DE3311256A1 - Vorrichtung und verfahren zum nailhead-kontaktieren eines bauelements - Google Patents

Vorrichtung und verfahren zum nailhead-kontaktieren eines bauelements

Info

Publication number
DE3311256A1
DE3311256A1 DE19833311256 DE3311256A DE3311256A1 DE 3311256 A1 DE3311256 A1 DE 3311256A1 DE 19833311256 DE19833311256 DE 19833311256 DE 3311256 A DE3311256 A DE 3311256A DE 3311256 A1 DE3311256 A1 DE 3311256A1
Authority
DE
Germany
Prior art keywords
nozzle
component
contact
nailhead
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19833311256
Other languages
German (de)
English (en)
Other versions
DE3311256C2 (cg-RX-API-DMAC10.html
Inventor
Alfred Dr. 8400 Regensburg Engl
Oswald 8412 Burglengenfeld Hainz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19833311256 priority Critical patent/DE3311256A1/de
Publication of DE3311256A1 publication Critical patent/DE3311256A1/de
Application granted granted Critical
Publication of DE3311256C2 publication Critical patent/DE3311256C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45164—Palladium (Pd) as principal constituent
    • H10W72/07141—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE19833311256 1983-03-28 1983-03-28 Vorrichtung und verfahren zum nailhead-kontaktieren eines bauelements Granted DE3311256A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19833311256 DE3311256A1 (de) 1983-03-28 1983-03-28 Vorrichtung und verfahren zum nailhead-kontaktieren eines bauelements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833311256 DE3311256A1 (de) 1983-03-28 1983-03-28 Vorrichtung und verfahren zum nailhead-kontaktieren eines bauelements

Publications (2)

Publication Number Publication Date
DE3311256A1 true DE3311256A1 (de) 1984-10-11
DE3311256C2 DE3311256C2 (cg-RX-API-DMAC10.html) 1987-10-22

Family

ID=6194881

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833311256 Granted DE3311256A1 (de) 1983-03-28 1983-03-28 Vorrichtung und verfahren zum nailhead-kontaktieren eines bauelements

Country Status (1)

Country Link
DE (1) DE3311256A1 (cg-RX-API-DMAC10.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2008817A1 (de) * 1970-02-25 1971-09-09 Siemens Ag Verfahren zum Abtrennen überstehender Drahtenden

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2008817A1 (de) * 1970-02-25 1971-09-09 Siemens Ag Verfahren zum Abtrennen überstehender Drahtenden

Also Published As

Publication number Publication date
DE3311256C2 (cg-RX-API-DMAC10.html) 1987-10-22

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee