DE3712569C2 - - Google Patents

Info

Publication number
DE3712569C2
DE3712569C2 DE3712569A DE3712569A DE3712569C2 DE 3712569 C2 DE3712569 C2 DE 3712569C2 DE 3712569 A DE3712569 A DE 3712569A DE 3712569 A DE3712569 A DE 3712569A DE 3712569 C2 DE3712569 C2 DE 3712569C2
Authority
DE
Germany
Prior art keywords
glass composition
powder
filler
sealing
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3712569A
Other languages
German (de)
English (en)
Other versions
DE3712569A1 (de
Inventor
Toshio Otsu Shiga Jp Yamanaka
Fumio Shiga Jp Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Publication of DE3712569A1 publication Critical patent/DE3712569A1/de
Application granted granted Critical
Publication of DE3712569C2 publication Critical patent/DE3712569C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structural Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Glass Compositions (AREA)
  • Compositions Of Oxide Ceramics (AREA)
DE19873712569 1986-04-16 1987-04-14 Abdichtungsglaszusammensetzung mit einem blei-kalzium-titanat-fueller Granted DE3712569A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61087542A JPS62256741A (ja) 1986-04-16 1986-04-16 封着材料

Publications (2)

Publication Number Publication Date
DE3712569A1 DE3712569A1 (de) 1987-10-29
DE3712569C2 true DE3712569C2 (it) 1991-10-31

Family

ID=13917867

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873712569 Granted DE3712569A1 (de) 1986-04-16 1987-04-14 Abdichtungsglaszusammensetzung mit einem blei-kalzium-titanat-fueller

Country Status (4)

Country Link
US (1) US4710479A (it)
JP (1) JPS62256741A (it)
KR (1) KR900000624B1 (it)
DE (1) DE3712569A1 (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251810B1 (en) 1998-07-23 2001-06-26 Schott Glas Composite solder glass, filling material for same and methods of using same

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4883777A (en) * 1988-04-07 1989-11-28 Nippon Electric Glass Company, Limited Sealing glass composition with filler containing Fe and W partially substituted for Ti in PbTiO3 filler
US4983839A (en) * 1989-08-18 1991-01-08 The United States Of America As Represented By The Secretary Of The Army Pyroelectric materials
JP2971502B2 (ja) * 1990-03-27 1999-11-08 旭硝子株式会社 コバール封着用ガラス組成物
US5437808A (en) * 1990-11-15 1995-08-01 Lockheed Corporation Nonflammable mild odor solvent cleaner
EP0539151B1 (en) * 1991-10-24 1996-04-03 Matsushita Electric Industrial Co., Ltd. Dielectric ceramics composite material
US5281561A (en) * 1993-02-09 1994-01-25 Dumesnil Maurice E Low temperature sealing glass composition
US6127005A (en) * 1999-01-08 2000-10-03 Rutgers University Method of thermally glazing an article
US6583079B1 (en) * 1999-02-19 2003-06-24 Nippon Electric Glass Co., Ltd. CRT frit capable of sealing a CRT bulb at a relatively low temperature and in a short time
US6218005B1 (en) 1999-04-01 2001-04-17 3M Innovative Properties Company Tapes for heat sealing substrates
DE10159093C1 (de) * 2001-12-01 2003-08-14 Schott Glas Verfahren zum hermetischen Einglasen einer Lichtleitfaser in eine metallische Durchführungs-Hülse und danach hergestellte hermetische Einglasung
US7518292B2 (en) * 2003-10-14 2009-04-14 Jfe Mineral Company, Ltd. Piezoelectric single crystal and piezoelectric single-crystal device and method for manufacturing the same
CN100345786C (zh) * 2004-07-30 2007-10-31 京东方科技集团股份有限公司 一种低熔点、低膨胀系数焊料玻璃封接粉及其制备方法
JP6409501B2 (ja) * 2014-10-28 2018-10-24 セイコーエプソン株式会社 回路装置及び電子機器
CN114249529B (zh) * 2021-12-06 2024-03-01 北京北旭电子材料有限公司 锂铝硅系填料组合物、锂铝硅系填料及其制备方法、玻璃封接材料及其应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1149303A (en) * 1966-02-04 1969-04-23 Du Pont Dielectric compositions and their use
JPS4924208A (it) * 1972-06-30 1974-03-04
DE2548736C3 (de) * 1975-10-31 1978-05-18 Jenaer Glaswerk Schott & Gen., 6500 Mainz Composit-Passivierungsglas auf der Basis PbO-B2 Okskö-ab O3) m't einem thermischen Ausdehnungskoeffizienten (200-300 Grad C) zwischen 40 und 60 mal 10"7 / Grad C für Silicium-Halbleiterbauelemente mit Aufschmelztemperaturen von höchstens 600 Grad C
JPS5358512A (en) * 1976-11-09 1978-05-26 Asahi Glass Co Ltd Sealant composition
JPS607907B2 (ja) * 1977-07-25 1985-02-27 ソニー株式会社 スイツチングレギユレータ
US4186023A (en) * 1978-05-01 1980-01-29 Technology Glass Corporation Sealing glass composition
US4405722A (en) * 1979-01-23 1983-09-20 Asahi Glass Company Ltd. Sealing glass compositions
US4415898A (en) * 1981-06-26 1983-11-15 The United States Of America As Represented By The Secretary Of The Navy Method of determining the material composition of a dielectrically coated radar target/obstacle
US4365021A (en) * 1981-07-22 1982-12-21 Owens-Illinois, Inc. Low temperature sealant glass

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6251810B1 (en) 1998-07-23 2001-06-26 Schott Glas Composite solder glass, filling material for same and methods of using same

Also Published As

Publication number Publication date
JPH0428658B2 (it) 1992-05-14
DE3712569A1 (de) 1987-10-29
US4710479A (en) 1987-12-01
JPS62256741A (ja) 1987-11-09
KR870009968A (ko) 1987-11-30
KR900000624B1 (ko) 1990-02-01

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee