DE3770791D1 - Verfahren zur entfernung von vernetzten epoxiden. - Google Patents

Verfahren zur entfernung von vernetzten epoxiden.

Info

Publication number
DE3770791D1
DE3770791D1 DE8787118548T DE3770791T DE3770791D1 DE 3770791 D1 DE3770791 D1 DE 3770791D1 DE 8787118548 T DE8787118548 T DE 8787118548T DE 3770791 T DE3770791 T DE 3770791T DE 3770791 D1 DE3770791 D1 DE 3770791D1
Authority
DE
Germany
Prior art keywords
removing cross
epoxies
linked
linked epoxies
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787118548T
Other languages
English (en)
Inventor
Harold George Linde
Elizabeth Theresa Murphy
Denis John Poley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3770791D1 publication Critical patent/DE3770791D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE8787118548T 1986-12-31 1987-12-15 Verfahren zur entfernung von vernetzten epoxiden. Expired - Fee Related DE3770791D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/948,259 US4729797A (en) 1986-12-31 1986-12-31 Process for removal of cured epoxy

Publications (1)

Publication Number Publication Date
DE3770791D1 true DE3770791D1 (de) 1991-07-18

Family

ID=25487551

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787118548T Expired - Fee Related DE3770791D1 (de) 1986-12-31 1987-12-15 Verfahren zur entfernung von vernetzten epoxiden.

Country Status (4)

Country Link
US (1) US4729797A (de)
EP (1) EP0273294B1 (de)
JP (1) JPS63172746A (de)
DE (1) DE3770791D1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346640A (en) * 1989-08-30 1994-09-13 Transcontinental Marketing Group, Inc. Cleaner compositions for removing graffiti from surfaces
JPH08231989A (ja) * 1995-02-23 1996-09-10 Kurita Water Ind Ltd 洗浄剤組成物及び洗浄方法
US20080196828A1 (en) * 1999-07-14 2008-08-21 Gilbert Michael D Electrically Disbonding Adhesive Compositions and Related Methods
US7332218B1 (en) * 1999-07-14 2008-02-19 Eic Laboratories, Inc. Electrically disbonding materials
US20050066995A1 (en) * 2003-09-30 2005-03-31 International Business Machines Corporation Non-hermetic encapsulant removal for module rework
US20070269659A1 (en) * 2006-05-17 2007-11-22 Eic Laboratories, Inc. Electrically disbondable compositions and related methods
CN107207938B (zh) 2015-02-27 2020-12-15 汉高股份有限及两合公司 可脱粘的反应性热熔粘合剂
EP3199344B1 (de) 2016-02-01 2022-04-13 Henkel AG & Co. KGaA Elektrisches debonden von pu-heissschmelzklebstoffen mithilfe leitfähiger tinten
CN109831879A (zh) * 2019-02-23 2019-05-31 上海富柏化工有限公司 一种护锡型pcb去膜液
ES2940490T3 (es) 2019-12-13 2023-05-08 Henkel Ag & Co Kgaa Composición adhesiva curable de dos componentes (2K)
ES2973449T3 (es) 2019-12-13 2024-06-20 Henkel Ag & Co Kgaa Composición adhesiva curable de dos componentes (2K)
EP3835383B1 (de) 2019-12-13 2023-04-12 Henkel AG & Co. KGaA Einkomponentige (1k) härtbare klebstoffzusammensetzung
EP3835378A1 (de) 2019-12-13 2021-06-16 Henkel AG & Co. KGaA Zweikomponentige (2k) härtbare klebstoffzusammensetzung
KR20230004524A (ko) 2020-04-24 2023-01-06 헨켈 아게 운트 코. 카게아아 열 분리형 2 층 점착제 시스템 및 이를 이용한 점착제 디본딩 방법
WO2021259594A1 (en) 2020-06-22 2021-12-30 Henkel Ag & Co. Kgaa Electrochemically debondable adhesive composition
EP4050040A1 (de) 2021-02-26 2022-08-31 Henkel AG & Co. KGaA Einkomponentige (1k) härtbare klebstoffzusammensetzung
EP4067401A1 (de) 2021-03-30 2022-10-05 Henkel AG & Co. KGaA Zweikomponentige (2k) härtbare klebstoffzusammensetzung
KR20230169152A (ko) 2021-04-14 2023-12-15 헨켈 아게 운트 코. 카게아아 용매계 감압성 접착제 (psa)를 기반으로 하는 탈결합가능한 구조체
WO2023241875A1 (en) 2022-06-17 2023-12-21 Henkel Ag & Co. Kgaa Two component (2k) curable adhesive composition
EP4332144A1 (de) 2022-09-05 2024-03-06 Henkel AG & Co. KGaA Einkomponentige (1k) härtbare klebstoffzusammensetzung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673099A (en) * 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US4168989A (en) * 1975-06-10 1979-09-25 Westinghouse Electric Corp. Stripping composition for thermoset resins and method of repairing electrical apparatus
US4171240A (en) * 1978-04-26 1979-10-16 Western Electric Company, Inc. Method of removing a cured epoxy from a metal surface
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
US4294729A (en) * 1979-12-17 1981-10-13 International Business Machines Corporation Composition containing alcohol and use thereof for epoxy removal
US4304681A (en) * 1980-09-15 1981-12-08 Shipley Company, Inc. Novel stripping composition for positive photoresists and method of using same
JPS58139430A (ja) * 1982-02-15 1983-08-18 Toray Ind Inc レジストの剥離法

Also Published As

Publication number Publication date
EP0273294A2 (de) 1988-07-06
JPH0556778B2 (de) 1993-08-20
EP0273294A3 (en) 1989-02-08
US4729797A (en) 1988-03-08
EP0273294B1 (de) 1991-06-12
JPS63172746A (ja) 1988-07-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee