DE3770791D1 - Verfahren zur entfernung von vernetzten epoxiden. - Google Patents
Verfahren zur entfernung von vernetzten epoxiden.Info
- Publication number
- DE3770791D1 DE3770791D1 DE8787118548T DE3770791T DE3770791D1 DE 3770791 D1 DE3770791 D1 DE 3770791D1 DE 8787118548 T DE8787118548 T DE 8787118548T DE 3770791 T DE3770791 T DE 3770791T DE 3770791 D1 DE3770791 D1 DE 3770791D1
- Authority
- DE
- Germany
- Prior art keywords
- removing cross
- epoxies
- linked
- linked epoxies
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004593 Epoxy Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/948,259 US4729797A (en) | 1986-12-31 | 1986-12-31 | Process for removal of cured epoxy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3770791D1 true DE3770791D1 (de) | 1991-07-18 |
Family
ID=25487551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8787118548T Expired - Lifetime DE3770791D1 (de) | 1986-12-31 | 1987-12-15 | Verfahren zur entfernung von vernetzten epoxiden. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4729797A (https=) |
| EP (1) | EP0273294B1 (https=) |
| JP (1) | JPS63172746A (https=) |
| DE (1) | DE3770791D1 (https=) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5346640A (en) * | 1989-08-30 | 1994-09-13 | Transcontinental Marketing Group, Inc. | Cleaner compositions for removing graffiti from surfaces |
| JPH08231989A (ja) * | 1995-02-23 | 1996-09-10 | Kurita Water Ind Ltd | 洗浄剤組成物及び洗浄方法 |
| US20080196828A1 (en) * | 1999-07-14 | 2008-08-21 | Gilbert Michael D | Electrically Disbonding Adhesive Compositions and Related Methods |
| US7332218B1 (en) * | 1999-07-14 | 2008-02-19 | Eic Laboratories, Inc. | Electrically disbonding materials |
| US20050066995A1 (en) * | 2003-09-30 | 2005-03-31 | International Business Machines Corporation | Non-hermetic encapsulant removal for module rework |
| US20070269659A1 (en) * | 2006-05-17 | 2007-11-22 | Eic Laboratories, Inc. | Electrically disbondable compositions and related methods |
| EP3262132A1 (en) | 2015-02-27 | 2018-01-03 | Henkel AG & Co. KGaA | Debondable reactive hot melt adhesives |
| EP3199344B1 (en) | 2016-02-01 | 2022-04-13 | Henkel AG & Co. KGaA | Electrical debonding of pu hot melt adhesives by use of conductive inks |
| CN109831879A (zh) * | 2019-02-23 | 2019-05-31 | 上海富柏化工有限公司 | 一种护锡型pcb去膜液 |
| ES2973449T3 (es) | 2019-12-13 | 2024-06-20 | Henkel Ag & Co Kgaa | Composición adhesiva curable de dos componentes (2K) |
| EP3835378A1 (en) | 2019-12-13 | 2021-06-16 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| PL3835381T3 (pl) | 2019-12-13 | 2023-06-26 | Henkel Ag & Co. Kgaa | Dwuskładnikowa (2k) utwardzalna kompozycja klejowa |
| EP3835383B1 (en) | 2019-12-13 | 2023-04-12 | Henkel AG & Co. KGaA | One component (1k) curable adhesive composition |
| CN115443320A (zh) | 2020-04-24 | 2022-12-06 | 汉高股份有限及两合公司 | 可热分离的双层胶黏剂体系和使用该体系的胶黏剂脱胶方法 |
| JP7804594B2 (ja) | 2020-06-22 | 2026-01-22 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 電気化学的に剥離可能な接着剤組成物 |
| EP4050040A1 (en) | 2021-02-26 | 2022-08-31 | Henkel AG & Co. KGaA | One component (1k) curable adhesive composition |
| EP4067401A1 (en) | 2021-03-30 | 2022-10-05 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| KR20230169152A (ko) | 2021-04-14 | 2023-12-15 | 헨켈 아게 운트 코. 카게아아 | 용매계 감압성 접착제 (psa)를 기반으로 하는 탈결합가능한 구조체 |
| EP4540296A1 (en) | 2022-06-17 | 2025-04-23 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| PT4332144T (pt) | 2022-09-05 | 2025-07-09 | Henkel Ag & Co Kgaa | Composição adesiva curável de um componente (1k) |
| WO2025093205A1 (en) | 2023-10-31 | 2025-05-08 | Henkel Ag & Co. Kgaa | Two component (2k) curable and debondable adhesive composition |
| EP4559672A1 (en) | 2023-11-27 | 2025-05-28 | Henkel AG & Co. KGaA | Method of separating bonded articles |
| EP4559671A1 (en) | 2023-11-27 | 2025-05-28 | Henkel AG & Co. KGaA | Method of separating bonded articles |
| WO2025119717A1 (en) | 2023-12-04 | 2025-06-12 | Henkel Ag & Co. Kgaa | An adhesive sheet |
| EP4678390A1 (en) | 2024-07-10 | 2026-01-14 | Henkel AG & Co. KGaA | An adhesive sheet |
| EP4566807A1 (en) | 2023-12-04 | 2025-06-11 | Henkel AG & Co. KGaA | An adhesive sheet |
| EP4566808A1 (en) | 2023-12-06 | 2025-06-11 | Henkel AG & Co. KGaA | Bonded structure comprising an electrochemically debondable adhesive |
| EP4567085A1 (en) | 2023-12-08 | 2025-06-11 | Henkel AG & Co. KGaA | Electrochemically debondable adhesive film |
| EP4644500A1 (en) | 2024-04-30 | 2025-11-05 | Henkel AG & Co. KGaA | Two-component (2k) curable adhesive composition |
| EP4644502A1 (en) | 2024-04-30 | 2025-11-05 | Henkel AG & Co. KGaA | Electrochemically debondable adhesive film |
| WO2025241057A1 (en) | 2024-05-20 | 2025-11-27 | Henkel Ag & Co. Kgaa | Bonded structure comprising an electrochemically debondable adhesive film |
| EP4663713A1 (en) | 2024-06-13 | 2025-12-17 | Henkel AG & Co. KGaA | Bonded structure comprising an thermally debondable adhesive film |
| DE102024117579A1 (de) | 2024-06-21 | 2025-12-24 | Henkel Ag & Co. Kgaa | Polyurethanbasierter Klebstoff mit schaltbarer Enthaftung |
| EP4717746A1 (en) | 2024-09-27 | 2026-04-01 | Henkel AG & Co. KGaA | One component (1k) composition based on epoxide compounds |
| EP4721970A1 (en) | 2024-10-01 | 2026-04-08 | Henkel AG & Co. KGaA | Bonded structure comprising an electrochemically debondable adhesive layer |
| EP4721971A1 (en) | 2024-10-07 | 2026-04-08 | Henkel AG & Co. KGaA | Method of separating bonded articles |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3673099A (en) * | 1970-10-19 | 1972-06-27 | Bell Telephone Labor Inc | Process and composition for stripping cured resins from substrates |
| US4168989A (en) * | 1975-06-10 | 1979-09-25 | Westinghouse Electric Corp. | Stripping composition for thermoset resins and method of repairing electrical apparatus |
| US4171240A (en) * | 1978-04-26 | 1979-10-16 | Western Electric Company, Inc. | Method of removing a cured epoxy from a metal surface |
| US4276186A (en) * | 1979-06-26 | 1981-06-30 | International Business Machines Corporation | Cleaning composition and use thereof |
| US4294729A (en) * | 1979-12-17 | 1981-10-13 | International Business Machines Corporation | Composition containing alcohol and use thereof for epoxy removal |
| US4304681A (en) * | 1980-09-15 | 1981-12-08 | Shipley Company, Inc. | Novel stripping composition for positive photoresists and method of using same |
| JPS58139430A (ja) * | 1982-02-15 | 1983-08-18 | Toray Ind Inc | レジストの剥離法 |
-
1986
- 1986-12-31 US US06/948,259 patent/US4729797A/en not_active Expired - Lifetime
-
1987
- 1987-11-27 JP JP62297915A patent/JPS63172746A/ja active Granted
- 1987-12-15 DE DE8787118548T patent/DE3770791D1/de not_active Expired - Lifetime
- 1987-12-15 EP EP87118548A patent/EP0273294B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63172746A (ja) | 1988-07-16 |
| EP0273294B1 (en) | 1991-06-12 |
| EP0273294A2 (en) | 1988-07-06 |
| US4729797A (en) | 1988-03-08 |
| EP0273294A3 (en) | 1989-02-08 |
| JPH0556778B2 (https=) | 1993-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |