system for surface treatment gas reactors
JP2003342739A (ja) * 2002-05-23 2003-12-03 Sony Corp プラズマ化学的気相成長装置
KR20040046571A (ko) * 2002-11-27 2004-06-05 주식회사 피앤아이 이온빔을 이용한 재료의 표면 처리 장치
US20050172897A1 (en) * 2004-02-09 2005-08-11 Frank Jansen Barrier layer process and arrangement
US7087145B1 (en) 2005-03-10 2006-08-08 Robert Choquette Sputtering cathode assembly
JP4558810B2 (ja) * 2008-02-29 2010-10-06 富士フイルム株式会社 成膜装置
JP4999737B2 (ja) * 2008-03-14 2012-08-15 富士フイルム株式会社 成膜装置
JP5009845B2 (ja) * 2008-03-14 2012-08-22 富士フイルム株式会社 成膜装置
EP2123793A1 (de) * 2008-05-20 2009-11-25 Helianthos B.V. Dampfabscheidungsverfahren
US20100037820A1 (en) * 2008-08-13 2010-02-18 Synos Technology, Inc. Vapor Deposition Reactor
US20100037824A1 (en) * 2008-08-13 2010-02-18 Synos Technology, Inc. Plasma Reactor Having Injector
US8851012B2 (en) * 2008-09-17 2014-10-07 Veeco Ald Inc. Vapor deposition reactor using plasma and method for forming thin film using the same
US8770142B2 (en) * 2008-09-17 2014-07-08 Veeco Ald Inc. Electrode for generating plasma and plasma generator
US20100101727A1 (en) * 2008-10-27 2010-04-29 Helin Ji Capacitively coupled remote plasma source with large operating pressure range
RU2482219C2 (ru) * 2008-11-05 2013-05-20 Улвак, Инк. Намоточное вакуумированное устройство
CN102325718B (zh) * 2008-12-30 2013-12-18 3M创新有限公司 制备纳米结构化表面的方法
CN106185793A (zh) 2008-12-30 2016-12-07 3M创新有限公司 纳米结构化制品和制备纳米结构化制品的方法
US8871628B2 (en) * 2009-01-21 2014-10-28 Veeco Ald Inc. Electrode structure, device comprising the same and method for forming electrode structure
WO2010095901A2 (en) 2009-02-23 2010-08-26 Synos Technology, Inc. Method for forming thin film using radicals generated by plasma
US8758512B2 (en) * 2009-06-08 2014-06-24 Veeco Ald Inc. Vapor deposition reactor and method for forming thin film
EP2360293A1 (de) * 2010-02-11 2011-08-24 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Verfahren und Vorrichtung zur Ablagerung atomarer Schichten auf einem Substrat
US8771791B2 (en) 2010-10-18 2014-07-08 Veeco Ald Inc. Deposition of layer using depositing apparatus with reciprocating susceptor
US8877300B2 (en) 2011-02-16 2014-11-04 Veeco Ald Inc. Atomic layer deposition using radicals of gas mixture
US9163310B2 (en) 2011-02-18 2015-10-20 Veeco Ald Inc. Enhanced deposition of layer on substrate using radicals
RU2642494C2 (ru) * 2012-03-20 2018-01-25 МЭППЕР ЛИТОГРАФИ АйПи Б.В. Агрегат и способ переноса радикалов
US8822314B2 (en) * 2012-06-14 2014-09-02 Palo Alto Research Center Incorporated Method of growing epitaxial layers on a substrate
JP6045265B2 (ja) 2012-09-18 2016-12-14 リンテック株式会社 イオン注入装置
JP6045266B2 (ja) * 2012-09-18 2016-12-14 リンテック株式会社 イオン注入装置
JP6303733B2 (ja) * 2014-03-31 2018-04-04 ソニー株式会社 磁気記録媒体およびその製造方法、ならびに成膜装置
DE102015222556B3 (de) * 2015-11-16 2017-05-04 FAP Forschungs- und Applikationslabor Plasmatechnik GmbH Dresden Vorrichtung zur Modifizierung von Oberflächen von Folien
KR20220083082A (ko) * 2020-12-11 2022-06-20 한국핵융합에너지연구원 통기성 부재의 내면을 플라즈마 처리하는 방법 및 이의 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4013539A (en) * 1973-01-12 1977-03-22 Coulter Information Systems, Inc. Thin film deposition apparatus
US4322276A (en) * 1979-06-20 1982-03-30 Deposition Technology, Inc. Method for producing an inhomogeneous film for selective reflection/transmission of solar radiation
JPS5718737A (en) * 1980-06-21 1982-01-30 Shin Etsu Chem Co Ltd Apparatus for continuous plasma treatment
JPS5754269A (en) * 1980-09-17 1982-03-31 Matsushita Electric Ind Co Ltd Apparatus for forming film in vacuum
JPS5991130A (ja) * 1982-11-16 1984-05-25 Matsushita Electric Ind Co Ltd 高分子基板の表面処理方法
JPS59213735A (ja) * 1983-05-18 1984-12-03 Kuraray Co Ltd プラズマ処理方法
US4631105A (en) * 1985-04-22 1986-12-23 Branson International Plasma Corporation Plasma etching apparatus

Also Published As

Publication number Publication date
US5300189A (en) 1994-04-05
JPS62274080A (ja) 1987-11-28
KR910000290B1 (ko) 1991-01-24
KR870010942A (ko) 1987-12-19
EP0248274B1 (de) 1993-08-04
EP0248274A3 (en) 1989-11-29
EP0248274A2 (de) 1987-12-09
DE3786840D1 (de) 1993-09-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee