DE3784666D1 - Verfahren und uebertragungsplatte zum auftragen von loetmittel auf kontaktbeine von bauteilen. - Google Patents
Verfahren und uebertragungsplatte zum auftragen von loetmittel auf kontaktbeine von bauteilen.Info
- Publication number
- DE3784666D1 DE3784666D1 DE8787115744T DE3784666T DE3784666D1 DE 3784666 D1 DE3784666 D1 DE 3784666D1 DE 8787115744 T DE8787115744 T DE 8787115744T DE 3784666 T DE3784666 T DE 3784666T DE 3784666 D1 DE3784666 D1 DE 3784666D1
- Authority
- DE
- Germany
- Prior art keywords
- components
- transfer plate
- contact legs
- applying solvent
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/936,574 US4722470A (en) | 1986-12-01 | 1986-12-01 | Method and transfer plate for applying solder to component leads |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3784666D1 true DE3784666D1 (de) | 1993-04-15 |
DE3784666T2 DE3784666T2 (de) | 1993-09-23 |
Family
ID=25468837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787115744T Expired - Fee Related DE3784666T2 (de) | 1986-12-01 | 1987-10-27 | Verfahren und uebertragungsplatte zum auftragen von loetmittel auf kontaktbeine von bauteilen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4722470A (de) |
EP (1) | EP0273131B1 (de) |
JP (1) | JPS63143894A (de) |
DE (1) | DE3784666T2 (de) |
Families Citing this family (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10131225B4 (de) * | 1983-12-29 | 2012-07-05 | Tyco Electronics Amp Gmbh | Kontaktelement von zur Oberflächenmontage geeigneten Bauteilen sowie Verfahren zum Anbringen von Lot an diese Kontaktelemente |
JPS63304636A (ja) * | 1987-06-05 | 1988-12-12 | Hitachi Ltd | はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法 |
US4832255A (en) * | 1988-07-25 | 1989-05-23 | International Business Machines Corporation | Precision solder transfer method and means |
US4898320A (en) * | 1988-11-21 | 1990-02-06 | Honeywell, Inc. | Method of manufacturing a high-yield solder bumped semiconductor wafer |
US5574629A (en) * | 1989-06-09 | 1996-11-12 | Sullivan; Kenneth W. | Solderless printed wiring devices |
US5048747A (en) * | 1989-06-27 | 1991-09-17 | At&T Bell Laboratories | Solder assembly of components |
US5232736A (en) * | 1989-07-24 | 1993-08-03 | Motorola, Inc. | Method for controlling solder printer |
US5046658A (en) * | 1989-07-27 | 1991-09-10 | At&T Bell Laboratories | Method and apparatus for soldering articles |
EP0448266B1 (de) * | 1990-03-23 | 1996-06-05 | Motorola, Inc. | Oberflächenmontierbare Halbleitervorrichtung mit selbstbeladenen Lötverbindungen |
US5241134A (en) * | 1990-09-17 | 1993-08-31 | Yoo Clarence S | Terminals of surface mount components |
US5124175A (en) * | 1990-11-15 | 1992-06-23 | Microelectronics And Computer Technology Corporation | Method of patterned metal reflow on interconnect substrates |
US5118027A (en) * | 1991-04-24 | 1992-06-02 | International Business Machines Corporation | Method of aligning and mounting solder balls to a substrate |
CA2047502C (en) * | 1991-07-22 | 1995-05-09 | Peter Tsuk | Selectively plating electrically conductive pin |
GB2259661A (en) * | 1991-09-18 | 1993-03-24 | Ibm | Depositing solder on printed circuit boards |
AU2739892A (en) * | 1991-10-29 | 1993-05-06 | Alcatel N.V. | Method of producing solid solder coatings |
US5219117A (en) * | 1991-11-01 | 1993-06-15 | Motorola, Inc. | Method of transferring solder balls onto a semiconductor device |
US5297008A (en) * | 1991-12-31 | 1994-03-22 | Compaq Computer Corporation (Compaq) | Polymeric composite lead wire and method for making same |
US5244143A (en) * | 1992-04-16 | 1993-09-14 | International Business Machines Corporation | Apparatus and method for injection molding solder and applications thereof |
US5541447A (en) * | 1992-04-22 | 1996-07-30 | Yamaha Corporation | Lead frame |
NL195026C (nl) * | 1992-04-22 | 2003-06-18 | Yamaha Corporation | Werkwijze voor het bewerken van een raam van elektrische geleiders voor een halfgeleiderelement. |
US5211328A (en) * | 1992-05-22 | 1993-05-18 | International Business Machines | Method of applying solder |
US5197655A (en) * | 1992-06-05 | 1993-03-30 | International Business Machines Corporation | Fine pitch solder application |
TW238431B (de) * | 1992-12-01 | 1995-01-11 | Stanford W Crane Jr | |
US5367124A (en) * | 1993-06-28 | 1994-11-22 | International Business Machines Corporation | Compliant lead for surface mounting a chip package to a substrate |
US5373984A (en) * | 1993-09-27 | 1994-12-20 | Sundstrand Corporation | Reflow process for mixed technology on a printed wiring board |
US5492266A (en) * | 1994-08-31 | 1996-02-20 | International Business Machines Corporation | Fine pitch solder deposits on printed circuit board process and product |
US5493075A (en) * | 1994-09-30 | 1996-02-20 | International Business Machines Corporation | Fine pitch solder formation on printed circuit board process and product |
US6939173B1 (en) * | 1995-06-12 | 2005-09-06 | Fci Americas Technology, Inc. | Low cross talk and impedance controlled electrical connector with solder masses |
TW267265B (en) * | 1995-06-12 | 1996-01-01 | Connector Systems Tech Nv | Low cross talk and impedance controlled electrical connector |
US5872051A (en) * | 1995-08-02 | 1999-02-16 | International Business Machines Corporation | Process for transferring material to semiconductor chip conductive pads using a transfer substrate |
DE19533169C2 (de) * | 1995-09-08 | 2002-02-07 | Fraunhofer Ges Forschung | Lotdepotträger |
US6448169B1 (en) * | 1995-12-21 | 2002-09-10 | International Business Machines Corporation | Apparatus and method for use in manufacturing semiconductor devices |
US6384333B1 (en) | 1996-05-21 | 2002-05-07 | Micron Technology, Inc. | Underfill coating for LOC package |
US5733800A (en) | 1996-05-21 | 1998-03-31 | Micron Technology, Inc. | Underfill coating for LOC package |
US6024584A (en) | 1996-10-10 | 2000-02-15 | Berg Technology, Inc. | High density connector |
US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
US5863812A (en) * | 1996-09-19 | 1999-01-26 | Vlsi Technology, Inc. | Process for manufacturing a multi layer bumped semiconductor device |
US6042389A (en) * | 1996-10-10 | 2000-03-28 | Berg Technology, Inc. | Low profile connector |
TW406454B (en) | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US6241535B1 (en) | 1996-10-10 | 2001-06-05 | Berg Technology, Inc. | Low profile connector |
US6139336A (en) * | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
US6230963B1 (en) | 1997-01-28 | 2001-05-15 | Eric L. Hertz | Method and apparatus using colored foils for placing conductive preforms |
US6202918B1 (en) | 1997-01-28 | 2001-03-20 | Eric Hertz | Method and apparatus for placing conductive preforms |
US6641030B1 (en) | 1997-02-06 | 2003-11-04 | Speedline Technologies, Inc. | Method and apparatus for placing solder balls on a substrate |
US6056190A (en) * | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
US6427903B1 (en) | 1997-02-06 | 2002-08-06 | Speedline Technologies, Inc. | Solder ball placement apparatus |
US5975921A (en) * | 1997-10-10 | 1999-11-02 | Berg Technology, Inc. | High density connector system |
FR2789225B1 (fr) * | 1999-02-02 | 2004-09-03 | Thomson Csf | Circuit integre de type montable en surface |
JP2001060596A (ja) * | 1999-08-19 | 2001-03-06 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
EP1314196A1 (de) * | 2000-07-18 | 2003-05-28 | Atmel Grenoble S.A. | Herstellungsverfahren für einen auf einer oberfläche montierbaren integrierten schaltkreis und dadurch hergestellter schaltkreis |
US7057273B2 (en) * | 2001-05-15 | 2006-06-06 | Gem Services, Inc. | Surface mount package |
US7297003B2 (en) * | 2003-07-16 | 2007-11-20 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
EP1645173A2 (de) * | 2003-07-16 | 2006-04-12 | Gryphics, Inc. | Elektrische verbindungsbaugruppe mit verriegelndem kontaktsystem |
US7537461B2 (en) * | 2003-07-16 | 2009-05-26 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
US20060196857A1 (en) * | 2005-03-03 | 2006-09-07 | Samtec, Inc. | Methods of manufacturing electrical contacts having solder stops |
US7172438B2 (en) | 2005-03-03 | 2007-02-06 | Samtec, Inc. | Electrical contacts having solder stops |
US8044502B2 (en) | 2006-03-20 | 2011-10-25 | Gryphics, Inc. | Composite contact for fine pitch electrical interconnect assembly |
KR20080033092A (ko) * | 2006-10-11 | 2008-04-16 | 쥬키 가부시키가이샤 | 전자부품의 실장방법 및 장치 |
US7737546B2 (en) * | 2007-09-05 | 2010-06-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Surface mountable semiconductor package with solder bonding features |
JP4954050B2 (ja) * | 2007-12-20 | 2012-06-13 | モレックス インコーポレイテド | 端子及びコネクタ |
US8366485B2 (en) | 2009-03-19 | 2013-02-05 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
US8052434B2 (en) * | 2009-04-20 | 2011-11-08 | Hon Hai Precision Ind. Co., Ltd. | Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint |
TWM380606U (en) * | 2009-11-12 | 2010-05-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US8894422B2 (en) | 2010-04-20 | 2014-11-25 | Hon Hai Precision Industry Co., Ltd. | Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint |
US9142932B2 (en) | 2010-04-20 | 2015-09-22 | Hon Hai Precision Industry Co., Ltd. | Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder joint |
JP2012160310A (ja) | 2011-01-31 | 2012-08-23 | Fujitsu Component Ltd | 表面実装部品及び製造方法 |
JP5479406B2 (ja) * | 2011-06-30 | 2014-04-23 | 日本航空電子工業株式会社 | コネクタ |
CN102509990A (zh) * | 2011-10-19 | 2012-06-20 | 番禺得意精密电子工业有限公司 | 电连接器的成型方法 |
EP2624034A1 (de) | 2012-01-31 | 2013-08-07 | Fci | Abbaubare optische Kupplungsvorrichtung |
USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
US9257778B2 (en) | 2012-04-13 | 2016-02-09 | Fci Americas Technology | High speed electrical connector |
USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
US8944831B2 (en) | 2012-04-13 | 2015-02-03 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate with engagement members |
US9543703B2 (en) | 2012-07-11 | 2017-01-10 | Fci Americas Technology Llc | Electrical connector with reduced stack height |
USD751507S1 (en) | 2012-07-11 | 2016-03-15 | Fci Americas Technology Llc | Electrical connector |
US9027228B2 (en) * | 2012-11-29 | 2015-05-12 | Honeywell International Inc. | Method for manufacturing electromagnetic coil assemblies |
USD745852S1 (en) | 2013-01-25 | 2015-12-22 | Fci Americas Technology Llc | Electrical connector |
USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
WO2017142741A1 (en) * | 2016-02-19 | 2017-08-24 | Alpha Assembly Solutions Inc. | Rf shield with selectively integrated solder |
US11688714B2 (en) * | 2017-09-05 | 2023-06-27 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor package with three leads |
JP2022049987A (ja) * | 2020-09-17 | 2022-03-30 | 株式会社村田製作所 | 積層セラミック電子部品、積層セラミック電子部品の実装構造 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2728330A1 (de) * | 1977-06-23 | 1979-01-11 | Siemens Ag | Verfahren zum verloeten von kontaktteilen und/oder halbleiterplaettchen |
FR2476428A1 (fr) * | 1980-02-15 | 1981-08-21 | Tech Electro Cie Indle | Procede de fixation de composants electroniques sur un circuit imprime et produit obtenu par ce procede |
US4396140A (en) * | 1981-01-27 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Method of bonding electronic components |
US4412642A (en) * | 1982-03-15 | 1983-11-01 | Western Electric Co., Inc. | Cast solder leads for leadless semiconductor circuits |
JPS60201696A (ja) * | 1984-03-27 | 1985-10-12 | 松下電器産業株式会社 | フラツトパツケ−ジの半田付方法 |
JPS62179139A (ja) * | 1986-02-03 | 1987-08-06 | Matsushita Electric Ind Co Ltd | Icリ−ド予備半田付け方法 |
-
1986
- 1986-12-01 US US06/936,574 patent/US4722470A/en not_active Expired - Lifetime
-
1987
- 1987-09-18 JP JP62232758A patent/JPS63143894A/ja active Pending
- 1987-10-27 DE DE8787115744T patent/DE3784666T2/de not_active Expired - Fee Related
- 1987-10-27 EP EP87115744A patent/EP0273131B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4722470A (en) | 1988-02-02 |
JPS63143894A (ja) | 1988-06-16 |
EP0273131B1 (de) | 1993-03-10 |
EP0273131A1 (de) | 1988-07-06 |
DE3784666T2 (de) | 1993-09-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |