DE3468151D1 - Gate array type semiconductor integrated circuit device - Google Patents
Gate array type semiconductor integrated circuit deviceInfo
- Publication number
- DE3468151D1 DE3468151D1 DE8484306557T DE3468151T DE3468151D1 DE 3468151 D1 DE3468151 D1 DE 3468151D1 DE 8484306557 T DE8484306557 T DE 8484306557T DE 3468151 T DE3468151 T DE 3468151T DE 3468151 D1 DE3468151 D1 DE 3468151D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- type semiconductor
- semiconductor integrated
- circuit device
- gate array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
- H01L27/0921—Means for preventing a bipolar, e.g. thyristor, action between the different transistor regions, e.g. Latchup prevention
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
- H01L27/11803—Masterslice integrated circuits using field effect technology
- H01L27/11807—CMOS gate arrays
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58182069A JPH0828480B2 (ja) | 1983-09-30 | 1983-09-30 | 半導体集積回路装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3468151D1 true DE3468151D1 (en) | 1988-01-28 |
Family
ID=16111804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8484306557T Expired DE3468151D1 (en) | 1983-09-30 | 1984-09-26 | Gate array type semiconductor integrated circuit device |
Country Status (5)
Country | Link |
---|---|
US (1) | US4701777A (de) |
EP (1) | EP0136880B1 (de) |
JP (1) | JPH0828480B2 (de) |
KR (1) | KR890003299B1 (de) |
DE (1) | DE3468151D1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62119936A (ja) * | 1985-11-19 | 1987-06-01 | Fujitsu Ltd | コンプリメンタリ−lsiチツプ |
US4884118A (en) * | 1986-05-19 | 1989-11-28 | Lsi Logic Corporation | Double metal HCMOS compacted array |
JPS62276852A (ja) * | 1986-05-23 | 1987-12-01 | Mitsubishi Electric Corp | 半導体集積回路装置 |
US4791317A (en) * | 1986-09-26 | 1988-12-13 | Siemens Aktiengesellschaft | Latch-up protection circuit for integrated circuits using complementary mos circuit technology |
US4791316A (en) * | 1986-09-26 | 1988-12-13 | Siemens Aktiengesellschaft | Latch-up protection circuit for integrated circuits using complementary MOS circuit technology |
JPS63278248A (ja) * | 1987-03-13 | 1988-11-15 | Fujitsu Ltd | ゲ−トアレイの基本セル |
US5136355A (en) * | 1987-11-25 | 1992-08-04 | Marconi Electronic Devices Limited | Interconnecting layer on a semiconductor substrate |
US5025296A (en) * | 1988-02-29 | 1991-06-18 | Motorola, Inc. | Center tapped FET |
DE68929068T2 (de) * | 1988-04-22 | 1999-12-23 | Fujitsu Ltd., Kawasaki | Integrierte Halbleiterschaltungsanordnung vom "Masterslice"-Typ |
NL194182C (nl) * | 1988-07-23 | 2001-08-03 | Samsung Electronics Co Ltd | Randloze moederschijf-halfgeleiderinrichting. |
US4928160A (en) * | 1989-01-17 | 1990-05-22 | Ncr Corporation | Gate isolated base cell structure with off-grid gate polysilicon pattern |
DE69034088T2 (de) * | 1989-04-19 | 2004-02-05 | Seiko Epson Corp. | Halbleiteranordnung |
US5459340A (en) * | 1989-10-03 | 1995-10-17 | Trw Inc. | Adaptive configurable gate array |
US5217916A (en) * | 1989-10-03 | 1993-06-08 | Trw Inc. | Method of making an adaptive configurable gate array |
US5200917A (en) * | 1991-11-27 | 1993-04-06 | Micron Technology, Inc. | Stacked printed circuit board device |
US6262216B1 (en) | 1998-10-13 | 2001-07-17 | Affymetrix, Inc. | Functionalized silicon compounds and methods for their synthesis and use |
JP4517413B2 (ja) * | 1999-01-13 | 2010-08-04 | ソニー株式会社 | 半導体装置 |
JP4794030B2 (ja) * | 2000-07-10 | 2011-10-12 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7102867B2 (en) | 2003-06-30 | 2006-09-05 | International Business Machines Corporation | Method, apparatus and circuit for latchup suppression in a gate-array ASIC environment |
JP5331195B2 (ja) * | 2009-10-19 | 2013-10-30 | パナソニック株式会社 | 半導体装置 |
KR20180068229A (ko) * | 2016-12-13 | 2018-06-21 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3955210A (en) * | 1974-12-30 | 1976-05-04 | International Business Machines Corporation | Elimination of SCR structure |
JPS5925381B2 (ja) * | 1977-12-30 | 1984-06-16 | 富士通株式会社 | 半導体集積回路装置 |
JPS5939904B2 (ja) * | 1978-09-28 | 1984-09-27 | 株式会社東芝 | 半導体装置 |
JPS58210660A (ja) * | 1982-06-01 | 1983-12-07 | Seiko Epson Corp | 半導体装置 |
EP0105985A1 (de) * | 1982-10-12 | 1984-04-25 | Mitsubishi Denki Kabushiki Kaisha | Integrierter Schaltkreis mit komplementärem Isolierschicht-Feldeffekt-Halbleiterelement |
JPS6017932A (ja) * | 1983-07-09 | 1985-01-29 | Fujitsu Ltd | ゲ−ト・アレイ |
-
1983
- 1983-09-30 JP JP58182069A patent/JPH0828480B2/ja not_active Expired - Lifetime
-
1984
- 1984-09-26 EP EP84306557A patent/EP0136880B1/de not_active Expired
- 1984-09-26 DE DE8484306557T patent/DE3468151D1/de not_active Expired
- 1984-09-28 KR KR8405989A patent/KR890003299B1/ko not_active IP Right Cessation
-
1986
- 1986-12-30 US US06/948,406 patent/US4701777A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS6074648A (ja) | 1985-04-26 |
EP0136880B1 (de) | 1987-12-16 |
JPH0828480B2 (ja) | 1996-03-21 |
EP0136880A1 (de) | 1985-04-10 |
KR890003299B1 (en) | 1989-09-06 |
US4701777A (en) | 1987-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |