DE3672171D1 - Verfahren zur herstellung von elektronischen modulen fuer karten mit mikroschaltungen und derartig hergestellte module. - Google Patents

Verfahren zur herstellung von elektronischen modulen fuer karten mit mikroschaltungen und derartig hergestellte module.

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Publication number
DE3672171D1
DE3672171D1 DE8686104178T DE3672171T DE3672171D1 DE 3672171 D1 DE3672171 D1 DE 3672171D1 DE 8686104178 T DE8686104178 T DE 8686104178T DE 3672171 T DE3672171 T DE 3672171T DE 3672171 D1 DE3672171 D1 DE 3672171D1
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DE
Germany
Prior art keywords
modules
pellet
hollow
tongues
grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686104178T
Other languages
English (en)
Inventor
Jean-Marcel Stampfli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebauchesfabrik ETA AG
Original Assignee
Ebauchesfabrik ETA AG
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE8686104178T 1985-04-02 1986-03-26 Verfahren zur herstellung von elektronischen modulen fuer karten mit mikroschaltungen und derartig hergestellte module. Expired - Lifetime DE3672171D1 (de)

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FR8505109A FR2579798B1 (fr) 1985-04-02 1985-04-02 Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede

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DE3672171D1 true DE3672171D1 (de) 1990-07-26

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US (1) US4674175A (de)
EP (1) EP0197438B2 (de)
JP (1) JPS61232629A (de)
AT (1) ATE54030T1 (de)
DE (1) DE3672171D1 (de)
FR (1) FR2579798B1 (de)
HK (1) HK93993A (de)

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Also Published As

Publication number Publication date
EP0197438B2 (de) 1995-08-23
HK93993A (en) 1993-09-17
US4674175A (en) 1987-06-23
EP0197438A1 (de) 1986-10-15
JPH0260227B2 (de) 1990-12-14
JPS61232629A (ja) 1986-10-16
FR2579798B1 (fr) 1990-09-28
EP0197438B1 (de) 1990-06-20
ATE54030T1 (de) 1990-07-15
FR2579798A1 (fr) 1986-10-03

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