DE3717856A1 - Verfahren zur montage von halbleitergeraeten und einrichtung zu dessen durchfuehrung - Google Patents

Verfahren zur montage von halbleitergeraeten und einrichtung zu dessen durchfuehrung

Info

Publication number
DE3717856A1
DE3717856A1 DE19873717856 DE3717856A DE3717856A1 DE 3717856 A1 DE3717856 A1 DE 3717856A1 DE 19873717856 DE19873717856 DE 19873717856 DE 3717856 A DE3717856 A DE 3717856A DE 3717856 A1 DE3717856 A1 DE 3717856A1
Authority
DE
Germany
Prior art keywords
wire
bond
semiconductor devices
bonding
displacement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873717856
Other languages
German (de)
English (en)
Inventor
Gennadevic Sisov
Aleksandrovic Kalacev
Anatolevic Guljaev
Vitalij Georgievic Melnik
Zinovij Michalevic Slavinskij
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KALACEV
Original Assignee
KALACEV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KALACEV filed Critical KALACEV
Publication of DE3717856A1 publication Critical patent/DE3717856A1/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
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    • H01L2224/78—Apparatus for connecting with wire connectors
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    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
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    • H01L2224/78318—Shape of other portions inside the capillary
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85186—Translational movements connecting first outside the semiconductor or solid-state body, i.e. off-chip, reverse stitch
    • H—ELECTRICITY
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    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
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    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/151—Die mounting substrate
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Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)
DE19873717856 1987-05-26 1987-05-27 Verfahren zur montage von halbleitergeraeten und einrichtung zu dessen durchfuehrung Granted DE3717856A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08712311A GB2205053A (en) 1987-05-26 1987-05-26 Method and arrangement for interconnection of semiconductor devices

Publications (1)

Publication Number Publication Date
DE3717856A1 true DE3717856A1 (de) 1988-12-08

Family

ID=10617902

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873717856 Granted DE3717856A1 (de) 1987-05-26 1987-05-27 Verfahren zur montage von halbleitergeraeten und einrichtung zu dessen durchfuehrung

Country Status (4)

Country Link
CH (1) CH673908A5 (enExample)
DE (1) DE3717856A1 (enExample)
FR (1) FR2618020B1 (enExample)
GB (1) GB2205053A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1464433A1 (de) * 2003-04-04 2004-10-06 Hesse & Knipps GmbH Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung
WO2005118203A1 (de) * 2004-06-01 2005-12-15 Hesse & Knipps Gmbh Verfahren und vorrichtung zur prüfung einer drahtbondverbindung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114473280B (zh) * 2022-02-23 2023-11-24 广西桂芯半导体科技有限公司 一种芯片封装焊线装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2522022A1 (de) * 1974-05-21 1975-12-11 Philips Nv Verfahren zum anbringen einer drahtverbindung an einer halbleiteranordnung
SU740448A1 (ru) * 1978-04-03 1980-06-15 Предприятие П/Я Р-6495 Автоматическа установка дл присоединени проволочных выводов внахлестку
SU821100A1 (ru) * 1979-02-23 1981-04-15 Предприятие П/Я Р-6495 Установка дл присоединени про-ВОлОчНыХ ВыВОдОВ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58192688A (ja) * 1982-04-30 1983-11-10 Chiyouonpa Kogyo Kk ワイヤボンデイング装置におけるワイヤル−プ整形方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2522022A1 (de) * 1974-05-21 1975-12-11 Philips Nv Verfahren zum anbringen einer drahtverbindung an einer halbleiteranordnung
SU740448A1 (ru) * 1978-04-03 1980-06-15 Предприятие П/Я Р-6495 Автоматическа установка дл присоединени проволочных выводов внахлестку
SU821100A1 (ru) * 1979-02-23 1981-04-15 Предприятие П/Я Р-6495 Установка дл присоединени про-ВОлОчНыХ ВыВОдОВ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Prospekt der Firma Kaijo Denki Co. Ltd., Japan Anlage WB-1511, 1977 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1464433A1 (de) * 2003-04-04 2004-10-06 Hesse & Knipps GmbH Verfahren und Vorrichtung zur Prüfung einer Drahtbondverbindung
US7134591B2 (en) 2003-04-04 2006-11-14 Hesse & Knipps Gmbh Method of and apparatus for testing a wire bond connection
WO2005118203A1 (de) * 2004-06-01 2005-12-15 Hesse & Knipps Gmbh Verfahren und vorrichtung zur prüfung einer drahtbondverbindung

Also Published As

Publication number Publication date
FR2618020A1 (fr) 1989-01-13
FR2618020B1 (fr) 1991-04-19
GB2205053A (en) 1988-11-30
GB8712311D0 (en) 1987-07-01
CH673908A5 (enExample) 1990-04-12

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