PL3835381T3 - Dwuskładnikowa (2k) utwardzalna kompozycja klejowa - Google Patents
Dwuskładnikowa (2k) utwardzalna kompozycja klejowaInfo
- Publication number
- PL3835381T3 PL3835381T3 PL19216098.4T PL19216098T PL3835381T3 PL 3835381 T3 PL3835381 T3 PL 3835381T3 PL 19216098 T PL19216098 T PL 19216098T PL 3835381 T3 PL3835381 T3 PL 3835381T3
- Authority
- PL
- Poland
- Prior art keywords
- component
- adhesive composition
- curable adhesive
- curable
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/378—Thiols containing heterocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19216098.4A EP3835381B1 (en) | 2019-12-13 | 2019-12-13 | Two component (2k) curable adhesive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
PL3835381T3 true PL3835381T3 (pl) | 2023-06-26 |
Family
ID=69105684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL19216098.4T PL3835381T3 (pl) | 2019-12-13 | 2019-12-13 | Dwuskładnikowa (2k) utwardzalna kompozycja klejowa |
Country Status (9)
Country | Link |
---|---|
US (1) | US20220389289A1 (pl) |
EP (1) | EP3835381B1 (pl) |
JP (1) | JP2023506807A (pl) |
KR (1) | KR20220117871A (pl) |
CN (1) | CN114787305A (pl) |
ES (1) | ES2940490T3 (pl) |
PL (1) | PL3835381T3 (pl) |
TW (1) | TW202132522A (pl) |
WO (1) | WO2021115772A1 (pl) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113980171B (zh) * | 2021-12-01 | 2022-10-11 | 香港中文大学(深圳) | 遇湿变硬的高分子材料及其制备方法和用途 |
JP2023138150A (ja) * | 2022-03-18 | 2023-09-29 | 株式会社東芝 | 物体の接着・剥離方法、及び物体接着剥離装置 |
EP4269518A1 (en) * | 2022-04-26 | 2023-11-01 | Henkel AG & Co. KGaA | Two component (2k) acrylic composition comprising a bio-renewable monomer |
WO2023241875A1 (en) | 2022-06-17 | 2023-12-21 | Henkel Ag & Co. Kgaa | Two component (2k) curable adhesive composition |
EP4332190A1 (en) * | 2022-09-05 | 2024-03-06 | Henkel AG & Co. KGaA | Debondable solvent-borne pressure sensitive adhesive (psa) |
WO2024079548A1 (en) * | 2022-10-10 | 2024-04-18 | 3M Innovative Properties Company | Electrically debondable uv activated adhesives |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3419512A (en) | 1965-12-23 | 1968-12-31 | Borden Inc | Anaerobic curing composition |
US3479246A (en) | 1967-08-08 | 1969-11-18 | John R Stapleton | Catalyzed room temperature curing shelf stable sealant compositions |
US3535342A (en) | 1968-02-07 | 1970-10-20 | Dow Chemical Co | Process for making alkylene carbonates |
JPS5117966B1 (pl) * | 1971-07-22 | 1976-06-07 | ||
IT1034323B (it) | 1975-03-17 | 1979-09-10 | Anic Spa | Procedimento per la preparazione di alchilencarbonati |
US4171240A (en) | 1978-04-26 | 1979-10-16 | Western Electric Company, Inc. | Method of removing a cured epoxy from a metal surface |
JPS5714669A (en) * | 1980-06-30 | 1982-01-25 | Bridgestone Corp | Electrically conductive bonding method of metal |
GB8307613D0 (en) | 1983-03-18 | 1983-04-27 | Bp Chem Int Ltd | Carbonates |
DE3529263A1 (de) | 1985-08-16 | 1987-02-19 | Hoechst Ag | Verfahren zur herstellung von 2-oxo-1,3-dioxolanen |
DE3600602A1 (de) | 1986-01-11 | 1987-07-16 | Hoechst Ag | Verfahren zur herstellung von 2-oxo-1,3-dioxolanen |
US4729797A (en) | 1986-12-31 | 1988-03-08 | International Business Machines Corporation | Process for removal of cured epoxy |
JPH051225A (ja) | 1991-06-25 | 1993-01-08 | Kanegafuchi Chem Ind Co Ltd | 硬化性組成物 |
DE29706235U1 (de) | 1997-04-08 | 1998-08-27 | Ernst Mühlbauer KG, 22547 Hamburg | Anordnung zum Ausgeben einer gemischten dentaltechnischen Mehrkomponentenmasse |
US7332218B1 (en) * | 1999-07-14 | 2008-02-19 | Eic Laboratories, Inc. | Electrically disbonding materials |
US20080196828A1 (en) | 1999-07-14 | 2008-08-21 | Gilbert Michael D | Electrically Disbonding Adhesive Compositions and Related Methods |
US20070269659A1 (en) | 2006-05-17 | 2007-11-22 | Eic Laboratories, Inc. | Electrically disbondable compositions and related methods |
DE102008040738A1 (de) | 2008-07-25 | 2010-01-28 | Hilti Aktiengesellschaft | Foliengebinde |
EP2545132B1 (en) * | 2010-03-09 | 2015-11-04 | Henkel IP & Holding GmbH | Cationic uv-crosslinkable acrylic polymers for pressure sensitive adhesives |
CN103958628B (zh) * | 2011-11-14 | 2016-02-17 | 汉高知识产权控股有限责任公司 | 粘合剂组合物 |
CN103571406B (zh) * | 2013-10-25 | 2016-08-31 | 北京天山新材料技术有限公司 | 高弹性室温快速固化丙烯酸酯结构胶及其制备方法 |
DE102014109355A1 (de) * | 2014-07-04 | 2016-01-07 | Fischerwerke Gmbh & Co. Kg | Reaktivverdünner für die chemische Befestigung |
JP6770523B2 (ja) * | 2015-02-27 | 2020-10-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | 剥離可能な反応性ホットメルト接着剤 |
TWI711680B (zh) * | 2015-07-03 | 2020-12-01 | 日商東亞合成股份有限公司 | 黏著劑組成物 |
EP3199344B1 (en) | 2016-02-01 | 2022-04-13 | Henkel AG & Co. KGaA | Electrical debonding of pu hot melt adhesives by use of conductive inks |
EP3497174A4 (en) * | 2016-08-10 | 2020-04-22 | 3M Innovative Properties Company | FLUORED PRESSURE SENSITIVE ADHESIVE |
WO2018081941A1 (zh) * | 2016-11-02 | 2018-05-11 | 宁德新能源科技有限公司 | 结构胶纸及其制备方法、在电极片预留极耳空位的方法 |
EP3612609B1 (en) * | 2017-04-21 | 2022-12-28 | Henkel AG & Co. KGaA | Adhesive compositions |
TWI768032B (zh) * | 2017-04-21 | 2022-06-21 | 德商漢高智慧財產控股公司 | 黏著劑組合物 |
JP2018188602A (ja) * | 2017-05-11 | 2018-11-29 | セメダイン株式会社 | 二液型硬化性組成物、及び製品 |
CN108977135A (zh) * | 2017-05-31 | 2018-12-11 | 比亚迪股份有限公司 | 厌氧胶组合物、厌氧胶及其制备方法 |
TWI839336B (zh) * | 2017-09-28 | 2024-04-21 | 日商三菱化學股份有限公司 | 活性能量射線硬化性剝離型黏著劑組成物 |
WO2019113298A1 (en) * | 2017-12-07 | 2019-06-13 | Henkel IP & Holding GmbH | Two component room temperature curable polyacrylate compositions |
CN109054661A (zh) * | 2018-07-17 | 2018-12-21 | 江苏道明胶粘剂有限公司 | 一种高粘接强度ab双组份型丙烯酸结构胶及制备方法 |
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2019
- 2019-12-13 EP EP19216098.4A patent/EP3835381B1/en active Active
- 2019-12-13 ES ES19216098T patent/ES2940490T3/es active Active
- 2019-12-13 PL PL19216098.4T patent/PL3835381T3/pl unknown
-
2020
- 2020-11-24 CN CN202080085959.3A patent/CN114787305A/zh active Pending
- 2020-11-24 JP JP2022535920A patent/JP2023506807A/ja active Pending
- 2020-11-24 KR KR1020227019801A patent/KR20220117871A/ko unknown
- 2020-11-24 WO PCT/EP2020/083109 patent/WO2021115772A1/en active Application Filing
- 2020-12-11 TW TW109143776A patent/TW202132522A/zh unknown
-
2022
- 2022-06-13 US US17/839,006 patent/US20220389289A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20220389289A1 (en) | 2022-12-08 |
CN114787305A (zh) | 2022-07-22 |
WO2021115772A1 (en) | 2021-06-17 |
ES2940490T3 (es) | 2023-05-08 |
KR20220117871A (ko) | 2022-08-24 |
EP3835381A1 (en) | 2021-06-16 |
EP3835381B1 (en) | 2023-02-08 |
JP2023506807A (ja) | 2023-02-20 |
TW202132522A (zh) | 2021-09-01 |
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