DE3469646D1 - Integrated circuit package (1111111) - Google Patents

Integrated circuit package (1111111)

Info

Publication number
DE3469646D1
DE3469646D1 DE8484111297T DE3469646T DE3469646D1 DE 3469646 D1 DE3469646 D1 DE 3469646D1 DE 8484111297 T DE8484111297 T DE 8484111297T DE 3469646 T DE3469646 T DE 3469646T DE 3469646 D1 DE3469646 D1 DE 3469646D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit package
package
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8484111297T
Other languages
German (de)
English (en)
Inventor
Satoru Ogihara
Hironori Kodama
Nobuyuki Ushifusa
Kanji Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3469646D1 publication Critical patent/DE3469646D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/737—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
DE8484111297T 1983-09-22 1984-09-21 Integrated circuit package (1111111) Expired DE3469646D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58175958A JPS6066843A (ja) 1983-09-22 1983-09-22 集積回路パツケ−ジ

Publications (1)

Publication Number Publication Date
DE3469646D1 true DE3469646D1 (en) 1988-04-07

Family

ID=16005227

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484111297T Expired DE3469646D1 (en) 1983-09-22 1984-09-21 Integrated circuit package (1111111)

Country Status (4)

Country Link
US (1) US4965660A (Direct)
EP (1) EP0137385B1 (Direct)
JP (1) JPS6066843A (Direct)
DE (1) DE3469646D1 (Direct)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8509439D0 (en) * 1985-04-12 1985-05-15 Artus R G C Heat sink
JPS62291158A (ja) * 1986-06-11 1987-12-17 Toshiba Corp Ｉｃパツケ−ジ
JPS63131561A (ja) * 1986-11-18 1988-06-03 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 電子パツケージ
GB2222721B (en) * 1988-08-23 1993-07-28 Nobuo Mikoshiba Cooling semiconductor devices
EP0382203B1 (en) * 1989-02-10 1995-04-26 Fujitsu Limited Ceramic package type semiconductor device and method of assembling the same
US5258649A (en) * 1989-05-20 1993-11-02 Hitachi, Ltd. Semiconductor device and electronic apparatus using semiconductor device
JPH03116948A (ja) * 1989-09-29 1991-05-17 Yoshiki Tanigawa 超高周波ｉｃ用窒化アルミニウムパッケージ
US5227663A (en) * 1989-12-19 1993-07-13 Lsi Logic Corporation Integral dam and heat sink for semiconductor device assembly
JP2918328B2 (ja) * 1990-11-26 1999-07-12 株式会社デンソー 樹脂の選定方法及びこの選定方法により選定された樹脂を有する樹脂封止型半導体装置
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
US5155067A (en) * 1991-03-26 1992-10-13 Micron Technology, Inc. Packaging for a semiconductor die
US5459348A (en) * 1991-05-24 1995-10-17 Astec International, Ltd. Heat sink and electromagnetic interference shield assembly
JP2927081B2 (ja) * 1991-10-30 1999-07-28 株式会社デンソー 樹脂封止型半導体装置
JPH05136304A (ja) * 1991-11-14 1993-06-01 Mitsubishi Electric Corp 半導体モジユール及びそれを用いたパワー制御装置
US5265321A (en) * 1992-09-22 1993-11-30 Microelectronics And Computer Technology Corporation Integrated circuit structure with heat exchanger elements secured thereto and method of making
US5309321A (en) * 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
JPH06204285A (ja) * 1992-12-28 1994-07-22 Toshiba Corp 半導体装置及びその製造方法
DE19509188B4 (de) * 1994-03-14 2004-04-29 Denso Corp., Kariya Druckdetektor
US6081028A (en) * 1994-03-29 2000-06-27 Sun Microsystems, Inc. Thermal management enhancements for cavity packages
US5650593A (en) * 1994-05-26 1997-07-22 Amkor Electronics, Inc. Thermally enhanced chip carrier package
US5665473A (en) * 1994-09-16 1997-09-09 Tokuyama Corporation Package for mounting a semiconductor device
DE19727913A1 (de) * 1997-07-01 1999-01-07 Daimler Benz Ag Keramikgehäuse und Verfahren zu seiner Herstellung
KR100320983B1 (ko) * 1997-08-22 2002-06-20 포만 제프리 엘 칩조립체및직접적인개방열전도성경로의제공방법
US6448665B1 (en) * 1997-10-15 2002-09-10 Kabushiki Kaisha Toshiba Semiconductor package and manufacturing method thereof
US6022616A (en) * 1998-01-23 2000-02-08 National Starch And Chemical Investment Holding Corporation Adhesive composition with small particle size for microelectronic devices
US6369452B1 (en) * 1999-07-27 2002-04-09 International Business Machines Corporation Cap attach surface modification for improved adhesion
DE10009678C1 (de) 2000-02-29 2001-07-19 Siemens Ag Wärmeleitende Klebstoffverbindung und Verfahren zum Herstellen einer wärmeleitenden Klebstoffverbindung
US6979894B1 (en) 2001-09-27 2005-12-27 Marvell International Ltd. Integrated chip package having intermediate substrate
US20030183369A1 (en) * 2002-04-02 2003-10-02 John Makaran Heat sink and method of removing heat from power electronics components
US7227257B2 (en) * 2002-12-09 2007-06-05 Intel Corporation Cooling micro-channels
US6809261B1 (en) * 2003-06-23 2004-10-26 Agilent Technologies, Inc. Physically compact device package
JP4393312B2 (ja) * 2004-08-27 2010-01-06 富士通株式会社 半導体装置
US7105920B2 (en) * 2004-11-12 2006-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate design to improve chip package reliability
US7473853B2 (en) * 2005-02-28 2009-01-06 Sanyo Electric Co., Ltd. Circuit device
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
WO2011030517A1 (ja) * 2009-09-09 2011-03-17 株式会社日立製作所 接続材料、半導体装置及びその製造方法
JP2013514674A (ja) * 2009-12-17 2013-04-25 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング 変速機制御装置として使用するため裸ダイ取付けにより重なり合って設けられる複数の印刷配線板層を持つ印刷配線板
CA3137290C (en) * 2019-04-25 2025-07-08 American Axle & Manufacturing, Inc. Electric drive module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2850687A (en) * 1953-10-13 1958-09-02 Rca Corp Semiconductor devices
NL100919C (Direct) * 1954-12-16 1900-01-01
NL217849A (Direct) * 1956-06-12
US3187226A (en) * 1961-08-07 1965-06-01 Curtiss Wright Corp Miniaturized electrical apparatus with combined heat dissipating and insulating structure
DE2743773A1 (de) * 1976-10-04 1978-04-06 Owens Illinois Inc Elektrische vorrichtung
DE2940917A1 (de) * 1979-10-09 1981-04-23 Wacker-Chemie GmbH, 8000 München Klebstoffe
JPS6038867B2 (ja) * 1981-06-05 1985-09-03 株式会社日立製作所 絶縁型半導体装置
JPS5899172A (ja) * 1981-12-07 1983-06-13 株式会社日立製作所 電気絶縁基板
JPS58101442A (ja) * 1981-12-11 1983-06-16 Hitachi Ltd 電気的装置用基板

Also Published As

Publication number Publication date
JPS6066843A (ja) 1985-04-17
EP0137385B1 (en) 1988-03-02
EP0137385A1 (en) 1985-04-17
JPH0363824B2 (Direct) 1991-10-02
US4965660A (en) 1990-10-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee