DE3686923T2 - Verfahren zur sichtbarkeitsverbesserung von ausrichtmarkierungen erster ordnung. - Google Patents

Verfahren zur sichtbarkeitsverbesserung von ausrichtmarkierungen erster ordnung.

Info

Publication number
DE3686923T2
DE3686923T2 DE8686109503T DE3686923T DE3686923T2 DE 3686923 T2 DE3686923 T2 DE 3686923T2 DE 8686109503 T DE8686109503 T DE 8686109503T DE 3686923 T DE3686923 T DE 3686923T DE 3686923 T2 DE3686923 T2 DE 3686923T2
Authority
DE
Germany
Prior art keywords
improving visibility
alignment markings
order alignment
order
markings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686109503T
Other languages
English (en)
Other versions
DE3686923D1 (de
Inventor
Donald George Chesebro
Robert Wayne Sweetser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3686923D1 publication Critical patent/DE3686923D1/de
Publication of DE3686923T2 publication Critical patent/DE3686923T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/975—Substrate or mask aligning feature

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE8686109503T 1985-08-19 1986-07-11 Verfahren zur sichtbarkeitsverbesserung von ausrichtmarkierungen erster ordnung. Expired - Fee Related DE3686923T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/767,316 US4632724A (en) 1985-08-19 1985-08-19 Visibility enhancement of first order alignment marks

Publications (2)

Publication Number Publication Date
DE3686923D1 DE3686923D1 (de) 1992-11-12
DE3686923T2 true DE3686923T2 (de) 1993-04-22

Family

ID=25079116

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686109503T Expired - Fee Related DE3686923T2 (de) 1985-08-19 1986-07-11 Verfahren zur sichtbarkeitsverbesserung von ausrichtmarkierungen erster ordnung.

Country Status (4)

Country Link
US (1) US4632724A (de)
EP (1) EP0212219B1 (de)
JP (1) JPH07118441B2 (de)
DE (1) DE3686923T2 (de)

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DE3788470T2 (de) * 1986-08-08 1994-06-09 Philips Nv Verfahren zur Herstellung eines Feldeffekttransistors mit isoliertem Gate.
DE69118031T2 (de) * 1990-06-29 1996-09-05 Canon Kk Verfahren zum Herstellen einer Halbleiteranordnung mit einer Ausrichtungsmarke
JPH05159221A (ja) * 1991-12-02 1993-06-25 Fujitsu Ltd 薄膜ヘッドおよびその製造方法
US5470693A (en) * 1992-02-18 1995-11-28 International Business Machines Corporation Method of forming patterned polyimide films
US5300797A (en) * 1992-03-31 1994-04-05 Sgs-Thomson Microelectronics, Inc. Coplanar twin-well integrated circuit structure
US5401691A (en) * 1994-07-01 1995-03-28 Cypress Semiconductor Corporation Method of fabrication an inverse open frame alignment mark
US5952247A (en) * 1994-11-23 1999-09-14 Intel Corporation Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate
US5976980A (en) * 1994-11-23 1999-11-02 Intel Corporation Method and apparatus providing a mechanical probe structure in an integrated circuit die
US6153891A (en) * 1994-11-23 2000-11-28 Intel Corporation Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die
US6020746A (en) * 1994-11-23 2000-02-01 Intel Corporation Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die
US5700732A (en) 1996-08-02 1997-12-23 Micron Technology, Inc. Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
US5783490A (en) * 1997-04-21 1998-07-21 Vanguard International Semiconductor Corporation Photolithography alignment mark and manufacturing method
US6309897B1 (en) 1997-09-30 2001-10-30 Intel Corporation Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die
US5904486A (en) * 1997-09-30 1999-05-18 Intel Corporation Method for performing a circuit edit through the back side of an integrated circuit die
US6008060A (en) * 1998-04-14 1999-12-28 Etec Systems, Inc. Detecting registration marks with a low energy electron beam
US6159754A (en) * 1998-05-07 2000-12-12 Intel Corporation Method of making a circuit edit interconnect structure through the backside of an integrated circuit die
JPH11329923A (ja) 1998-05-11 1999-11-30 Sony Corp 半導体装置の製造方法
US6241847B1 (en) 1998-06-30 2001-06-05 Lsi Logic Corporation Method and apparatus for detecting a polishing endpoint based upon infrared signals
US6071818A (en) 1998-06-30 2000-06-06 Lsi Logic Corporation Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material
US6077783A (en) * 1998-06-30 2000-06-20 Lsi Logic Corporation Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer
US6268224B1 (en) 1998-06-30 2001-07-31 Lsi Logic Corporation Method and apparatus for detecting an ion-implanted polishing endpoint layer within a semiconductor wafer
US6074517A (en) * 1998-07-08 2000-06-13 Lsi Logic Corporation Method and apparatus for detecting an endpoint polishing layer by transmitting infrared light signals through a semiconductor wafer
US6285035B1 (en) 1998-07-08 2001-09-04 Lsi Logic Corporation Apparatus for detecting an endpoint polishing layer of a semiconductor wafer having a wafer carrier with independent concentric sub-carriers and associated method
US6080670A (en) * 1998-08-10 2000-06-27 Lsi Logic Corporation Method of detecting a polishing endpoint layer of a semiconductor wafer which includes a non-reactive reporting specie
US6201253B1 (en) 1998-10-22 2001-03-13 Lsi Logic Corporation Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system
US6121147A (en) * 1998-12-11 2000-09-19 Lsi Logic Corporation Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance
US6288773B2 (en) 1998-12-11 2001-09-11 Lsi Logic Corporation Method and apparatus for removing residual material from an alignment mark of a semiconductor wafer
US6117779A (en) * 1998-12-15 2000-09-12 Lsi Logic Corporation Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint
JP3288320B2 (ja) * 1998-12-21 2002-06-04 沖電気工業株式会社 レジストマーク
DE19904571C1 (de) * 1999-02-04 2000-04-20 Siemens Ag Verfahren zur Herstellung einer integrierten Schaltungsanordnung aus zwei Substraten, wobei die Schaltungsstrukturen des Substrate exakt gegeneinander ausgerichtet sind
US6303459B1 (en) * 1999-11-15 2001-10-16 Taiwan Semiconductor Manufacturing Company Integration process for Al pad
US7751609B1 (en) 2000-04-20 2010-07-06 Lsi Logic Corporation Determination of film thickness during chemical mechanical polishing
US6492269B1 (en) 2001-01-08 2002-12-10 Taiwan Semiconductor Manufacturing Company Methods for edge alignment mark protection during damascene electrochemical plating of copper
US6693365B2 (en) * 2002-02-23 2004-02-17 Taiwan Semiconductor Manufacturing Co., Ltd. Local electrochemical deplating of alignment mark regions of semiconductor wafers
US6692995B2 (en) 2002-04-05 2004-02-17 Intel Corporation Physically deposited layer to electrically connect circuit edit connection targets
US6596604B1 (en) 2002-07-22 2003-07-22 Atmel Corporation Method of preventing shift of alignment marks during rapid thermal processing
JP2006106263A (ja) * 2004-10-04 2006-04-20 Fujinon Sano Kk 光学素子の製造方法
US20080191310A1 (en) * 2007-02-12 2008-08-14 Weng-Jin Wu By-product removal for wafer bonding process
JP2008288430A (ja) * 2007-05-18 2008-11-27 Toshiba Corp 半導体装置の製造方法
US9472506B2 (en) 2015-02-25 2016-10-18 International Business Machines Corporation Registration mark formation during sidewall image transfer process
US11244907B2 (en) 2020-01-02 2022-02-08 International Business Machines Corporation Metal surface preparation for increased alignment contrast

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3802940A (en) * 1969-08-18 1974-04-09 Computervision Corp Enhanced contrast semiconductor wafer alignment target and method for making same
JPS51147179A (en) * 1975-06-12 1976-12-17 Fujitsu Ltd Method of munufacturing of semiconductor device
GB1520925A (en) * 1975-10-06 1978-08-09 Mullard Ltd Semiconductor device manufacture
JPS5534442A (en) * 1978-08-31 1980-03-11 Fujitsu Ltd Preparation of semiconductor device
US4374915A (en) * 1981-07-30 1983-02-22 Intel Corporation High contrast alignment marker for integrated circuit fabrication
JPS60149130A (ja) * 1984-01-17 1985-08-06 Hitachi Ltd パターン検出方法およびそれに用いる反射防止膜用材料
US4487653A (en) * 1984-03-19 1984-12-11 Advanced Micro Devices, Inc. Process for forming and locating buried layers

Also Published As

Publication number Publication date
EP0212219A2 (de) 1987-03-04
EP0212219B1 (de) 1992-10-07
US4632724A (en) 1986-12-30
JPS6245028A (ja) 1987-02-27
DE3686923D1 (de) 1992-11-12
EP0212219A3 (en) 1989-10-25
JPH07118441B2 (ja) 1995-12-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee