DE3535923A1 - Substrathaltender aufbau - Google Patents

Substrathaltender aufbau

Info

Publication number
DE3535923A1
DE3535923A1 DE19853535923 DE3535923A DE3535923A1 DE 3535923 A1 DE3535923 A1 DE 3535923A1 DE 19853535923 DE19853535923 DE 19853535923 DE 3535923 A DE3535923 A DE 3535923A DE 3535923 A1 DE3535923 A1 DE 3535923A1
Authority
DE
Germany
Prior art keywords
substrate
holes
circuit
segments
circuit substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19853535923
Other languages
German (de)
English (en)
Other versions
DE3535923C2 (US06312121-20011106-C00033.png
Inventor
Sadayoshi Ijichi
Tetsuro Soma Fukushima Umemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of DE3535923A1 publication Critical patent/DE3535923A1/de
Application granted granted Critical
Publication of DE3535923C2 publication Critical patent/DE3535923C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/04—Arrangements of circuit components or wiring on supporting structure on conductive chassis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
DE19853535923 1984-10-09 1985-10-08 Substrathaltender aufbau Granted DE3535923A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984152747U JPH0412714Y2 (US06312121-20011106-C00033.png) 1984-10-09 1984-10-09

Publications (2)

Publication Number Publication Date
DE3535923A1 true DE3535923A1 (de) 1986-04-10
DE3535923C2 DE3535923C2 (US06312121-20011106-C00033.png) 1989-02-02

Family

ID=15547276

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19853535923 Granted DE3535923A1 (de) 1984-10-09 1985-10-08 Substrathaltender aufbau

Country Status (5)

Country Link
US (1) US4725920A (US06312121-20011106-C00033.png)
JP (1) JPH0412714Y2 (US06312121-20011106-C00033.png)
KR (1) KR890007939Y1 (US06312121-20011106-C00033.png)
DE (1) DE3535923A1 (US06312121-20011106-C00033.png)
GB (1) GB2165399B (US06312121-20011106-C00033.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036081A1 (de) * 1990-04-26 1991-11-07 Mitsubishi Electric Corp Tragbare halbleiterspeichervorrichtung
US5189638A (en) * 1990-04-26 1993-02-23 Mitsubishi Denki Kabushiki Kaisha Portable semiconductor memory device
US6094360A (en) * 1996-09-06 2000-07-25 U.S. Philips Corporation HF module with housing and printed circuit board arranged therein
WO2004010750A1 (de) * 2002-07-12 2004-01-29 Ghw Grote & Hartmann Gmbh Leiterplattenelement mit einer stromversorgungsvorrichtung für auf der leiterplatte angeordnete elektrische und elektronische bauelemente

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4873764A (en) * 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
JPH02187093A (ja) * 1989-01-13 1990-07-23 Toshiba Corp 印刷配線板
US5162971A (en) * 1989-03-23 1992-11-10 Matsushita Electric Industrial Co., Ltd. High-density circuit module and process for producing same
US5090918A (en) * 1990-05-31 1992-02-25 John Fluke Mfg. Co., Inc. Isothermal termination block having a multi-layer thermal conductor
JP3018640B2 (ja) * 1991-08-29 2000-03-13 ソニー株式会社 回路接続基板構造
US5184283A (en) * 1991-12-23 1993-02-02 Ford Motor Company Power device assembly and method
US5311407A (en) * 1992-04-30 1994-05-10 Siemens Components, Inc. Printed circuit based for mounted semiconductors and other electronic components
US5272599A (en) * 1993-03-19 1993-12-21 Compaq Computer Corporation Microprocessor heat dissipation apparatus for a printed circuit board
JPH07105759B2 (ja) * 1993-03-30 1995-11-13 山一電機株式会社 光電変換器
WO1997001263A1 (fr) * 1995-06-20 1997-01-09 Matsushita Electric Industrial Co., Ltd. Dispositif de maintien de piece, substrat dote de ce dispositif et son procede de fabrication
DE19535490A1 (de) * 1995-09-23 1997-03-27 Bosch Gmbh Robert Schaltungsplatine sowie Verfahren zum Herstellen einer Schaltungsplatine
DE19600617A1 (de) * 1996-01-10 1997-07-17 Bosch Gmbh Robert Elektrisches Gerät
US6078359A (en) * 1996-07-15 2000-06-20 The Regents Of The University Of California Vacuum compatible miniature CCD camera head
FR2822632B1 (fr) * 2001-03-21 2004-01-23 Sagem Carte electronique et circuit correspondant
JP3787291B2 (ja) * 2001-08-22 2006-06-21 ペンタックス株式会社 Ｅｍｃコア支持、シールド、及び放熱の為の構造
WO2005002302A1 (en) * 2003-06-24 2005-01-06 Bae Systems Plc Flexi-rigid printed circuit board with integral flexible heat sink area
US20050276024A1 (en) * 2004-06-10 2005-12-15 Westbury Steven D Flexi-rigid printed circuit board with integral flexible heat sink area
JP2023085706A (ja) * 2021-12-09 2023-06-21 日本航空電子工業株式会社 組立体及びハーネス組立体

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2586854A (en) * 1947-04-19 1952-02-26 Farnsworth Res Corp Printed circuit construction
FR1403061A (fr) * 1964-05-06 1965-06-18 Commissariat Energie Atomique Masse électrique, notamment pour plaquettes de circuits imprimés
DE1195829B (de) * 1962-11-28 1965-07-01 Imperial Rundfunk- und Fernsehwerk G.m.b.H., Osterode (Harz) Elektrisches Schaltungsschassis und Verfahren zu seiner Herstellung und Montage
US3202879A (en) * 1959-12-24 1965-08-24 Ibm Encapsulated circuit card
US3409805A (en) * 1965-08-12 1968-11-05 Foxboro Co Printed-circuit board coupling circuit with d-c isolation
DE1911779A1 (de) * 1969-03-07 1970-09-10 Siemens Ag Verdrahtungsanordnung zur elektrischen Verbindung voneinander verschiedener Anschlussebenen
AT348018B (de) * 1975-04-16 1979-01-25 Siemens Ag Oesterreich Traegerplatte

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3348101A (en) * 1964-05-27 1967-10-17 Itt Cordwood module with heat sink fence
US3506877A (en) * 1968-09-25 1970-04-14 Us Navy Hermetically sealed and shielded circuit module
GB1411080A (en) * 1971-11-17 1975-10-22 Lucas Industries Ltd Mounting arrangements for printed circuit boards
IT1008331B (it) * 1973-03-28 1976-11-10 Rca Corp Pannello composito a circuito stampato
US3996500A (en) * 1975-06-16 1976-12-07 Richco Plastic Company Chassis connector and circuit board clip
US4250616A (en) * 1979-03-23 1981-02-17 Methode Electronics, Inc. Method of producing multilayer backplane
US4310870A (en) * 1979-12-31 1982-01-12 Motorola, Inc. Chassis captivation arrangement for an electronic device
DE3021655C2 (de) * 1980-06-10 1983-05-26 Rose-Elektrotechnik Gmbh & Co Kg Elektrotechnische Fabrik, 4952 Porta Westfalica Vorrichtung zum Positionieren von Leiterkarten, Montagewänden oder -platten in Elektronik-Schaltgehäusen
US4498119A (en) * 1980-11-03 1985-02-05 Lockheed Corporation Electronic circuit board and method and apparatus for thermal management thereof
US4388672A (en) * 1981-05-01 1983-06-14 Motorola Inc. Printed circuit board assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2586854A (en) * 1947-04-19 1952-02-26 Farnsworth Res Corp Printed circuit construction
US3202879A (en) * 1959-12-24 1965-08-24 Ibm Encapsulated circuit card
DE1195829B (de) * 1962-11-28 1965-07-01 Imperial Rundfunk- und Fernsehwerk G.m.b.H., Osterode (Harz) Elektrisches Schaltungsschassis und Verfahren zu seiner Herstellung und Montage
FR1403061A (fr) * 1964-05-06 1965-06-18 Commissariat Energie Atomique Masse électrique, notamment pour plaquettes de circuits imprimés
US3409805A (en) * 1965-08-12 1968-11-05 Foxboro Co Printed-circuit board coupling circuit with d-c isolation
DE1911779A1 (de) * 1969-03-07 1970-09-10 Siemens Ag Verdrahtungsanordnung zur elektrischen Verbindung voneinander verschiedener Anschlussebenen
AT348018B (de) * 1975-04-16 1979-01-25 Siemens Ag Oesterreich Traegerplatte

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4036081A1 (de) * 1990-04-26 1991-11-07 Mitsubishi Electric Corp Tragbare halbleiterspeichervorrichtung
US5189638A (en) * 1990-04-26 1993-02-23 Mitsubishi Denki Kabushiki Kaisha Portable semiconductor memory device
US6094360A (en) * 1996-09-06 2000-07-25 U.S. Philips Corporation HF module with housing and printed circuit board arranged therein
WO2004010750A1 (de) * 2002-07-12 2004-01-29 Ghw Grote & Hartmann Gmbh Leiterplattenelement mit einer stromversorgungsvorrichtung für auf der leiterplatte angeordnete elektrische und elektronische bauelemente

Also Published As

Publication number Publication date
US4725920A (en) 1988-02-16
GB8523890D0 (en) 1985-10-30
JPS6166993U (US06312121-20011106-C00033.png) 1986-05-08
KR860005454U (ko) 1986-06-11
JPH0412714Y2 (US06312121-20011106-C00033.png) 1992-03-26
DE3535923C2 (US06312121-20011106-C00033.png) 1989-02-02
KR890007939Y1 (ko) 1989-11-10
GB2165399B (en) 1988-06-22
GB2165399A (en) 1986-04-09

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee