DE3608410A1 - Herstellung von feinstrukturen fuer die halbleiterkontaktierung - Google Patents
Herstellung von feinstrukturen fuer die halbleiterkontaktierungInfo
- Publication number
- DE3608410A1 DE3608410A1 DE19863608410 DE3608410A DE3608410A1 DE 3608410 A1 DE3608410 A1 DE 3608410A1 DE 19863608410 DE19863608410 DE 19863608410 DE 3608410 A DE3608410 A DE 3608410A DE 3608410 A1 DE3608410 A1 DE 3608410A1
- Authority
- DE
- Germany
- Prior art keywords
- plastic
- tape
- production
- fine structures
- openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000004065 semiconductor Substances 0.000 title claims abstract description 7
- 239000004033 plastic Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims description 7
- 239000003973 paint Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000002650 laminated plastic Substances 0.000 claims 2
- 239000004744 fabric Substances 0.000 claims 1
- 238000000608 laser ablation Methods 0.000 claims 1
- 239000003351 stiffener Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 241000239290 Araneae Species 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000002910 structure generation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19863608410 DE3608410A1 (de) | 1986-03-13 | 1986-03-13 | Herstellung von feinstrukturen fuer die halbleiterkontaktierung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19863608410 DE3608410A1 (de) | 1986-03-13 | 1986-03-13 | Herstellung von feinstrukturen fuer die halbleiterkontaktierung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3608410A1 true DE3608410A1 (de) | 1987-09-17 |
| DE3608410C2 DE3608410C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-10-10 |
Family
ID=6296268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19863608410 Granted DE3608410A1 (de) | 1986-03-13 | 1986-03-13 | Herstellung von feinstrukturen fuer die halbleiterkontaktierung |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3608410A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3834361A1 (de) * | 1988-10-10 | 1990-04-12 | Lsi Logic Products Gmbh | Anschlussrahmen fuer eine vielzahl von anschluessen |
| DE4000372A1 (de) * | 1990-01-09 | 1991-07-11 | Aei Gmbh | Verfahren zur erstellung einer leiterstruktur auf einem platten- oder folienfoermigen, isolierenden traeger |
| FR2657219A1 (fr) * | 1990-01-11 | 1991-07-19 | Gim Ind Sa | Procede de fabrication de circuits imprimes souples, circuit imprime fabrique par ce procede, et dispositif pour la mise en óoeuvre de ce procede. |
| EP0638924A1 (de) * | 1993-08-06 | 1995-02-15 | Robert Bosch Gmbh | Verfahren zum Herstellen von TAB-Filmträgern |
| US5466967A (en) * | 1988-10-10 | 1995-11-14 | Lsi Logic Products Gmbh | Lead frame for a multiplicity of terminals |
| DE4438449A1 (de) * | 1994-10-28 | 1996-07-04 | Sibet Gmbh Sican Forschungs Un | Verfahren zur direkten Kontaktierung elektronischer Bauelemente mit einem Träger und direkt kontaktierbare Bauelemente hierzu |
| WO2000011920A1 (de) * | 1998-08-18 | 2000-03-02 | Infineon Technologies Ag | Leiterplatte zur verwendung bei der prüfung von elektrischen bauteilen |
| DE19903652A1 (de) * | 1999-01-29 | 2000-08-10 | A B Elektronik Gmbh | Verfahren zur Herstellung von gehäusten Schaltkreiseinheiten |
| WO2001065595A3 (en) * | 2000-02-28 | 2002-01-03 | Sts Atl Corp | A method of forming an opening or cavity in a substrate for receiving an electronic component |
| US6956182B2 (en) * | 2000-05-26 | 2005-10-18 | Sts Atl Corporation | Method of forming an opening or cavity in a substrate for receiving an electronic component |
| US7288739B2 (en) | 2001-02-26 | 2007-10-30 | Sts Atl Corporation | Method of forming an opening or cavity in a substrate for receiving an electronic component |
| CN103161763A (zh) * | 2011-12-19 | 2013-06-19 | 台达电子工业股份有限公司 | 薄型风扇及其制造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2414297A1 (de) * | 1974-03-25 | 1975-10-02 | Siemens Ag | Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente |
| US3947801A (en) * | 1975-01-23 | 1976-03-30 | Rca Corporation | Laser-trimmed resistor |
| EP0111655A1 (en) * | 1982-11-18 | 1984-06-27 | International Business Machines Corporation | Processes for producing positive self-developed photo resist patterns |
| EP0111644A2 (de) * | 1982-09-27 | 1984-06-27 | Siemens Aktiengesellschaft | Verfahren zur Herstellung von Halbleiterchips-Filmträgern |
| EP0135416A1 (en) * | 1983-07-22 | 1985-03-27 | Fairchild Semiconductor Corporation | Integrated circuit having a pre-attached conductive mounting media and method of making the same |
| DE3446920A1 (de) * | 1983-12-24 | 1985-07-11 | Asahi Kasei Kogyo K.K., Osaka | Lichtempfindlicher schichtstoff |
| DE3431446A1 (de) * | 1984-08-27 | 1986-03-06 | Siemens AG, 1000 Berlin und 8000 München | Anordnung mit einer in dickschicht- oder duennschichttechnik hergestellten leiterschicht auf einem isolierenden substrat |
-
1986
- 1986-03-13 DE DE19863608410 patent/DE3608410A1/de active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2414297A1 (de) * | 1974-03-25 | 1975-10-02 | Siemens Ag | Perforiertes kunststoffband zur teilautomatisierten herstellung von zwischentraegern fuer halbleiterbauelemente |
| US3947801A (en) * | 1975-01-23 | 1976-03-30 | Rca Corporation | Laser-trimmed resistor |
| EP0111644A2 (de) * | 1982-09-27 | 1984-06-27 | Siemens Aktiengesellschaft | Verfahren zur Herstellung von Halbleiterchips-Filmträgern |
| EP0111655A1 (en) * | 1982-11-18 | 1984-06-27 | International Business Machines Corporation | Processes for producing positive self-developed photo resist patterns |
| EP0135416A1 (en) * | 1983-07-22 | 1985-03-27 | Fairchild Semiconductor Corporation | Integrated circuit having a pre-attached conductive mounting media and method of making the same |
| DE3446920A1 (de) * | 1983-12-24 | 1985-07-11 | Asahi Kasei Kogyo K.K., Osaka | Lichtempfindlicher schichtstoff |
| DE3431446A1 (de) * | 1984-08-27 | 1986-03-06 | Siemens AG, 1000 Berlin und 8000 München | Anordnung mit einer in dickschicht- oder duennschichttechnik hergestellten leiterschicht auf einem isolierenden substrat |
Non-Patent Citations (3)
| Title |
|---|
| "Wärmefreies Laserätzen" in Z: Elektronik Produktion & Prüftechnik, Okt 1984, S. 734 * |
| DE-Z: VDI Nachrichten 39, 1983, S.24 * |
| Solid State Technology Bd. 21 (1978) Heft 3, S. 53-58 * |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3834361A1 (de) * | 1988-10-10 | 1990-04-12 | Lsi Logic Products Gmbh | Anschlussrahmen fuer eine vielzahl von anschluessen |
| US5656854A (en) * | 1988-10-10 | 1997-08-12 | Lsi Logic Products Gmbh | Lead frame for a multiplicity of terminals |
| US5466967A (en) * | 1988-10-10 | 1995-11-14 | Lsi Logic Products Gmbh | Lead frame for a multiplicity of terminals |
| DE4000372A1 (de) * | 1990-01-09 | 1991-07-11 | Aei Gmbh | Verfahren zur erstellung einer leiterstruktur auf einem platten- oder folienfoermigen, isolierenden traeger |
| US5278385A (en) * | 1990-01-11 | 1994-01-11 | Nicolitch S.A. | Method of producing flexible printed circuits, printed circuit produced by this method and device for carrying out this method |
| WO1991011090A1 (fr) * | 1990-01-11 | 1991-07-25 | Gim Industrie S.A. | Procede de fabrication de circuits imprimes souples, circuit imprime fabrique par ce procede, et dispositif pour la mise en ×uvre de ce procede |
| FR2657219A1 (fr) * | 1990-01-11 | 1991-07-19 | Gim Ind Sa | Procede de fabrication de circuits imprimes souples, circuit imprime fabrique par ce procede, et dispositif pour la mise en óoeuvre de ce procede. |
| EP0638924A1 (de) * | 1993-08-06 | 1995-02-15 | Robert Bosch Gmbh | Verfahren zum Herstellen von TAB-Filmträgern |
| DE4438449A1 (de) * | 1994-10-28 | 1996-07-04 | Sibet Gmbh Sican Forschungs Un | Verfahren zur direkten Kontaktierung elektronischer Bauelemente mit einem Träger und direkt kontaktierbare Bauelemente hierzu |
| WO2000011920A1 (de) * | 1998-08-18 | 2000-03-02 | Infineon Technologies Ag | Leiterplatte zur verwendung bei der prüfung von elektrischen bauteilen |
| DE19903652B4 (de) * | 1999-01-29 | 2005-04-14 | Ab Elektronik Gmbh | Verfahren zur Herstellung von gehäusten Schaltkreiseinheiten |
| DE19903652A1 (de) * | 1999-01-29 | 2000-08-10 | A B Elektronik Gmbh | Verfahren zur Herstellung von gehäusten Schaltkreiseinheiten |
| WO2001065595A3 (en) * | 2000-02-28 | 2002-01-03 | Sts Atl Corp | A method of forming an opening or cavity in a substrate for receiving an electronic component |
| CN100366132C (zh) * | 2000-02-28 | 2008-01-30 | Stsatl公司 | 在用于容纳电子元件的基片中形成开孔的方法 |
| US6956182B2 (en) * | 2000-05-26 | 2005-10-18 | Sts Atl Corporation | Method of forming an opening or cavity in a substrate for receiving an electronic component |
| US7288739B2 (en) | 2001-02-26 | 2007-10-30 | Sts Atl Corporation | Method of forming an opening or cavity in a substrate for receiving an electronic component |
| CN103161763A (zh) * | 2011-12-19 | 2013-06-19 | 台达电子工业股份有限公司 | 薄型风扇及其制造方法 |
| CN103161763B (zh) * | 2011-12-19 | 2016-01-20 | 台达电子工业股份有限公司 | 薄型风扇及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3608410C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-10-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |