DE3376044D1 - Lead frame and method - Google Patents

Lead frame and method

Info

Publication number
DE3376044D1
DE3376044D1 DE8383902475T DE3376044T DE3376044D1 DE 3376044 D1 DE3376044 D1 DE 3376044D1 DE 8383902475 T DE8383902475 T DE 8383902475T DE 3376044 T DE3376044 T DE 3376044T DE 3376044 D1 DE3376044 D1 DE 3376044D1
Authority
DE
Germany
Prior art keywords
lead frame
lead
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383902475T
Other languages
German (de)
English (en)
Inventor
Raymond Jones
John Lawson
O'dell Keil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE3376044D1 publication Critical patent/DE3376044D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10W70/40—
    • H10P72/74—
    • H10W70/411—
    • H10P72/7418—
    • H10W72/0198—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
DE8383902475T 1982-07-12 1983-06-15 Lead frame and method Expired DE3376044D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/397,662 US4480150A (en) 1982-07-12 1982-07-12 Lead frame and method
PCT/US1983/000937 WO1984000444A1 (en) 1982-07-12 1983-06-15 Lead frame and method

Publications (1)

Publication Number Publication Date
DE3376044D1 true DE3376044D1 (en) 1988-04-21

Family

ID=23572127

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383902475T Expired DE3376044D1 (en) 1982-07-12 1983-06-15 Lead frame and method

Country Status (8)

Country Link
US (1) US4480150A (OSRAM)
EP (1) EP0113763B1 (OSRAM)
JP (1) JPS59501387A (OSRAM)
KR (1) KR910001421B1 (OSRAM)
DE (1) DE3376044D1 (OSRAM)
IT (1) IT1172287B (OSRAM)
MY (1) MY100275A (OSRAM)
WO (1) WO1984000444A1 (OSRAM)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646127A (en) * 1985-09-03 1987-02-24 Gte Products Corporation Scrap-less taping system for IC lead-frames
US4597816A (en) * 1985-09-03 1986-07-01 Gte Products Corporation Scrap-less taping system for IC lead-frames
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
AU8034087A (en) * 1987-02-20 1988-09-14 Lsi Logic Corporation Integrated circuit package assembly
FR2622353B1 (fr) * 1987-10-22 1990-03-23 Bendix Electronics Sa Produit en bande pour supporter et convoyer des composants electroniques et procede pour sa fabrication
US4859632A (en) * 1987-12-28 1989-08-22 Siemens Corporate Research And Support, Inc. Method for manufacturing the same
JPH0622111B2 (ja) * 1989-08-29 1994-03-23 スタンレー電気株式会社 基板装着用電球及びその製造方法
JP3088193B2 (ja) * 1992-06-05 2000-09-18 三菱電機株式会社 Ｌｏｃ構造を有する半導体装置の製造方法並びにこれに使用するリードフレーム
JPH06196603A (ja) * 1992-12-23 1994-07-15 Shinko Electric Ind Co Ltd リードフレームの製造方法
US5587890A (en) * 1994-08-08 1996-12-24 Cooper Industries, Inc. Vehicle electric power distribution system
US5706952A (en) * 1996-01-11 1998-01-13 Autosplice Systems Inc. Continuous carrier for electrical or mechanical components
US6202853B1 (en) 1996-01-11 2001-03-20 Autosplice Systems, Inc. Secondary processing for electrical or mechanical components molded to continuous carrier supports
US6107910A (en) 1996-11-29 2000-08-22 X-Cyte, Inc. Dual mode transmitter/receiver and decoder for RF transponder tags
US5892178A (en) * 1997-03-20 1999-04-06 Qualcomm Incorporated Support fixture for control panel assembly
US6208062B1 (en) 1997-08-18 2001-03-27 X-Cyte, Inc. Surface acoustic wave transponder configuration
US6114971A (en) * 1997-08-18 2000-09-05 X-Cyte, Inc. Frequency hopping spread spectrum passive acoustic wave identification device
US5986382A (en) 1997-08-18 1999-11-16 X-Cyte, Inc. Surface acoustic wave transponder configuration
US6060815A (en) * 1997-08-18 2000-05-09 X-Cyte, Inc. Frequency mixing passive transponder
US6574858B1 (en) 1998-02-13 2003-06-10 Micron Technology, Inc. Method of manufacturing a chip package
US6386959B2 (en) * 1999-01-13 2002-05-14 Micro Contacts Inc. Feeding system for electro-chemically polishing contact tips
US8497697B2 (en) 2010-06-14 2013-07-30 Analog Devices, Inc. Apparatus and method for testing multiple integrated circuit devices on a film frame handler

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3426423A (en) * 1965-07-08 1969-02-11 Molectro Corp Method of manufacturing semiconductors
DE2246208A1 (de) * 1971-09-22 1973-03-29 Circuit Materials Division Dod Verfahren zur herstellung von gedruckten schaltungen
JPS5620169B2 (OSRAM) * 1973-05-18 1981-05-12
DD143331A1 (de) * 1979-04-27 1980-08-13 Lessig Hans Joerg Filmtraegerbonden und zwischentraeger
JPS55150264A (en) * 1979-05-10 1980-11-22 Mitsubishi Electric Corp Lead frame for semiconductor device and method of fabricating the same
FR2503673A1 (fr) * 1981-04-08 1982-10-15 Philips Nv Emballage pour composants electroniques

Also Published As

Publication number Publication date
EP0113763A1 (en) 1984-07-25
IT1172287B (it) 1987-06-18
IT8348635A1 (it) 1985-01-06
JPS59501387A (ja) 1984-08-02
KR840005607A (ko) 1984-11-14
WO1984000444A1 (en) 1984-02-02
MY100275A (en) 1990-07-28
EP0113763B1 (en) 1988-03-16
IT8348635A0 (it) 1983-07-06
EP0113763A4 (en) 1984-11-16
JPH035666B2 (OSRAM) 1991-01-28
US4480150A (en) 1984-10-30
KR910001421B1 (ko) 1991-03-05

Similar Documents

Publication Publication Date Title
DE3369465D1 (en) Bone-equivalent and method for preparation thereof
GB2127067B (en) Well completion method and apparatus
GB8334625D0 (en) Slit-score method
ZA838242B (en) Clearance-controlling means and methods
DE3376044D1 (en) Lead frame and method
PL242971A1 (en) Antiphlogistine obtaining method
DE3367259D1 (en) Lead frame and method for manufacturing the same
GB2131464B (en) Fabric and method
GB2131001B (en) Currency-dispensing method and apparatus
DE3474540D1 (en) Yarn-threading method
ZA84653B (en) Field subassembly and method
EP0139528A3 (en) Lead member and method for fixing thereof
DE3267155D1 (en) Method and arrangement for increasing frame frequency
GB8307963D0 (en) Method and apparatus
GB8300241D0 (en) Cover and frame assemblies
JPS5771356A (en) Klosh frame and klosh
GB8305920D0 (en) Cover and frame assemblies
DE3362705D1 (en) Drawing frame
GB2129356B (en) Billet-shearing method and apparatus
DE3462929D1 (en) Drawing frame
EP0355870A3 (en) Lead attachment method
IL75877A0 (en) Lead frame taping method and device
GB8420219D0 (en) Frame
GB8304124D0 (en) Frame
GB2142854B (en) Draw-bending apparatus and method

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee