DE3587101D1 - Rahmen fuer die montage mechanischer einzelteile. - Google Patents
Rahmen fuer die montage mechanischer einzelteile.Info
- Publication number
- DE3587101D1 DE3587101D1 DE8585112788T DE3587101T DE3587101D1 DE 3587101 D1 DE3587101 D1 DE 3587101D1 DE 8585112788 T DE8585112788 T DE 8585112788T DE 3587101 T DE3587101 T DE 3587101T DE 3587101 D1 DE3587101 D1 DE 3587101D1
- Authority
- DE
- Germany
- Prior art keywords
- assembly
- frame
- mechanical items
- items
- mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Supplying Of Containers To The Packaging Station (AREA)
- Vehicle Body Suspensions (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59218406A JPS6197996A (ja) | 1984-10-19 | 1984-10-19 | 機構部品塔載用シヤ−シ |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3587101D1 true DE3587101D1 (de) | 1993-03-25 |
DE3587101T2 DE3587101T2 (de) | 1993-06-09 |
Family
ID=16719410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585112788T Expired - Fee Related DE3587101T2 (de) | 1984-10-19 | 1985-10-09 | Rahmen fuer die montage mechanischer einzelteile. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4810048A (de) |
EP (1) | EP0178579B1 (de) |
JP (1) | JPS6197996A (de) |
KR (1) | KR920002275B1 (de) |
DE (1) | DE3587101T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935284A (en) * | 1988-12-21 | 1990-06-19 | Amp Incorporated | Molded circuit board with buried circuit layer |
JP2695921B2 (ja) * | 1989-06-16 | 1998-01-14 | 株式会社日立製作所 | 伝送媒体をインサート成形した回路構造体 |
US5179601A (en) * | 1989-06-16 | 1993-01-12 | Hitachi, Ltd. | Method of manufacturing circuit structure by insert molding of electric and/or optical transmission medium |
US5264975A (en) * | 1989-09-19 | 1993-11-23 | International Business Machines Corporation | Magnetic disk storage device with the base provided by an electronic module substrate |
GB9016833D0 (en) * | 1989-09-19 | 1990-09-12 | Ibm | Disk storage apparatus |
US5414574A (en) * | 1993-07-29 | 1995-05-09 | International Business Machines Corporation | Hybrid base for ultrathin disk drives |
KR0169516B1 (ko) * | 1993-09-28 | 1999-03-20 | 사또오 후미오 | 자기 기록 재생 장치용 샤시 및 그 제조 방법 |
JP3011944U (ja) * | 1994-12-01 | 1995-06-06 | 船井電機株式会社 | 電気機器 |
US6748650B2 (en) | 2001-06-27 | 2004-06-15 | Visteon Global Technologies, Inc. | Method for making a circuit assembly having an integral frame |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3663194A (en) * | 1970-05-25 | 1972-05-16 | Ibm | Method for making monolithic opto-electronic structure |
US3879756A (en) * | 1973-03-13 | 1975-04-22 | Economy Co | Automatic drive stop control utilizing motor voltage transients |
US4136366A (en) * | 1976-09-08 | 1979-01-23 | Hitachi, Ltd. | Cassette tape recorder and method for producing the same |
US4180608A (en) * | 1977-01-07 | 1979-12-25 | Del Joseph A | Process for making multi-layer printed circuit boards, and the article resulting therefrom |
ZA783270B (en) * | 1977-07-06 | 1979-06-27 | Motorola Inc | Molded circuit board |
US4249229A (en) * | 1978-08-28 | 1981-02-03 | Litton Systems, Inc. | Transformer having novel multiple winding and support structure and method of making same |
US4268113A (en) * | 1979-04-16 | 1981-05-19 | International Business Machines Corporation | Signal coupling element for substrate-mounted optical transducers |
US4217624A (en) * | 1979-06-28 | 1980-08-12 | Inteq, Inc. | Communications interface adapter |
JPS5677037U (de) * | 1979-11-12 | 1981-06-23 | ||
JPS5714598A (en) * | 1980-06-30 | 1982-01-25 | Yamasa Shoyu Co Ltd | 5-substituted-1-beta-d-arabinofuranosyluracil derivative and its preparation |
JPS5749288A (en) * | 1980-09-09 | 1982-03-23 | Toshiba Corp | Photo hybrid integrated circuit |
KR880001670B1 (ko) * | 1980-11-29 | 1988-09-05 | 가부시기가이샤 히다찌 세이사꾸쇼 | 비데오 테이프레코오더용 샤시의 제조방법 |
FR2524247A1 (fr) * | 1982-03-23 | 1983-09-30 | Thomson Csf | Procede de fabrication de circuits imprimes avec support metallique rigide conducteur individuel |
US4471898A (en) * | 1982-04-28 | 1984-09-18 | Pace Incorporated | Universal modular power and air supply |
JPS592008A (ja) * | 1982-06-28 | 1984-01-07 | Nippon Telegr & Teleph Corp <Ntt> | 埋め込み型石英光導波路の製造方法 |
JPS5938867A (ja) * | 1982-08-30 | 1984-03-02 | Canon Inc | 電子機器 |
US4452847A (en) * | 1982-11-17 | 1984-06-05 | Westinghouse Electric Corp. | Sheet material impregnated with a highly cross linked thermally stable epoxy composition |
JPS59180514A (ja) * | 1983-03-31 | 1984-10-13 | Toshiba Corp | 光受信モジユ−ル |
DE3324674A1 (de) * | 1983-07-08 | 1985-01-17 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zur herstellung eines integrierten elektrooptischen bauelementes |
US4584767A (en) * | 1984-07-16 | 1986-04-29 | Gregory Vernon C | In-mold process for fabrication of molded plastic printed circuit boards |
-
1984
- 1984-10-19 JP JP59218406A patent/JPS6197996A/ja active Pending
-
1985
- 1985-10-09 EP EP85112788A patent/EP0178579B1/de not_active Expired - Lifetime
- 1985-10-09 DE DE8585112788T patent/DE3587101T2/de not_active Expired - Fee Related
- 1985-10-17 KR KR1019850007658A patent/KR920002275B1/ko not_active IP Right Cessation
- 1985-10-17 US US06/788,258 patent/US4810048A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR920002275B1 (ko) | 1992-03-20 |
KR860003757A (ko) | 1986-05-28 |
JPS6197996A (ja) | 1986-05-16 |
EP0178579B1 (de) | 1993-02-17 |
EP0178579A2 (de) | 1986-04-23 |
US4810048A (en) | 1989-03-07 |
EP0178579A3 (en) | 1988-03-23 |
DE3587101T2 (de) | 1993-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |