DE3274015D1 - Pattern detection system - Google Patents

Pattern detection system

Info

Publication number
DE3274015D1
DE3274015D1 DE8282106185T DE3274015T DE3274015D1 DE 3274015 D1 DE3274015 D1 DE 3274015D1 DE 8282106185 T DE8282106185 T DE 8282106185T DE 3274015 T DE3274015 T DE 3274015T DE 3274015 D1 DE3274015 D1 DE 3274015D1
Authority
DE
Germany
Prior art keywords
detection system
pattern detection
pattern
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282106185T
Other languages
English (en)
Inventor
Yasuhiko Hara
Nobuyuki Akiyama
Satoru Fushimi
Yoshimasa Oshima
Nobuhiko Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10888581A external-priority patent/JPS5810833A/ja
Priority claimed from JP16574481A external-priority patent/JPS5867039A/ja
Priority claimed from JP17716181A external-priority patent/JPS5879104A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE3274015D1 publication Critical patent/DE3274015D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE8282106185T 1981-07-14 1982-07-12 Pattern detection system Expired DE3274015D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10888581A JPS5810833A (ja) 1981-07-14 1981-07-14 パタ−ンの検出方法及び同装置
JP16574481A JPS5867039A (ja) 1981-10-19 1981-10-19 暗視野照明装置
JP17716181A JPS5879104A (ja) 1981-11-06 1981-11-06 パタ−ン比較検査装置

Publications (1)

Publication Number Publication Date
DE3274015D1 true DE3274015D1 (en) 1986-12-04

Family

ID=27311343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282106185T Expired DE3274015D1 (en) 1981-07-14 1982-07-12 Pattern detection system

Country Status (3)

Country Link
US (1) US4508453A (de)
EP (1) EP0070017B1 (de)
DE (1) DE3274015D1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963725A (ja) * 1982-10-05 1984-04-11 Toshiba Corp パタ−ン検査装置
DE3475106D1 (en) * 1983-04-15 1988-12-15 Hitachi Ltd Method and apparatus for detecting defects of printed circuit patterns
EP0124113B1 (de) * 1983-04-28 1989-03-01 Hitachi, Ltd. Verfahren und Einrichtung zur Feststellung von Fehlern in Mustern
JPS60119407A (ja) * 1983-11-30 1985-06-26 Nippon Kogaku Kk <Nikon> 比較検査装置
US4618938A (en) * 1984-02-22 1986-10-21 Kla Instruments Corporation Method and apparatus for automatic wafer inspection
NL8401416A (nl) * 1984-05-03 1985-12-02 Thomassen & Drijver Inrichting voor het opsporen van houders met een afwijkende eigenschap.
JPH0616013B2 (ja) * 1984-11-22 1994-03-02 肇産業株式会社 自動検査装置
US4856904A (en) * 1985-01-21 1989-08-15 Nikon Corporation Wafer inspecting apparatus
FR2605115A1 (fr) * 1986-10-01 1988-04-15 Primat Didier Dispositif d'acquisition optique multivoies a eclairage integre
US4969200A (en) * 1988-03-25 1990-11-06 Texas Instruments Incorporated Target autoalignment for pattern inspector or writer
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US5198878A (en) * 1990-11-30 1993-03-30 International Business Machines Corporation Substrate machining verifier
JPH0728226A (ja) * 1993-04-30 1995-01-31 Internatl Business Mach Corp <Ibm> 領域的イメージを測定する装置及び方法
JP3228197B2 (ja) * 1997-10-15 2001-11-12 株式会社デンソー 光学情報読取装置および記録媒体
EP0930498A3 (de) * 1997-12-26 1999-11-17 Nidek Co., Ltd. Prüfeinrichtung und Verfahren zum Erfassen von Fehlstellen
US6873363B1 (en) * 1999-02-16 2005-03-29 Micron Technology Inc. Technique for flagging oversaturated pixels
US6693664B2 (en) * 1999-06-30 2004-02-17 Negevtech Method and system for fast on-line electro-optical detection of wafer defects
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
DE102004015326A1 (de) * 2004-03-30 2005-10-20 Leica Microsystems Vorrichtung und Verfahren zur Inspektion eines Halbleiterbauteils
US7177012B2 (en) * 2004-10-18 2007-02-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4996856B2 (ja) * 2006-01-23 2012-08-08 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
JP4890096B2 (ja) * 2006-05-19 2012-03-07 浜松ホトニクス株式会社 画像取得装置、画像取得方法、及び画像取得プログラム
US20080145040A1 (en) * 2006-12-19 2008-06-19 Cytyc Corporation Simultaneous imaging of multiple specimen slides on a single slide stage
US20100006785A1 (en) * 2008-07-14 2010-01-14 Moshe Finarov Method and apparatus for thin film quality control
US8812149B2 (en) 2011-02-24 2014-08-19 Mss, Inc. Sequential scanning of multiple wavelengths
US9952162B2 (en) * 2013-12-13 2018-04-24 Robert Scott Simmons Optical inspection system for printed circuit board or the like
JP7353757B2 (ja) * 2015-07-13 2023-10-02 レニショウ パブリック リミテッド カンパニー アーチファクトを測定するための方法
JP2018063160A (ja) * 2016-10-12 2018-04-19 富士通株式会社 検査装置および検査方法
DE102018202096A1 (de) * 2018-02-12 2019-08-14 Carl Zeiss Smt Gmbh Bildsensor für eine positionssensorvorrichtung, positionssensorvorrichtung mit einem bildsensor, lithographieanlage mit einer positionssensorvorrichtung und verfahren zum betreiben eines bildsensors

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2321229A1 (fr) * 1975-08-13 1977-03-11 Cit Alcatel Procede et appareillage pour controle automatique de graphisme
DE2628358A1 (de) * 1976-06-24 1977-12-29 Siemens Ag Anordnung zum automatischen erkennen eines musters, insbesondere zur lageerkennung eines bildmusters
JPS5371563A (en) * 1976-12-08 1978-06-26 Hitachi Ltd Automatic inspection correcting method for mask
US4112469A (en) * 1977-04-21 1978-09-05 The Mead Corporation Jet drop copying apparatus
US4274745A (en) * 1977-05-12 1981-06-23 Eisai Co., Ltd. Method and apparatus for detecting foreign matters in liquids
JPS5419366A (en) * 1977-07-14 1979-02-14 Nippon Jidoseigyo Ltd Device for inspecting fault of pattern
JPS5419664A (en) * 1977-07-15 1979-02-14 Nippon Jidoseigyo Ltd Device for inspecting fault of pattern
JPS55142254A (en) * 1979-04-25 1980-11-06 Hitachi Ltd Inspecting method for pattern of printed wiring board
DD146500A1 (de) * 1979-10-16 1981-02-11 Eberhard Degenkolbe Anordnung zur automatischen pruefung von photomasken
US4389669A (en) * 1981-02-27 1983-06-21 Ilc Data Device Corporation Opto-video inspection system

Also Published As

Publication number Publication date
US4508453A (en) 1985-04-02
EP0070017B1 (de) 1986-10-29
EP0070017A1 (de) 1983-01-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee