DE3337156C2 - - Google Patents

Info

Publication number
DE3337156C2
DE3337156C2 DE3337156A DE3337156A DE3337156C2 DE 3337156 C2 DE3337156 C2 DE 3337156C2 DE 3337156 A DE3337156 A DE 3337156A DE 3337156 A DE3337156 A DE 3337156A DE 3337156 C2 DE3337156 C2 DE 3337156C2
Authority
DE
Germany
Prior art keywords
semiconductor
region
conductivity type
layer
semiconductor region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3337156A
Other languages
German (de)
English (en)
Other versions
DE3337156A1 (de
Inventor
Mitsuo Tsuzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE3337156A1 publication Critical patent/DE3337156A1/de
Application granted granted Critical
Publication of DE3337156C2 publication Critical patent/DE3337156C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/20—Breakdown diodes, e.g. avalanche diodes
    • H10D8/25—Zener diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
    • H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors

Landscapes

  • Bipolar Transistors (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE19833337156 1982-10-12 1983-10-12 Halbleitervorrichtung Granted DE3337156A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57178807A JPS5967670A (ja) 1982-10-12 1982-10-12 半導体装置

Publications (2)

Publication Number Publication Date
DE3337156A1 DE3337156A1 (de) 1984-04-12
DE3337156C2 true DE3337156C2 (enrdf_load_stackoverflow) 1988-11-17

Family

ID=16054992

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833337156 Granted DE3337156A1 (de) 1982-10-12 1983-10-12 Halbleitervorrichtung

Country Status (3)

Country Link
US (1) US4599631A (enrdf_load_stackoverflow)
JP (1) JPS5967670A (enrdf_load_stackoverflow)
DE (1) DE3337156A1 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226971A (ja) * 1985-03-30 1986-10-08 Toshiba Corp 半導体装置
JPS61201353U (enrdf_load_stackoverflow) * 1985-06-04 1986-12-17
US4705322A (en) * 1985-07-05 1987-11-10 American Telephone And Telegraph Company, At&T Bell Laboratories Protection of inductive load switching transistors from inductive surge created overvoltage conditions
US5023194A (en) * 1988-02-11 1991-06-11 Exar Corporation Method of making a multicollector vertical pnp transistor
JPH02185069A (ja) * 1988-12-02 1990-07-19 Motorola Inc 高エネルギー阻止能力及び温度補償された阻止電圧を具備する半導体デバイス
US5142348A (en) * 1989-08-16 1992-08-25 Matsushita Electronics Corporation Lateral thyristor
US5519242A (en) * 1994-08-17 1996-05-21 David Sarnoff Research Center, Inc. Electrostatic discharge protection circuit for a NMOS or lateral NPN transistor
US5701071A (en) * 1995-08-21 1997-12-23 Fujitsu Limited Systems for controlling power consumption in integrated circuits
JPH10189761A (ja) * 1996-12-20 1998-07-21 Fuji Electric Co Ltd 半導体装置
US6933546B2 (en) * 2003-03-17 2005-08-23 Freescale Semiconductor, Inc. Semiconductor component
TW201250985A (en) * 2011-06-10 2012-12-16 Raydium Semiconductor Corp Electrostatic discharge protection circuit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE361555B (enrdf_load_stackoverflow) * 1969-06-10 1973-11-05 Rca Corp
JPS5321838B2 (enrdf_load_stackoverflow) * 1973-02-28 1978-07-05
US4100561A (en) * 1976-05-24 1978-07-11 Rca Corp. Protective circuit for MOS devices
JPS6048765B2 (ja) * 1977-12-19 1985-10-29 日本電気株式会社 定電圧半導体集積回路
US4267557A (en) * 1978-06-08 1981-05-12 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device
JPS5571075A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Zener diode
US4451839A (en) * 1980-09-12 1984-05-29 National Semiconductor Corporation Bilateral zener trim

Also Published As

Publication number Publication date
US4599631A (en) 1986-07-08
JPS5967670A (ja) 1984-04-17
DE3337156A1 (de) 1984-04-12

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee