DE3583173D1 - Wirbeleinrichtung zur behandlung eines substrates, insbesondere einer halbleiterscheibe. - Google Patents

Wirbeleinrichtung zur behandlung eines substrates, insbesondere einer halbleiterscheibe.

Info

Publication number
DE3583173D1
DE3583173D1 DE8585400430T DE3583173T DE3583173D1 DE 3583173 D1 DE3583173 D1 DE 3583173D1 DE 8585400430 T DE8585400430 T DE 8585400430T DE 3583173 T DE3583173 T DE 3583173T DE 3583173 D1 DE3583173 D1 DE 3583173D1
Authority
DE
Germany
Prior art keywords
treating
substrate
vibration device
semiconductor disc
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585400430T
Other languages
English (en)
Inventor
Katsuyuki Arii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3583173D1 publication Critical patent/DE3583173D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
DE8585400430T 1984-03-06 1985-03-06 Wirbeleinrichtung zur behandlung eines substrates, insbesondere einer halbleiterscheibe. Expired - Fee Related DE3583173D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59042612A JPS60210840A (ja) 1984-03-06 1984-03-06 スピン処理装置

Publications (1)

Publication Number Publication Date
DE3583173D1 true DE3583173D1 (de) 1991-07-18

Family

ID=12640846

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585400430T Expired - Fee Related DE3583173D1 (de) 1984-03-06 1985-03-06 Wirbeleinrichtung zur behandlung eines substrates, insbesondere einer halbleiterscheibe.

Country Status (5)

Country Link
US (1) US4633804A (de)
EP (1) EP0157675B1 (de)
JP (1) JPS60210840A (de)
KR (1) KR900005119B1 (de)
DE (1) DE3583173D1 (de)

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US5261566A (en) * 1981-02-16 1993-11-16 Tokyo Ohka Kogyo Co., Ltd. Solution-dropping nozzle device
JPH01121114U (de) * 1988-02-04 1989-08-16
US5395446A (en) * 1988-11-21 1995-03-07 Kabushiki Kaisha Toshiba Semiconductor treatment apparatus
DE68924758T2 (de) * 1988-11-21 1996-05-02 Toshiba Kawasaki Kk Vorrichtung zum Behandeln von Halbleitern.
US5204055A (en) * 1989-12-08 1993-04-20 Massachusetts Institute Of Technology Three-dimensional printing techniques
US4971931A (en) * 1990-02-12 1990-11-20 Eastman Kodak Company Diffuser features for spin-coated films
US5173334A (en) * 1991-06-12 1992-12-22 Pierre Lavaux Apparatus and method for improved hot dip metallic coating of metal objects
US5326398A (en) * 1992-07-22 1994-07-05 Statspin Technologies Compact slide spinner using a disposable slide holder
US5549750A (en) * 1992-07-22 1996-08-27 Norfolk Scientific, Inc. Disposable slide holder
JPH0652964U (ja) * 1992-12-21 1994-07-19 株式会社康井精機 塗工装置
US5679154A (en) * 1994-03-01 1997-10-21 Norfolk Scientific, Inc. Cytology centrifuge apparatus
US5480484A (en) * 1994-03-01 1996-01-02 Statspin Technologies Cytology centrifuge apparatus
US6090261A (en) * 1995-05-26 2000-07-18 Formfactor, Inc. Method and apparatus for controlling plating over a face of a substrate
US6685817B1 (en) * 1995-05-26 2004-02-03 Formfactor, Inc. Method and apparatus for controlling plating over a face of a substrate
US5609995A (en) * 1995-08-30 1997-03-11 Micron Technology, Inc. Method for forming a thin uniform layer of resist for lithography
US5637326A (en) * 1995-12-04 1997-06-10 Fuisz Technologies Ltd. Apparatus for making chopped amorphous fibers with an air transport system
US5858475A (en) * 1996-12-23 1999-01-12 Taiwan Semiconductor Manufacturing Company, Ltd Acoustic wave enhanced spin coating method
US5876875A (en) * 1996-12-23 1999-03-02 Taiwan Semiconductor Manufacturing Company, Ltd. Acoustic wave enhanced developer
WO1998035377A1 (en) * 1997-02-07 1998-08-13 Camelot Systems, Inc. Method and apparatus for dispensing liquids
US6355397B1 (en) * 1997-04-11 2002-03-12 Taiwan Semiconductor Manufacturing Company Method and apparatus for improving resist pattern developing
US5925410A (en) * 1997-05-06 1999-07-20 Micron Technology, Inc. Vibration-enhanced spin-on film techniques for semiconductor device processing
US20050034745A1 (en) * 1997-05-09 2005-02-17 Semitool, Inc. Processing a workpiece with ozone and a halogenated additive
US7416611B2 (en) * 1997-05-09 2008-08-26 Semitool, Inc. Process and apparatus for treating a workpiece with gases
US6701941B1 (en) * 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
US20020157686A1 (en) * 1997-05-09 2002-10-31 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
US7163588B2 (en) 1997-05-09 2007-01-16 Semitool, Inc. Processing a workpiece using water, a base, and ozone
US20050194356A1 (en) * 1997-05-09 2005-09-08 Semitool, Inc. Removing photoresist from a workpiece using water and ozone and a photoresist penetrating additive
US6416583B1 (en) 1998-06-19 2002-07-09 Tokyo Electron Limited Film forming apparatus and film forming method
US6092937A (en) * 1999-01-08 2000-07-25 Fastar, Ltd. Linear developer
US6730349B2 (en) * 1999-04-19 2004-05-04 Scimed Life Systems, Inc. Mechanical and acoustical suspension coating of medical implants
US6368658B1 (en) * 1999-04-19 2002-04-09 Scimed Life Systems, Inc. Coating medical devices using air suspension
US6607598B2 (en) 1999-04-19 2003-08-19 Scimed Life Systems, Inc. Device for protecting medical devices during a coating process
US6214110B1 (en) * 1999-04-23 2001-04-10 Ball Semiconductor, Inc. Apparatus for producing uniform coating thickness on a spherical substrate
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6384894B2 (en) * 2000-01-21 2002-05-07 Tokyo Electron Limited Developing method and developing unit
KR100390553B1 (ko) * 2000-12-30 2003-07-07 주식회사 동진쎄미켐 근적외선 분광기를 이용한 금속막 에칭 공정 제어방법 및에쳔트 조성물의 재생방법
TW554069B (en) * 2001-08-10 2003-09-21 Ebara Corp Plating device and method
JP2003084455A (ja) * 2001-09-13 2003-03-19 Matsushita Electric Ind Co Ltd パターン形成方法
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
JP2004207503A (ja) * 2002-12-25 2004-07-22 Canon Inc 処理装置
JP5231028B2 (ja) * 2008-01-21 2013-07-10 東京エレクトロン株式会社 塗布液供給装置
DE102008045068A1 (de) * 2008-08-29 2010-03-04 Suss Microtec Lithography Gmbh Verfahren zur Resist-Beschichtung einer Vertiefung in der Oberfläche eines Substrats, insbesondere eines Wafers
US9349622B2 (en) * 2013-03-12 2016-05-24 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for planarization of substrate coatings
US10871720B2 (en) * 2014-10-02 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for supporting a semiconductor wafer and method of vibrating a semiconductor wafer
CN104384070A (zh) * 2014-12-08 2015-03-04 南通新江海动力电子有限公司 自动灌胶方法
KR102433947B1 (ko) * 2017-09-29 2022-08-18 도쿄엘렉트론가부시키가이샤 유체로 기판을 코팅하기 위한 방법 및 시스템
CN112916333A (zh) * 2019-12-06 2021-06-08 长鑫存储技术有限公司 储液设备、晶圆处理装置以及供液方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707944A (en) * 1970-10-23 1973-01-02 Ibm Automatic photoresist apply and dry apparatus
US3695928A (en) * 1970-12-07 1972-10-03 Western Electric Co Selective coating
US4001659A (en) * 1974-09-12 1977-01-04 Headway Research, Inc. Apparatus for spinning a microelectronic substrate
US4124411A (en) * 1976-09-02 1978-11-07 U.S. Philips Corporation Method of providing a layer of solid material on a substrate in which liquid from which the solid material can be formed, is spread over the substrate surface
JPS57178327A (en) * 1981-04-27 1982-11-02 Hitachi Ltd Washer

Also Published As

Publication number Publication date
JPS60210840A (ja) 1985-10-23
US4633804A (en) 1987-01-06
EP0157675B1 (de) 1991-06-12
KR850006787A (ko) 1985-10-16
EP0157675A2 (de) 1985-10-09
EP0157675A3 (en) 1989-04-12
KR900005119B1 (ko) 1990-07-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee