DE3578224D1 - Integrierte schaltung vom chip-auf-chip-typ. - Google Patents

Integrierte schaltung vom chip-auf-chip-typ.

Info

Publication number
DE3578224D1
DE3578224D1 DE8585401535T DE3578224T DE3578224D1 DE 3578224 D1 DE3578224 D1 DE 3578224D1 DE 8585401535 T DE8585401535 T DE 8585401535T DE 3578224 T DE3578224 T DE 3578224T DE 3578224 D1 DE3578224 D1 DE 3578224D1
Authority
DE
Germany
Prior art keywords
chip
type
integrated
integrated chip
chip type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8585401535T
Other languages
English (en)
Inventor
Yoshinori Enomoto
Hideo Monma
Shunzo Ohta
Takeshi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15661884A external-priority patent/JPS6135546A/ja
Priority claimed from JP24197784A external-priority patent/JPS61120437A/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3578224D1 publication Critical patent/DE3578224D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06596—Structural arrangements for testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE8585401535T 1984-07-27 1985-07-25 Integrierte schaltung vom chip-auf-chip-typ. Expired - Fee Related DE3578224D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15661884A JPS6135546A (ja) 1984-07-27 1984-07-27 半導体装置
JP24197784A JPS61120437A (ja) 1984-11-16 1984-11-16 半導体装置

Publications (1)

Publication Number Publication Date
DE3578224D1 true DE3578224D1 (de) 1990-07-19

Family

ID=26484309

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585401535T Expired - Fee Related DE3578224D1 (de) 1984-07-27 1985-07-25 Integrierte schaltung vom chip-auf-chip-typ.

Country Status (3)

Country Link
US (1) US4703483A (de)
EP (1) EP0174224B1 (de)
DE (1) DE3578224D1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8801362A (nl) * 1988-05-27 1989-12-18 Philips Nv Elektronische module bevattende een eerste substraatelement met een funktioneel deel, alsmede een tweede substraatelement voor het testen van een interkonnektiefunktie, voet bevattende zo een tweede substraatelement, substraatelement te gebruiken als zo een tweede substraatelement en elektronisch apparaat bevattende een plaat met gedrukte bedrading en ten minste twee zulke elektronische modules.
US5363383A (en) * 1991-01-11 1994-11-08 Zilog, Inc. Circuit for generating a mode control signal
US5453991A (en) * 1992-03-18 1995-09-26 Kabushiki Kaisha Toshiba Integrated circuit device with internal inspection circuitry
US6295621B1 (en) * 1993-04-22 2001-09-25 Medtronic, Inc Apparatus for detecting output bond integrity in a display driver circuit
US6198136B1 (en) * 1996-03-19 2001-03-06 International Business Machines Corporation Support chips for buffer circuits
US6041269A (en) * 1997-08-11 2000-03-21 Advanced Micro Devices, Inc. Integrated circuit package verification
JPH11168185A (ja) * 1997-12-03 1999-06-22 Rohm Co Ltd 積層基板体および半導体装置
US6225699B1 (en) 1998-06-26 2001-05-01 International Business Machines Corporation Chip-on-chip interconnections of varied characteristics
US5977640A (en) * 1998-06-26 1999-11-02 International Business Machines Corporation Highly integrated chip-on-chip packaging
JP4018254B2 (ja) * 1998-08-20 2007-12-05 株式会社アドバンテスト 電子部品の試験方法
JP2000227457A (ja) * 1999-02-05 2000-08-15 Rohm Co Ltd 半導体装置
US6625745B1 (en) * 1999-03-17 2003-09-23 Hewlett-Packard Development Co.Lp Network component failure identification with minimal testing
US6456101B2 (en) 1999-04-07 2002-09-24 Agere Systems Guardian Corp. Chip-on-chip testing using BIST
US6294839B1 (en) 1999-08-30 2001-09-25 Micron Technology, Inc. Apparatus and methods of packaging and testing die
KR100335481B1 (ko) 1999-09-13 2002-05-04 김덕중 멀티 칩 패키지 구조의 전력소자
US6559531B1 (en) 1999-10-14 2003-05-06 Sun Microsystems, Inc. Face to face chips
US8212367B2 (en) * 2004-11-10 2012-07-03 Sandisk Il Ltd. Integrated circuit die with logically equivalent bonding pads
DE102005025169B4 (de) * 2005-06-01 2007-08-02 Infineon Technologies Ag Kommunikationsvorrichtung und Verfahren zur Übermittlung von Daten
US8146046B2 (en) * 2006-03-23 2012-03-27 International Business Machines Corporation Structures for semiconductor structures with error detection and correction
US7526698B2 (en) * 2006-03-23 2009-04-28 International Business Machines Corporation Error detection and correction in semiconductor structures
KR100915822B1 (ko) * 2007-12-11 2009-09-07 주식회사 하이닉스반도체 바운더리 스캔 테스트 회로 및 바운더리 스캔 테스트 방법
US8471582B2 (en) * 2009-01-27 2013-06-25 Qualcomm Incorporated Circuit for detecting tier-to-tier couplings in stacked integrated circuit devices
US8161335B2 (en) * 2009-05-05 2012-04-17 Bae Systems Information And Electronic Systems Integration Inc. System and method for testing a circuit
CN103106142B (zh) * 2011-11-10 2016-06-29 澜起科技（上海）有限公司 需要分配地址的器件、器件系统及地址分配方法
US20140246781A1 (en) * 2013-03-04 2014-09-04 Kabushiki Kaisha Toshiba Semiconductor device, method of forming a packaged chip device and chip package
CN106126470B (zh) * 2016-06-30 2021-09-17 唯捷创芯(天津)电子技术股份有限公司 一种实现芯片重用的可变信号流向控制方法及通信终端
CN109143022B (zh) * 2018-04-24 2024-06-07 赛凯诺技术（深圳）有限公司 防护单片机芯片被倒插致损的方法和电路
EP3712630B1 (de) * 2019-03-20 2021-04-28 LEM International SA Magnetfeldsensor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4241307A (en) * 1978-08-18 1980-12-23 International Business Machines Corporation Module interconnection testing scheme
US4244048A (en) * 1978-12-29 1981-01-06 International Business Machines Corporation Chip and wafer configuration and testing method for large-scale-integrated circuits
US4504784A (en) * 1981-07-02 1985-03-12 International Business Machines Corporation Method of electrically testing a packaging structure having N interconnected integrated circuit chips
JPS5832178A (ja) * 1981-08-19 1983-02-25 Advantest Corp Ｉｃテスタ
US4503386A (en) * 1982-04-20 1985-03-05 International Business Machines Corporation Chip partitioning aid (CPA)-A structure for test pattern generation for large logic networks
US4509008A (en) * 1982-04-20 1985-04-02 International Business Machines Corporation Method of concurrently testing each of a plurality of interconnected integrated circuit chips

Also Published As

Publication number Publication date
US4703483A (en) 1987-10-27
EP0174224B1 (de) 1990-06-13
EP0174224A1 (de) 1986-03-12

Similar Documents

Publication Publication Date Title
DE3578224D1 (de) Integrierte schaltung vom chip-auf-chip-typ.
DE3481957D1 (de) Halbleiteranordnung.
DE3583302D1 (de) Halbleiteranordnung.
FI862449A0 (fi) Integrerat pyrolytiskt foerfarande foer tunga petroleumfraktioner.
DE3576268D1 (de) Hoergeraet.
DE3577754D1 (de) Verbindungsvorrichtung.
DE3583010D1 (de) Halbleiterphotodetektor.
DE3587715D1 (de) Integrierte Schaltung.
DE3576064D1 (de) Melkkreuz.
DE3585265D1 (de) Fibronektinpraeparate.
DE3584799D1 (de) Halbleitervorrichtung.
NO851497L (no) Beholderlukke.
DE3582653D1 (de) Halbleiteranordnung.
FI853348L (fi) Vaetskedistribueringssammansaettning.
DE3583080D1 (de) Mikrorechner.
DE3581370D1 (de) Halbleitervorrichtung.
DE3861551D1 (de) Durchflussoszillator.
DE3586568D1 (de) Halbleitereinrichtung.
DE3587451D1 (de) Halbleiteruebergitterstruktur.
DE3582060D1 (de) Homopropargylamine.
DE3583401D1 (de) Fotovoltaisches element.
DE3577708D1 (de) Diphenylhexafluorpropanabkoemmlinge.
IT8522500A0 (it) Apparecchio di collegamento.
DE3579862D1 (de) Mikrorechner.
FI850568L (fi) Sjukbil.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee