DE3221794A1 - Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente - Google Patents

Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente

Info

Publication number
DE3221794A1
DE3221794A1 DE19823221794 DE3221794A DE3221794A1 DE 3221794 A1 DE3221794 A1 DE 3221794A1 DE 19823221794 DE19823221794 DE 19823221794 DE 3221794 A DE3221794 A DE 3221794A DE 3221794 A1 DE3221794 A1 DE 3221794A1
Authority
DE
Germany
Prior art keywords
pressure contact
pressure
disc
semiconductor cell
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823221794
Other languages
German (de)
English (en)
Other versions
DE3221794C2 (https=
Inventor
Dieter Dipl.-Phys. Eisele
Bertold 6840 Lampertheim Hahn
Klaus Dipl.-Ing. Weimann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AG Germany
Original Assignee
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Germany
Priority to DE19823221794 priority Critical patent/DE3221794A1/de
Priority to EP83105006A priority patent/EP0096266B1/de
Priority to JP58101042A priority patent/JPS593938A/ja
Publication of DE3221794A1 publication Critical patent/DE3221794A1/de
Application granted granted Critical
Publication of DE3221794C2 publication Critical patent/DE3221794C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings

Landscapes

  • Die Bonding (AREA)
  • Thyristors (AREA)
DE19823221794 1982-06-09 1982-06-09 Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente Granted DE3221794A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE19823221794 DE3221794A1 (de) 1982-06-09 1982-06-09 Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
EP83105006A EP0096266B1 (de) 1982-06-09 1983-05-20 Scheibenförmige Halbleiterzelle für druckkontaktierbare Leistungshalbleiterbauelemente
JP58101042A JPS593938A (ja) 1982-06-09 1983-06-08 円板状半導体セルおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823221794 DE3221794A1 (de) 1982-06-09 1982-06-09 Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente

Publications (2)

Publication Number Publication Date
DE3221794A1 true DE3221794A1 (de) 1983-12-15
DE3221794C2 DE3221794C2 (https=) 1988-05-19

Family

ID=6165727

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823221794 Granted DE3221794A1 (de) 1982-06-09 1982-06-09 Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente

Country Status (3)

Country Link
EP (1) EP0096266B1 (https=)
JP (1) JPS593938A (https=)
DE (1) DE3221794A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862248A (en) * 1984-01-28 1989-08-29 U.S. Philips Corporation Contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3612813A1 (de) * 1985-04-16 1986-10-23 Mitsubishi Denki K.K., Tokio/Tokyo Halbleiter-bauelement
FR2598031B1 (fr) * 1986-04-29 1988-12-02 Alsthom Boitier pour semi-conducteur de puissance
US7132698B2 (en) * 2002-01-25 2006-11-07 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring
JP5040234B2 (ja) 2006-09-26 2012-10-03 三菱電機株式会社 圧接型半導体装置
JP6011206B2 (ja) * 2012-09-27 2016-10-19 三菱電機株式会社 圧接型半導体装置、圧接型半導体装置の製造方法
DE102015109186A1 (de) 2015-06-10 2016-12-15 Infineon Technologies Ag Halbleiteranordnung, Halbleitersystem und Verfahren zur Ausbildung einer Halbleiteranordnung
CN108198764B (zh) * 2017-12-18 2019-07-02 重庆市长寿区普爱网络科技有限公司 电子元器件制造方法
CN111681995B (zh) * 2020-04-29 2022-09-09 株洲中车时代半导体有限公司 晶闸管元件、晶闸管元件装配结构及软启动器

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3837000A (en) * 1972-11-21 1974-09-17 Siemens Ag Semiconductor device having a silver layer in pressure contact with the device surface
US4041523A (en) * 1975-06-06 1977-08-09 Siemens Aktiengesellschaft A controllable semiconductor component having massive heat dissipating conically shaped metal bodies
DE2719400A1 (de) * 1977-04-30 1978-11-09 Licentia Gmbh Scheibenfoermige halbleiterzelle
DE2749359A1 (de) * 1977-11-04 1979-05-10 Bbc Brown Boveri & Cie Anschlussfertiges halbleiterbauelement
DE2825682A1 (de) * 1978-06-12 1979-12-20 Bbc Brown Boveri & Cie Halbleiterbauelement mit isoliergehaeuse
DE2942585A1 (de) * 1978-10-23 1980-05-08 Bbc Brown Boveri & Cie Leistungs-halbleiterbauelement
DE2952493A1 (de) * 1978-12-28 1980-07-10 Hitachi Chemical Co Ltd Verfahren zur herstellung von halbleitergehaeusen
DE2654532B2 (de) * 1976-12-02 1981-07-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Scheibenförmige Halbleiterzelle

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
DE1944181A1 (de) * 1969-08-30 1971-03-11 Bbc Brown Boveri & Cie Druckkontakt-Halbleiterbauelement
DE2118356A1 (de) * 1971-04-15 1972-10-26 Siemens AG, 1000 Berlin u. 8000 München Scheibenförmiges Halbleiterbauelement

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3837000A (en) * 1972-11-21 1974-09-17 Siemens Ag Semiconductor device having a silver layer in pressure contact with the device surface
US4041523A (en) * 1975-06-06 1977-08-09 Siemens Aktiengesellschaft A controllable semiconductor component having massive heat dissipating conically shaped metal bodies
DE2654532B2 (de) * 1976-12-02 1981-07-09 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Scheibenförmige Halbleiterzelle
DE2719400A1 (de) * 1977-04-30 1978-11-09 Licentia Gmbh Scheibenfoermige halbleiterzelle
DE2749359A1 (de) * 1977-11-04 1979-05-10 Bbc Brown Boveri & Cie Anschlussfertiges halbleiterbauelement
DE2825682A1 (de) * 1978-06-12 1979-12-20 Bbc Brown Boveri & Cie Halbleiterbauelement mit isoliergehaeuse
DE2942585A1 (de) * 1978-10-23 1980-05-08 Bbc Brown Boveri & Cie Leistungs-halbleiterbauelement
DE2952493A1 (de) * 1978-12-28 1980-07-10 Hitachi Chemical Co Ltd Verfahren zur herstellung von halbleitergehaeusen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862248A (en) * 1984-01-28 1989-08-29 U.S. Philips Corporation Contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements

Also Published As

Publication number Publication date
EP0096266B1 (de) 1988-09-28
EP0096266A2 (de) 1983-12-21
JPS593938A (ja) 1984-01-10
DE3221794C2 (https=) 1988-05-19
EP0096266A3 (en) 1986-03-19

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Legal Events

Date Code Title Description
8101 Request for examination as to novelty
8105 Search report available
8110 Request for examination paragraph 44
8127 New person/name/address of the applicant

Owner name: BBC BROWN BOVERI AG, 6800 MANNHEIM, DE

D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ASEA BROWN BOVERI AG, 6800 MANNHEIM, DE

8339 Ceased/non-payment of the annual fee