DE3381190D1 - Ladungsuebertragungsvorrichtungen zur multiplexverarbeitung von signalen. - Google Patents

Ladungsuebertragungsvorrichtungen zur multiplexverarbeitung von signalen.

Info

Publication number
DE3381190D1
DE3381190D1 DE8383901618T DE3381190T DE3381190D1 DE 3381190 D1 DE3381190 D1 DE 3381190D1 DE 8383901618 T DE8383901618 T DE 8383901618T DE 3381190 T DE3381190 T DE 3381190T DE 3381190 D1 DE3381190 D1 DE 3381190D1
Authority
DE
Germany
Prior art keywords
signals
charge transfer
transfer devices
multiplex processing
multiplex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8383901618T
Other languages
English (en)
Inventor
Maki Sony Corporation Sato
Takeo Sony Corporati Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Application granted granted Critical
Publication of DE3381190D1 publication Critical patent/DE3381190D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • H01L27/1057—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components comprising charge coupled devices [CCD] or charge injection devices [CID]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14868—CCD or CID colour imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
    • H04N25/447—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by preserving the colour pattern with or without loss of information

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Color Television Image Signal Generators (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE8383901618T 1982-05-21 1983-05-19 Ladungsuebertragungsvorrichtungen zur multiplexverarbeitung von signalen. Expired - Lifetime DE3381190D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57086258A JPS58202685A (ja) 1982-05-21 1982-05-21 信号合成用電荷転送装置
PCT/JP1983/000150 WO1983004344A1 (en) 1982-05-21 1983-05-19 Charge transfer device for synthesizing signal

Publications (1)

Publication Number Publication Date
DE3381190D1 true DE3381190D1 (de) 1990-03-08

Family

ID=13881789

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383901618T Expired - Lifetime DE3381190D1 (de) 1982-05-21 1983-05-19 Ladungsuebertragungsvorrichtungen zur multiplexverarbeitung von signalen.

Country Status (5)

Country Link
US (1) US4628347A (de)
EP (1) EP0109445B1 (de)
JP (1) JPS58202685A (de)
DE (1) DE3381190D1 (de)
WO (1) WO1983004344A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2949861B2 (ja) * 1991-01-18 1999-09-20 日本電気株式会社 Ｃｃｄリニアイメージセンサ
JP2871185B2 (ja) * 1991-06-17 1999-03-17 ミノルタ株式会社 電荷結合装置
US5420534A (en) * 1993-10-27 1995-05-30 Loral Fairchild Corporation Programmable NxM switching system with charge-coupled device multiplexer
JP3482689B2 (ja) * 1994-05-27 2003-12-22 ソニー株式会社 固体撮像装置及びこれを用いたバーコード読取り装置
JP2005268411A (ja) * 2004-03-17 2005-09-29 Nec Electronics Corp 電荷転送装置及びその駆動方法
JP2007173774A (ja) * 2005-11-22 2007-07-05 Matsushita Electric Ind Co Ltd 固体撮像装置
JP4637033B2 (ja) * 2006-02-23 2011-02-23 富士フイルム株式会社 出力２分岐型固体撮像素子及び撮像装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1020656A (en) * 1973-03-22 1977-11-08 Choong-Ki Kim Buried-channel charge-coupled linear imaging device
US3971003A (en) * 1974-11-18 1976-07-20 Rca Corporation Charge coupled device imager
JPS51105284A (de) * 1975-02-28 1976-09-17 Fujitsu Ltd
US4028671A (en) * 1975-10-06 1977-06-07 Motorola, Inc. Charge coupled storage device multiplexer
US4211937A (en) * 1976-01-23 1980-07-08 Tokyo Shibaura Electric Co., Ltd. Multi-channel charge coupled transfer device
JPS5321519A (en) * 1976-08-12 1978-02-28 Fujitsu Ltd Spike noise elemination unit of solid image pickup unit
JPS5334417A (en) * 1976-09-10 1978-03-31 Sony Corp Solid state color pick up unit
JPS603717B2 (ja) * 1977-06-13 1985-01-30 日本電気株式会社 電荷転送装置
US4242700A (en) * 1979-01-22 1980-12-30 Rca Corporation Line transfer CCD imagers
JPS55163973A (en) * 1979-06-08 1980-12-20 Nec Corp Color solid-state pickup unit
US4287536A (en) * 1979-10-12 1981-09-01 Xerox Corporation Gain control for scanning arrays
JPS56116373A (en) * 1980-02-18 1981-09-12 Fujitsu Ltd Signal charge detection circuit for line sensor
JPS5854551B2 (ja) * 1980-06-23 1983-12-05 日本電気株式会社 カラ−固体撮像装置
DE3104456A1 (de) * 1981-02-09 1982-08-26 Siemens AG, 1000 Berlin und 8000 München Verfahren und anordnung zum herausfiltern des luminanzsignals aus einem fbas-fernsehsignal
JPS58190169A (ja) * 1982-04-30 1983-11-07 Toshiba Corp 固体撮像装置
US4551758A (en) * 1982-06-09 1985-11-05 Canon Kabushiki Kaisha Image pick-up device and system
JPS5984575A (ja) * 1982-11-08 1984-05-16 Hitachi Ltd 固体撮像素子
US4513313A (en) * 1982-12-07 1985-04-23 Canon Kabushiki Kaisha Solid state imaging device
US4575763A (en) * 1984-12-12 1986-03-11 Rca Corporation CCD with number of clocking signal phases increasing in later charge transfer stages

Also Published As

Publication number Publication date
EP0109445B1 (de) 1990-01-31
JPH0474909B2 (de) 1992-11-27
US4628347A (en) 1986-12-09
WO1983004344A1 (en) 1983-12-08
EP0109445A4 (de) 1986-01-07
JPS58202685A (ja) 1983-11-25
EP0109445A1 (de) 1984-05-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee