DE3706951C2 - - Google Patents
Info
- Publication number
- DE3706951C2 DE3706951C2 DE3706951A DE3706951A DE3706951C2 DE 3706951 C2 DE3706951 C2 DE 3706951C2 DE 3706951 A DE3706951 A DE 3706951A DE 3706951 A DE3706951 A DE 3706951A DE 3706951 C2 DE3706951 C2 DE 3706951C2
- Authority
- DE
- Germany
- Prior art keywords
- metal film
- ceramic
- thin metal
- heat treatment
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000000919 ceramic Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 16
- 229910010293 ceramic material Inorganic materials 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 11
- 238000001465 metallisation Methods 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 150000007513 acids Chemical class 0.000 claims description 4
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 3
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001603 reducing effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Capacitors (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61049063A JPS62205615A (ja) | 1986-03-05 | 1986-03-05 | セラミツクスの金属化方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3706951A1 DE3706951A1 (de) | 1987-09-10 |
| DE3706951C2 true DE3706951C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-09-05 |
Family
ID=12820624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19873706951 Granted DE3706951A1 (de) | 1986-03-05 | 1987-03-04 | Verfahren zum metallisieren von keramischen materialien |
Country Status (4)
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05166969A (ja) * | 1991-10-14 | 1993-07-02 | Fuji Electric Co Ltd | 半導体装置 |
| US5706999A (en) * | 1995-11-28 | 1998-01-13 | Hughes Electronics | Preparation of a coated metal-matrix composite material |
| US5730853A (en) * | 1996-04-25 | 1998-03-24 | Northrop Grumman Corporation | Method for plating metal matrix composite materials with nickel and gold |
| US7106570B2 (en) * | 1997-04-08 | 2006-09-12 | Xzy Altenuators, Llc | Pathway arrangement |
| US7336467B2 (en) * | 2000-10-17 | 2008-02-26 | X2Y Attenuators, Llc | Energy pathway arrangement |
| US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
| US6603646B2 (en) * | 1997-04-08 | 2003-08-05 | X2Y Attenuators, Llc | Multi-functional energy conditioner |
| US7274549B2 (en) * | 2000-12-15 | 2007-09-25 | X2Y Attenuators, Llc | Energy pathway arrangements for energy conditioning |
| US6894884B2 (en) * | 1997-04-08 | 2005-05-17 | Xzy Attenuators, Llc | Offset pathway arrangements for energy conditioning |
| US7042703B2 (en) * | 2000-03-22 | 2006-05-09 | X2Y Attenuators, Llc | Energy conditioning structure |
| US7110235B2 (en) * | 1997-04-08 | 2006-09-19 | Xzy Altenuators, Llc | Arrangement for energy conditioning |
| US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
| US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US6650525B2 (en) * | 1997-04-08 | 2003-11-18 | X2Y Attenuators, Llc | Component carrier |
| US7110227B2 (en) * | 1997-04-08 | 2006-09-19 | X2Y Attenuators, Llc | Universial energy conditioning interposer with circuit architecture |
| US6018448A (en) | 1997-04-08 | 2000-01-25 | X2Y Attenuators, L.L.C. | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| US6606011B2 (en) * | 1998-04-07 | 2003-08-12 | X2Y Attenuators, Llc | Energy conditioning circuit assembly |
| US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US20030161086A1 (en) | 2000-07-18 | 2003-08-28 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| JP2003526195A (ja) * | 1998-04-07 | 2003-09-02 | エクストゥーワイ、アテニュエイタズ、エル、エル、シー | 部品キャリア |
| US7427816B2 (en) | 1998-04-07 | 2008-09-23 | X2Y Attenuators, Llc | Component carrier |
| US6157528A (en) * | 1999-01-28 | 2000-12-05 | X2Y Attenuators, L.L.C. | Polymer fuse and filter apparatus |
| US7113383B2 (en) * | 2000-04-28 | 2006-09-26 | X2Y Attenuators, Llc | Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| US6922021B2 (en) * | 2000-07-31 | 2005-07-26 | Luxim Corporation | Microwave energized plasma lamp with solid dielectric waveguide |
| US6737809B2 (en) | 2000-07-31 | 2004-05-18 | Luxim Corporation | Plasma lamp with dielectric waveguide |
| US7429818B2 (en) * | 2000-07-31 | 2008-09-30 | Luxim Corporation | Plasma lamp with bulb and lamp chamber |
| JP2004507198A (ja) * | 2000-08-15 | 2004-03-04 | エクストゥーワイ、アテニュエイタズ、エル、エル、シー | 回路のエネルギーを調整するための電極装置 |
| AU2002213356B2 (en) * | 2000-10-17 | 2005-03-10 | X2Y Attenuators, Llc | Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| US7193831B2 (en) * | 2000-10-17 | 2007-03-20 | X2Y Attenuators, Llc | Energy pathway arrangement |
| DE60134493D1 (de) * | 2000-12-12 | 2008-07-31 | Japan Science & Tech Agency | Lenkmechanismus für elektrisches fahrzeug |
| US6809612B2 (en) * | 2002-04-30 | 2004-10-26 | Cts Corporation | Dielectric block signal filters with cost-effective conductive coatings |
| US7180718B2 (en) * | 2003-01-31 | 2007-02-20 | X2Y Attenuators, Llc | Shielded energy conditioner |
| EP1629582A2 (en) | 2003-05-29 | 2006-03-01 | X2Y Attenuators, L.L.C. | Connector related structures including an energy conditioner |
| JP2005022956A (ja) * | 2003-07-02 | 2005-01-27 | Rohm & Haas Electronic Materials Llc | セラミックの金属化 |
| EP1649572A4 (en) | 2003-07-21 | 2012-06-27 | X2Y Attenuators Llc | FILTER ASSEMBLY |
| US7675729B2 (en) | 2003-12-22 | 2010-03-09 | X2Y Attenuators, Llc | Internally shielded energy conditioner |
| JP2008535207A (ja) | 2005-03-01 | 2008-08-28 | エックストゥーワイ アテニュエイターズ，エルエルシー | 共平面導体を有する調整器 |
| WO2006093831A2 (en) | 2005-03-01 | 2006-09-08 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
| WO2006099297A2 (en) | 2005-03-14 | 2006-09-21 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
| US7638951B2 (en) | 2005-10-27 | 2009-12-29 | Luxim Corporation | Plasma lamp with stable feedback amplification and method therefor |
| US7994721B2 (en) * | 2005-10-27 | 2011-08-09 | Luxim Corporation | Plasma lamp and methods using a waveguide body and protruding bulb |
| US7701143B2 (en) * | 2005-10-27 | 2010-04-20 | Luxim Corporation | Plasma lamp with compact waveguide |
| US7791280B2 (en) * | 2005-10-27 | 2010-09-07 | Luxim Corporation | Plasma lamp using a shaped waveguide body |
| US7855511B2 (en) * | 2005-10-27 | 2010-12-21 | Luxim Corporation | Plasma lamp with phase control |
| US8022607B2 (en) * | 2005-10-27 | 2011-09-20 | Luxim Corporation | Plasma lamp with small power coupling surface |
| US7906910B2 (en) * | 2005-10-27 | 2011-03-15 | Luxim Corporation | Plasma lamp with conductive material positioned relative to RF feed |
| US7791278B2 (en) | 2005-10-27 | 2010-09-07 | Luxim Corporation | High brightness plasma lamp |
| WO2007079496A2 (en) * | 2006-01-04 | 2007-07-12 | Luxim Corporation | Plasma lamp with field-concentrating antenna |
| US8026777B2 (en) | 2006-03-07 | 2011-09-27 | X2Y Attenuators, Llc | Energy conditioner structures |
| US20080075816A1 (en) * | 2006-09-21 | 2008-03-27 | Jensen Mark W | Dairy-based product and method and process for producing same |
| EP2087399A4 (en) * | 2006-10-16 | 2010-05-05 | Luxim Corp | MODULATED LIGHT SOURCE SYSTEMS, AND METHODS |
| WO2008048968A2 (en) * | 2006-10-16 | 2008-04-24 | Luxim Corporation | Electrodeless plasma lamp and fill |
| WO2008127367A2 (en) * | 2006-10-16 | 2008-10-23 | Luxim Corporation | Discharge lamp using spread spectrum |
| US20110043111A1 (en) * | 2006-10-16 | 2011-02-24 | Gregg Hollingsworth | Rf feed configurations and assembly for plasma lamp |
| US20100253231A1 (en) * | 2006-10-16 | 2010-10-07 | Devincentis Marc | Electrodeless plasma lamp systems and methods |
| US8143801B2 (en) | 2006-10-20 | 2012-03-27 | Luxim Corporation | Electrodeless lamps and methods |
| US8487543B2 (en) * | 2006-10-20 | 2013-07-16 | Luxim Corporation | Electrodeless lamps and methods |
| US20080211971A1 (en) * | 2007-01-08 | 2008-09-04 | Luxim Corporation | Color balancing systems and methods |
| US8159136B2 (en) * | 2007-02-07 | 2012-04-17 | Luxim Corporation | Frequency tunable resonant cavity for use with an electrodeless plasma lamp |
| US8063565B2 (en) * | 2007-07-23 | 2011-11-22 | Luxim Corporation | Method and apparatus to reduce arcing in electrodeless lamps |
| US8084955B2 (en) * | 2007-07-23 | 2011-12-27 | Luxim Corporation | Systems and methods for improved startup and control of electrodeless plasma lamp using current feedback |
| US20090167201A1 (en) * | 2007-11-07 | 2009-07-02 | Luxim Corporation. | Light source and methods for microscopy and endoscopy |
| EP2340691A4 (en) * | 2008-09-18 | 2015-09-16 | Luxim Corp | ELECTRODELESS LOW FREQUENCY PLASMA LAMP |
| US8319439B2 (en) * | 2008-09-18 | 2012-11-27 | Luxim Corporation | Electrodeless plasma lamp and drive circuit |
| US8304994B2 (en) * | 2008-10-09 | 2012-11-06 | Luxim Corporation | Light collection system for an electrodeless RF plasma lamp |
| US20100123396A1 (en) * | 2008-10-09 | 2010-05-20 | Luxim Corporation | Replaceable lamp bodies for electrodeless plasma lamps |
| US20100102724A1 (en) * | 2008-10-21 | 2010-04-29 | Luxim Corporation | Method of constructing ceramic body electrodeless lamps |
| US20100165306A1 (en) * | 2008-12-31 | 2010-07-01 | Luxmi Corporation | Beam projection systems and methods |
| EP2386110A4 (en) * | 2009-01-06 | 2013-01-23 | Luxim Corp | ELECTRODE-FREE LOW FREQUENCY PLASMA LAMP |
| JP2011014564A (ja) * | 2009-06-30 | 2011-01-20 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法 |
| WO2011075679A1 (en) * | 2009-12-18 | 2011-06-23 | Luxim Corporation | Plasma lamp having tunable frequency dielectric waveguide with stabilized permittivity |
| CN103340018A (zh) | 2010-09-30 | 2013-10-02 | 勒克西姆公司 | 带有集总器件的等离子灯 |
| CN112341250B (zh) * | 2020-10-16 | 2021-07-27 | 麦德美科技（苏州）有限公司 | 氧化锆陶瓷的金属化工艺 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1129246A (fr) * | 1955-07-26 | 1957-01-17 | Cie Generale Electro Ceramique | Perfectionnement aux métallisations d'objets non conducteurs |
| US3212917A (en) * | 1962-01-03 | 1965-10-19 | Ibm | Electroless plating procedure |
| FR1413507A (fr) * | 1963-11-04 | 1965-10-08 | Thomson Houston Comp Francaise | Perfectionnements aux supports métallisés de semiconducteurs |
| US3690921A (en) * | 1970-12-07 | 1972-09-12 | Ibm | Method for strongly adhering a metal film on ceramic substrates |
| DE2533524C3 (de) * | 1975-07-26 | 1978-05-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung eines Belages aus Kupfer oder einer Kupferlegierung auf einem Trägerkörper |
| US4066809A (en) * | 1976-06-28 | 1978-01-03 | International Business Machines Corporation | Method for preparing substrate surfaces for electroless deposition |
| JPS5399453A (en) * | 1977-02-09 | 1978-08-30 | Matsushita Electric Ind Co Ltd | Method of porcelain electronic part |
| JPS53130714A (en) * | 1977-04-20 | 1978-11-15 | Kogyo Gijutsuin | Method of bonding nitride base ceramics and silver |
| JPS5499963A (en) * | 1978-01-23 | 1979-08-07 | Murata Manufacturing Co | Method of producing ceramic electronic components |
| JPS5810880B2 (ja) * | 1979-08-30 | 1983-02-28 | 株式会社村田製作所 | 銅被膜の密着性向上方法 |
| US4402494A (en) * | 1980-10-08 | 1983-09-06 | Murata Manufacturing Co., Ltd. | Process of heat treating copper film on ceramic body and heat treating apparatus therefor |
| DE3134918A1 (de) * | 1981-09-03 | 1983-03-17 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben" |
| US4464422A (en) * | 1982-11-09 | 1984-08-07 | Murata Manufacturing Co., Ltd. | Process for preventing oxidation of copper film on ceramic body |
| JPS59222901A (ja) * | 1983-06-01 | 1984-12-14 | 株式会社村田製作所 | セラミツク電子部品の製造方法 |
| US4448804A (en) * | 1983-10-11 | 1984-05-15 | International Business Machines Corporation | Method for selective electroless plating of copper onto a non-conductive substrate surface |
| US4552787A (en) * | 1984-02-29 | 1985-11-12 | International Business Machines Corporation | Deposition of a metal from an electroless plating composition |
| DE3435807A1 (de) * | 1984-09-28 | 1986-04-10 | Siemens AG, 1000 Berlin und 8000 München | Haft- und bondfaehige metallisierung auf keramik fuer piezowandler |
-
1986
- 1986-03-05 JP JP61049063A patent/JPS62205615A/ja active Granted
-
1987
- 1987-02-25 US US07/018,591 patent/US4795658A/en not_active Expired - Lifetime
- 1987-03-04 DE DE19873706951 patent/DE3706951A1/de active Granted
- 1987-03-05 FR FR8702998A patent/FR2595349B1/fr not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE3706951A1 (de) | 1987-09-10 |
| FR2595349A1 (fr) | 1987-09-11 |
| US4795658A (en) | 1989-01-03 |
| JPS62205615A (ja) | 1987-09-10 |
| JPH0482043B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-12-25 |
| FR2595349B1 (fr) | 1992-10-30 |
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