DE3711255A1 - Anordnung aus led-einheiten - Google Patents

Anordnung aus led-einheiten

Info

Publication number
DE3711255A1
DE3711255A1 DE19873711255 DE3711255A DE3711255A1 DE 3711255 A1 DE3711255 A1 DE 3711255A1 DE 19873711255 DE19873711255 DE 19873711255 DE 3711255 A DE3711255 A DE 3711255A DE 3711255 A1 DE3711255 A1 DE 3711255A1
Authority
DE
Germany
Prior art keywords
group
light
pads
emitting elements
rows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873711255
Other languages
German (de)
English (en)
Inventor
Masashi Fuse
Tsuguo Shirado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of DE3711255A1 publication Critical patent/DE3711255A1/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
DE19873711255 1986-04-04 1987-04-03 Anordnung aus led-einheiten Granted DE3711255A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986050738U JPS62162858U (enExample) 1986-04-04 1986-04-04

Publications (1)

Publication Number Publication Date
DE3711255A1 true DE3711255A1 (de) 1987-10-15

Family

ID=12867178

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873711255 Granted DE3711255A1 (de) 1986-04-04 1987-04-03 Anordnung aus led-einheiten

Country Status (2)

Country Link
JP (1) JPS62162858U (enExample)
DE (1) DE3711255A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2584836Y2 (ja) * 1992-04-14 1998-11-11 セイコーインスツルメンツ株式会社 サーマルヘッド基板
US5814892A (en) * 1996-06-07 1998-09-29 Lsi Logic Corporation Semiconductor die with staggered bond pads

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717800A (en) * 1970-06-18 1973-02-20 Philips Corp Device and base plate for a mosaic of semiconductor elements

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717800A (en) * 1970-06-18 1973-02-20 Philips Corp Device and base plate for a mosaic of semiconductor elements

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP 54-161269. In: Patents Abstr. of JP, Sect. E-172, Vol. 4(1980), Nr. 21 *
JP 55-12791 A. In: Patents Abstr. of JP, Sect. E-4, Vol. 4(1980), Nr. 40 *
JP 56-51851 A. In: Patents Abstr. of JP, Sect. E-66, Vol. 5(1981), Nr. 113 *

Also Published As

Publication number Publication date
JPS62162858U (enExample) 1987-10-16

Similar Documents

Publication Publication Date Title
DE3587443T2 (de) Flüssigkristall-Anzeigebaustein.
DE69118602T2 (de) Halbleitervorrichtung bestehend aus mehreren LED-Chips
DE2752438C2 (de) Träger für eine integrierte Schaltung
DE3012995C2 (de) Anzeigevorrichtung mit matrixartig angeordneten lichtemittierenden Dioden
DE3923633A1 (de) Verfahren zur herstellung eines leuchtdioden-matrixkopfes
EP0878026B1 (de) Leuchtdiodenmatrix
DE69313062T2 (de) Chip-Direktmontage
DE69102834T2 (de) Kettenstruktur für Halbleiterbauelemente.
DE2129808C2 (de) Anzeigevorrichtung, die ein Mosaik von elektrolumineszierenden Halbleiterbausteinen enthält
EP1187209A2 (de) Elektronisches Bauteil mit gestapelten Bausteinen und Verfahren zu seiner Herstellung
DE19732807B4 (de) Integriertes Schaltungsbauelement
DE2641540C2 (de) Lumineszenzdiodenzeile zur Erzeugung eines sehr feinen Rasters von Lichtpunkten
DE3031287A1 (de) Transistor-steuereinheit fuer einen servomotor
DE69210314T2 (de) Zeilenförmiger Bildaufnahmesensor
DE3125259A1 (de) Ausgabeeinrichtung mit thermokopf
DE69203110T2 (de) Vorrichtung zum Verbinden der Kontaktstifte eines in einem dual-in-line (DIL) Gehäuse montierten integrierten Schaltkreises mit gedruckten Schaltungen auf einer Leiterplatte auf n verschiedene Weisen.
WO2020011798A1 (de) Led-anordnung und beleuchtungsvorrichtung
DE3320953C2 (enExample)
DE69300372T2 (de) Baugruppe von elektronischen Bauteilen.
DE3328736A1 (de) Schaltungsplatte
EP0216286A2 (de) Trägerkörper für integrierte Bausteine
DE3021565A1 (de) Flip-flop
DE69006447T2 (de) Kaskaden-Montierung von parallelgeschalteten Transistoren realisiert in Hybridschaltungstechnologie.
DE3436842A1 (de) Traegeraufbau fuer eine elektronische einrichtung
DE69030054T2 (de) Thermo-Kopf

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee