DE3228457A1 - Elektrisches bauelement - Google Patents

Elektrisches bauelement

Info

Publication number
DE3228457A1
DE3228457A1 DE19823228457 DE3228457A DE3228457A1 DE 3228457 A1 DE3228457 A1 DE 3228457A1 DE 19823228457 DE19823228457 DE 19823228457 DE 3228457 A DE3228457 A DE 3228457A DE 3228457 A1 DE3228457 A1 DE 3228457A1
Authority
DE
Germany
Prior art keywords
housing
electronic component
welds
protect
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19823228457
Other languages
German (de)
English (en)
Inventor
Manfred Dipl.-Ing. 7141 Schwieberdingen Frister
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19823228457 priority Critical patent/DE3228457A1/de
Priority to FR8307946A priority patent/FR2531269B1/fr
Priority to US06/504,840 priority patent/US4571612A/en
Priority to JP58134549A priority patent/JPS5939052A/ja
Publication of DE3228457A1 publication Critical patent/DE3228457A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Thermistors And Varistors (AREA)
  • Coils Or Transformers For Communication (AREA)
DE19823228457 1982-07-30 1982-07-30 Elektrisches bauelement Ceased DE3228457A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19823228457 DE3228457A1 (de) 1982-07-30 1982-07-30 Elektrisches bauelement
FR8307946A FR2531269B1 (fr) 1982-07-30 1983-05-11 Element de construction electrique contenant un element de construction electronique
US06/504,840 US4571612A (en) 1982-07-30 1983-06-16 Corrosion-protected electrical circuit component
JP58134549A JPS5939052A (ja) 1982-07-30 1983-07-25 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823228457 DE3228457A1 (de) 1982-07-30 1982-07-30 Elektrisches bauelement

Publications (1)

Publication Number Publication Date
DE3228457A1 true DE3228457A1 (de) 1984-02-02

Family

ID=6169690

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823228457 Ceased DE3228457A1 (de) 1982-07-30 1982-07-30 Elektrisches bauelement

Country Status (4)

Country Link
US (1) US4571612A (enExample)
JP (1) JPS5939052A (enExample)
DE (1) DE3228457A1 (enExample)
FR (1) FR2531269B1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5252856A (en) * 1990-09-26 1993-10-12 Nec Corporation Optical semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271638A (en) * 1963-11-04 1966-09-06 Emil M Murad Encased semiconductor with heat conductive and protective insulative encapsulation
JPS432111Y1 (enExample) * 1964-05-23 1968-01-29
DE2305484C3 (de) * 1973-02-05 1978-08-24 Siemens Ag, 1000 Berlin Und 8000 Muenchen Erregereinrichtung für eine gleichstromerregte Drehstrom-Lichtmaschine
JPS49135749U (enExample) * 1973-03-24 1974-11-21
DE7314657U (de) * 1973-04-17 1973-07-19 Roederstein Spezialfabrik Fuer Kondensatoren Gmbh Bauelementetrager
JPS502506U (enExample) * 1973-05-08 1975-01-11
JPS51113464A (en) * 1975-03-28 1976-10-06 Fujitsu Ltd Compound electronic component manufacturing system
US4115838A (en) * 1976-08-17 1978-09-19 General Time Corporation Packaging of a semiconductor
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel

Also Published As

Publication number Publication date
JPH0558261B2 (enExample) 1993-08-26
FR2531269B1 (fr) 1986-05-09
FR2531269A1 (fr) 1984-02-03
JPS5939052A (ja) 1984-03-03
US4571612A (en) 1986-02-18

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