DE3701652A1 - Ueberwachung von bondparametern waehrend des bondvorganges - Google Patents

Ueberwachung von bondparametern waehrend des bondvorganges

Info

Publication number
DE3701652A1
DE3701652A1 DE19873701652 DE3701652A DE3701652A1 DE 3701652 A1 DE3701652 A1 DE 3701652A1 DE 19873701652 DE19873701652 DE 19873701652 DE 3701652 A DE3701652 A DE 3701652A DE 3701652 A1 DE3701652 A1 DE 3701652A1
Authority
DE
Germany
Prior art keywords
bonding
amplitude
arm
monitoring
ultrasound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19873701652
Other languages
German (de)
English (en)
Other versions
DE3701652C2 (https=
Inventor
Klaus-Ulrich Von Dr Phil Raben
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6319221&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3701652(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19873701652 priority Critical patent/DE3701652A1/de
Priority to US07/140,122 priority patent/US4854494A/en
Priority to DE3851900T priority patent/DE3851900D1/de
Priority to EP88100121A priority patent/EP0275877B1/de
Priority to AT88100121T priority patent/ATE113225T1/de
Priority to JP63007388A priority patent/JPS63191927A/ja
Publication of DE3701652A1 publication Critical patent/DE3701652A1/de
Application granted granted Critical
Publication of DE3701652C2 publication Critical patent/DE3701652C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/922—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/9221—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force or the mechanical power
    • B29C66/92211—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force, the mechanical power or the displacement of the joining tools by measuring the pressure, the force or the mechanical power with special measurement means or methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
    • B29C66/951—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools
    • B29C66/9515—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools by measuring their vibration amplitude
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
    • B29C66/961—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving a feedback loop mechanism, e.g. comparison with a desired value
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
    • B29C66/944—Measuring or controlling the joining process by measuring or controlling the time by controlling or regulating the time
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
    • B29C66/951—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools
    • B29C66/9513—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools characterised by specific vibration frequency values or ranges
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Pretreatment Of Seeds And Plants (AREA)
  • Die Bonding (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
DE19873701652 1987-01-21 1987-01-21 Ueberwachung von bondparametern waehrend des bondvorganges Granted DE3701652A1 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DE19873701652 DE3701652A1 (de) 1987-01-21 1987-01-21 Ueberwachung von bondparametern waehrend des bondvorganges
US07/140,122 US4854494A (en) 1987-01-21 1987-12-31 Monitoring bond parameters during the bonding process
DE3851900T DE3851900D1 (de) 1987-01-21 1988-01-07 Überwachung von Bondparametern während des Bondvorganges.
EP88100121A EP0275877B1 (de) 1987-01-21 1988-01-07 Überwachung von Bondparametern während des Bondvorganges
AT88100121T ATE113225T1 (de) 1987-01-21 1988-01-07 Überwachung von bondparametern während des bondvorganges.
JP63007388A JPS63191927A (ja) 1987-01-21 1988-01-14 ボンデイング工程中のボンデイングパラメータ監視装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873701652 DE3701652A1 (de) 1987-01-21 1987-01-21 Ueberwachung von bondparametern waehrend des bondvorganges

Publications (2)

Publication Number Publication Date
DE3701652A1 true DE3701652A1 (de) 1988-08-04
DE3701652C2 DE3701652C2 (https=) 1992-06-17

Family

ID=6319221

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19873701652 Granted DE3701652A1 (de) 1987-01-21 1987-01-21 Ueberwachung von bondparametern waehrend des bondvorganges
DE3851900T Expired - Fee Related DE3851900D1 (de) 1987-01-21 1988-01-07 Überwachung von Bondparametern während des Bondvorganges.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE3851900T Expired - Fee Related DE3851900D1 (de) 1987-01-21 1988-01-07 Überwachung von Bondparametern während des Bondvorganges.

Country Status (5)

Country Link
US (1) US4854494A (https=)
EP (1) EP0275877B1 (https=)
JP (1) JPS63191927A (https=)
AT (1) ATE113225T1 (https=)
DE (2) DE3701652A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4443716A1 (de) * 1994-12-09 1996-06-13 Hottinger Messtechnik Baldwin Kraftmeßvorrichtung zur Messung der Zugspannung von Fäden, Bändern oder dergleichen sowie Federblatt und Verfahren zur Herstellung eines Federblatts
DE4447073C1 (de) * 1994-12-29 1996-07-18 Bosch Gmbh Robert Verfahren zum Prüfen von durch Ultraschalldrahtbonden hergestellten Verbindungen
WO2001078482A1 (de) * 2000-04-05 2001-10-18 Siemens Production And Logistics Systems Ag Bestückvorrichtung mit einer einrichtung zum messen der aufsetzkraft
DE19709912B4 (de) * 1996-03-11 2004-04-08 National Semiconductor Corp.(N.D.Ges.D.Staates Delaware), Santa Clara Ultraschallbondvorrichtung
WO2005116593A1 (de) * 2004-05-28 2005-12-08 Schunk Ultraschalltechnik Gmbh Verfahren zum messen und/oder regeln der schwingungsamplitude eines ultraschallschwingers sowie ultraschallschweissvorrichtung
US8020746B2 (en) 2006-09-05 2011-09-20 Technische Universitaet Berlin Method and device for controlling the generation of ultrasonic wire bonds

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JPH088271B2 (ja) * 1988-11-01 1996-01-29 株式会社新川 ワイヤボンデイング装置
JP2708222B2 (ja) * 1989-03-31 1998-02-04 株式会社東芝 ボンディング装置
JPH0353137A (ja) * 1989-07-20 1991-03-07 Yakichi Higo 応力測定法
US5065933A (en) * 1990-09-19 1991-11-19 At&T Bell Laboratories Electronic device manipulating apparatus and method
ATE117611T1 (de) * 1991-02-15 1995-02-15 Esec Sa Verfahren und einrichtung zur messung der schwingungsamplitude an einem energietransducer.
JP2665080B2 (ja) * 1991-08-02 1997-10-22 山形日本電気株式会社 半導体製造装置
JPH0547860A (ja) * 1991-08-08 1993-02-26 Shinkawa Ltd ワイヤボンデイング方法
JP3128702B2 (ja) * 1991-09-11 2001-01-29 株式会社新川 ボンデイング装置のデータ設定モード変更方法及び装置
DE4131565C2 (de) * 1991-09-18 2002-04-25 Bleich Karl Heinz Verfahren zur Optimierung des Schweißprozesses bei Bondverfahren
US5186378A (en) * 1991-09-30 1993-02-16 Texas Instruments Incorporated Method and apparatus for transducer heating in low temperature bonding
US5201453A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Linear, direct-drive microelectronic bonding apparatus and method
US5244140A (en) * 1991-09-30 1993-09-14 Texas Instruments Incorporated Ultrasonic bonding process beyond 125 khz
US5201454A (en) * 1991-09-30 1993-04-13 Texas Instruments Incorporated Process for enhanced intermetallic growth in IC interconnections
ATE147672T1 (de) * 1991-10-30 1997-02-15 F&K Delvotec Bondtechnik Gmbh Steuerungssystem
JP2981948B2 (ja) * 1992-03-12 1999-11-22 株式会社新川 ワイヤクランパ
US5170929A (en) * 1992-05-29 1992-12-15 International Business Machines Corporation Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means
US5230458A (en) * 1992-06-23 1993-07-27 National Semiconductor Corp. Interconnect formation utilizing real-time feedback
JPH06331678A (ja) * 1993-05-13 1994-12-02 Internatl Business Mach Corp <Ibm> 電子部品のリード接続を検査する方法および装置
DE4335108C1 (de) * 1993-10-14 1995-01-05 Schunk Ultraschalltechnik Gmbh Verfahren und Vorrichtung zum Kompaktieren und anschließenden Schweißen von elektrischen Leitern
US5578888A (en) * 1994-12-05 1996-11-26 Kulicke And Soffa Investments, Inc. Multi resonance unibody ultrasonic transducer
US5608172A (en) * 1995-03-16 1997-03-04 Texas Instruments Incorporated Die bond touch down detector
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
EP0857535B1 (en) * 1997-02-06 2003-06-25 F &amp; K Delvotec Bondtechnik GmbH Bonding head for a wire bonding machine
DE19753740C1 (de) 1997-12-04 1999-07-15 Herrmann Ultraschalltechnik Vorrichtung zum Bearbeiten einer Materialbahn
US20020117012A1 (en) * 1999-03-29 2002-08-29 Lec Ryszard Marian Torque measuring piezoelectric device and method
DE19917372B4 (de) * 1999-04-16 2009-01-02 Prüftechnik Dieter Busch AG Meßgerät zum Erfassen der Temperatur und der Schwingungen einer Oberfläche
US6190497B1 (en) 1999-04-23 2001-02-20 The Hong Kong Polytechnic University Ultrasonic transducer
SG83815A1 (en) * 1999-09-23 2001-10-16 Esec Trading Sa Ultrasonic wire bonder with a sensor for the control of the bond force
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US6827247B1 (en) * 1999-12-08 2004-12-07 Asm Technology Singapore Pte Ltd. Apparatus for detecting the oscillation amplitude of an oscillating object
US6279810B1 (en) * 2000-02-23 2001-08-28 Asm Assembly Automation Ltd Piezoelectric sensor for measuring bonding parameters
US6286747B1 (en) 2000-03-24 2001-09-11 Hong Kong Polytechnic University Ultrasonic transducer
JP2002368036A (ja) * 2001-06-11 2002-12-20 Nec Kyushu Ltd ワイアボンディング装置
US6644533B2 (en) 2001-07-03 2003-11-11 Asm Technology Singapore Pte. Ltd. Force sensing apparatus
DE50110953D1 (de) 2001-11-07 2006-10-19 F & K Delvotec Bondtech Gmbh Prüfverfahren für Bondverbindungen und Drahtbonder
DE10160228A1 (de) * 2001-12-07 2003-06-18 Hesse & Knipps Gmbh Kreuztransducer
KR20030066344A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
JP2004047944A (ja) * 2002-05-22 2004-02-12 Nec Corp 接合装置および接合の良否判別方法を有する接合方法
EP1447204A1 (de) * 2003-02-12 2004-08-18 Telsonic Holding AG Vorrichtung und Verfahren zum Bearbeiten von Bauteilen
DE10314499B4 (de) * 2003-03-27 2005-03-10 Angewandte Physik Mbh Ges Vorrichtung zum Drahtbonden
DE102004045575A1 (de) 2004-09-17 2006-04-06 Hesse & Knipps Gmbh Ultraschalltransducer mit einem in der Lagerung angeordneten Sensor
DE102005044048B4 (de) 2004-09-30 2007-05-03 Unaxis International Trading Ltd. Wire Bonder
US7958790B2 (en) * 2005-09-29 2011-06-14 Cornell Research Foundation, Inc. Biaxial load cell with highly anisotropic force resolutions
US7819013B2 (en) * 2006-07-05 2010-10-26 The Hong Kong Polytechnic University Method and apparatus for measuring oscillation amplitude of an ultrasonic device
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置
DE102006049624B4 (de) * 2006-10-20 2016-07-14 Hesse Gmbh Ultraschallbonder
US7698926B2 (en) * 2007-04-26 2010-04-20 Honeywell International Inc. Electrical connection of energy harvesting devices
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
CH700729B1 (de) * 2008-02-29 2010-10-15 Oerlikon Assembly Equipment Ag Wire Bonder.
KR100996264B1 (ko) * 2008-04-25 2010-11-23 에스티에스반도체통신 주식회사 광폭 리드 프레임을 위한 반도체 패키지 제조 장치 및 이를이용한 반도체 패키지 제조 방법
KR100967526B1 (ko) * 2008-04-25 2010-07-05 에스티에스반도체통신 주식회사 광폭 리드 프레임을 위한 반도체 패키지 제조 장치 및 이를이용한 반도체 패키지 제조 방법
US8056792B2 (en) * 2009-05-05 2011-11-15 Branson Ultrasonics Corporation Scalloped horn
IL247408B (en) 2016-08-21 2018-03-29 Elbit Systems Ltd A system and method for identifying weaknesses in the adhesion between structural elements
DE102017101736A1 (de) 2017-01-30 2018-08-02 F&K Delvotec Bondtechnik Gmbh Verfahren zur Herstellung von Drahtbondverbindungen und Anordnung zur Durchführung des Verfahrens
JP7794821B2 (ja) * 2020-11-05 2026-01-06 クリック アンド ソッファ インダストリーズ、インク． ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法
EP4001913A1 (en) 2020-11-17 2022-05-25 Mobile Locker NV Storage device with integrated substance detection system
JP2025122515A (ja) * 2024-02-08 2025-08-21 株式会社東芝 ワイヤボンディング装置、制御装置、及び制御方法

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WO2001078482A1 (de) * 2000-04-05 2001-10-18 Siemens Production And Logistics Systems Ag Bestückvorrichtung mit einer einrichtung zum messen der aufsetzkraft
WO2005116593A1 (de) * 2004-05-28 2005-12-08 Schunk Ultraschalltechnik Gmbh Verfahren zum messen und/oder regeln der schwingungsamplitude eines ultraschallschwingers sowie ultraschallschweissvorrichtung
US8020746B2 (en) 2006-09-05 2011-09-20 Technische Universitaet Berlin Method and device for controlling the generation of ultrasonic wire bonds

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JPS63191927A (ja) 1988-08-09
EP0275877A2 (de) 1988-07-27
EP0275877B1 (de) 1994-10-26
ATE113225T1 (de) 1994-11-15
DE3701652C2 (https=) 1992-06-17
EP0275877A3 (de) 1991-03-06
DE3851900D1 (de) 1994-12-01
JPH0552064B2 (https=) 1993-08-04
US4854494A (en) 1989-08-08

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