DE3641353C2 - - Google Patents

Info

Publication number
DE3641353C2
DE3641353C2 DE3641353A DE3641353A DE3641353C2 DE 3641353 C2 DE3641353 C2 DE 3641353C2 DE 3641353 A DE3641353 A DE 3641353A DE 3641353 A DE3641353 A DE 3641353A DE 3641353 C2 DE3641353 C2 DE 3641353C2
Authority
DE
Germany
Prior art keywords
carrier plate
conductor
conductor tracks
connections
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3641353A
Other languages
German (de)
English (en)
Other versions
DE3641353A1 (de
Inventor
Heinz 8554 Graefenberg De Burgeth
Winfried 6000 Frankfurt De Hormes
Guenter Dipl.-Ing. 8758 Goldbach De Tessendorf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schoeller and Co Elektrotecnische Fabrik GmbH and Co
Original Assignee
Schoeller and Co Elektrotecnische Fabrik GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schoeller and Co Elektrotecnische Fabrik GmbH and Co filed Critical Schoeller and Co Elektrotecnische Fabrik GmbH and Co
Priority to DE19863641353 priority Critical patent/DE3641353A1/de
Publication of DE3641353A1 publication Critical patent/DE3641353A1/de
Application granted granted Critical
Publication of DE3641353C2 publication Critical patent/DE3641353C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
DE19863641353 1986-12-03 1986-12-03 Einrichtung zur kontaktierung von anschluessen Granted DE3641353A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19863641353 DE3641353A1 (de) 1986-12-03 1986-12-03 Einrichtung zur kontaktierung von anschluessen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863641353 DE3641353A1 (de) 1986-12-03 1986-12-03 Einrichtung zur kontaktierung von anschluessen

Publications (2)

Publication Number Publication Date
DE3641353A1 DE3641353A1 (de) 1988-06-09
DE3641353C2 true DE3641353C2 (OSRAM) 1989-06-08

Family

ID=6315408

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863641353 Granted DE3641353A1 (de) 1986-12-03 1986-12-03 Einrichtung zur kontaktierung von anschluessen

Country Status (1)

Country Link
DE (1) DE3641353A1 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19732223A1 (de) * 1997-07-26 1999-02-11 Kiekert Ag Funktionsintegrationsmodul mit einem Aggregateträger für elektrische Verbraucher, insbesondere Türaggregateträger für Kraftfahrzeugtüren
DE19900999C2 (de) * 1999-01-13 2000-09-07 Moritz Production Innovation I Tastatur und Verfahren zur Herstellung derselben

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19735170A1 (de) * 1997-08-13 1998-09-10 Siemens Ag Chipmodul, insbesondere für kontaktbehaftete Chipkarten, mit nebeneinander angeordneten Chips
DE19739591A1 (de) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem
DE19833131C2 (de) * 1998-07-23 2003-08-07 Infineon Technologies Ag Anordnung zur Kontaktierung von elektronischen Bauelementen auf flexiblen Substraten
DE102006021095B4 (de) * 2006-05-05 2008-09-04 Continental Automotive Gmbh Leiterbahnträgervorrichtung
DE102011013449B4 (de) * 2011-03-09 2013-12-05 Continental Automotive Gmbh Baugruppe mit einem Träger, einem SMD-Bauteil und einem Stanzgitterteil

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8429026U1 (de) * 1985-02-07 Schoeller & Co Elektrotechnische Fabrik Gmbh & Co, 6000 Frankfurt Anzeigeeinrichtung
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3631297A (en) * 1969-02-12 1971-12-28 Dynalectron Corp Antivibration mounting for circuit boards
JPS5024770A (OSRAM) * 1973-07-05 1975-03-17
NL7812296A (nl) * 1978-01-25 1979-07-27 Brady Co W H Verlichting voor flexibele tastschakelaars.
DE2912202B1 (de) * 1979-03-28 1980-10-02 Metz App Werke Inh Paul Metz Anordnung einer integrierten Schaltung auf einer Leiterplatte
US4412272A (en) * 1981-08-31 1983-10-25 General Dynamics, Pomona Division Flexible printed circuit card assembly
DE3326968A1 (de) * 1982-06-12 1985-02-14 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen Traegerbauteil aus thermoplastischem material mit durch heisspraegen aufgebrachten metallischen leitern
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19732223A1 (de) * 1997-07-26 1999-02-11 Kiekert Ag Funktionsintegrationsmodul mit einem Aggregateträger für elektrische Verbraucher, insbesondere Türaggregateträger für Kraftfahrzeugtüren
DE19732223B4 (de) * 1997-07-26 2004-07-15 Kiekert Ag Aggregateträger für elektrische Verbraucher, insbesondere Türaggregateträger für Kraftfahrzeugtüren
DE19900999C2 (de) * 1999-01-13 2000-09-07 Moritz Production Innovation I Tastatur und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
DE3641353A1 (de) 1988-06-09

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee