DE3202271A1 - Vorrichtung zum abfuehren der verlustwaerme von steckplatinen - Google Patents

Vorrichtung zum abfuehren der verlustwaerme von steckplatinen

Info

Publication number
DE3202271A1
DE3202271A1 DE19823202271 DE3202271A DE3202271A1 DE 3202271 A1 DE3202271 A1 DE 3202271A1 DE 19823202271 DE19823202271 DE 19823202271 DE 3202271 A DE3202271 A DE 3202271A DE 3202271 A1 DE3202271 A1 DE 3202271A1
Authority
DE
Germany
Prior art keywords
board
heat
hollow profile
edges
tongues
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823202271
Other languages
German (de)
English (en)
Other versions
DE3202271C2 (enrdf_load_stackoverflow
Inventor
Walter Dipl.-Phys. 3000 Hannover Baum
Friedrich Dr.-Ing. 4020 Mettmann Nordmeyer
Klausdieter Dipl.-Ing. Schippl
Karl-Heinz Stobäus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kabelmetal Electro GmbH
Original Assignee
Kabelmetal Electro GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabelmetal Electro GmbH filed Critical Kabelmetal Electro GmbH
Priority to DE19823202271 priority Critical patent/DE3202271A1/de
Publication of DE3202271A1 publication Critical patent/DE3202271A1/de
Application granted granted Critical
Publication of DE3202271C2 publication Critical patent/DE3202271C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE19823202271 1982-01-25 1982-01-25 Vorrichtung zum abfuehren der verlustwaerme von steckplatinen Granted DE3202271A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19823202271 DE3202271A1 (de) 1982-01-25 1982-01-25 Vorrichtung zum abfuehren der verlustwaerme von steckplatinen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823202271 DE3202271A1 (de) 1982-01-25 1982-01-25 Vorrichtung zum abfuehren der verlustwaerme von steckplatinen

Publications (2)

Publication Number Publication Date
DE3202271A1 true DE3202271A1 (de) 1983-07-28
DE3202271C2 DE3202271C2 (enrdf_load_stackoverflow) 1987-05-21

Family

ID=6153856

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823202271 Granted DE3202271A1 (de) 1982-01-25 1982-01-25 Vorrichtung zum abfuehren der verlustwaerme von steckplatinen

Country Status (1)

Country Link
DE (1) DE3202271A1 (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3705881A1 (de) * 1986-02-25 1987-08-27 Amada Co Ltd Gaslasergenerator
DE4028003A1 (de) * 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
DE4437971A1 (de) * 1994-10-24 1996-05-02 Siemens Ag Kühleinrichtung für elektrische Baugruppen
EP2190277A1 (de) * 2008-11-24 2010-05-26 Siemens Aktiengesellschaft Vorrichtung zur Befestigung einer elektronischen Baugruppe
EP2285199A1 (de) 2009-08-11 2011-02-16 Siemens Aktiengesellschaft Modulare Vorrichtung und Baugruppe

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1006053A (en) * 1963-05-15 1965-09-29 Decca Ltd Improvements in or relating to the construction of electrical equipment
US3631325A (en) * 1970-06-15 1971-12-28 Sperry Rand Corp Card module and end wall treatment facilitating heat transfer and sliding
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
GB1521464A (en) * 1975-10-15 1978-08-16 Thorn Automation Ltd Mounting of electrical equipment for cooling
US4283754A (en) * 1979-03-26 1981-08-11 Bunker Ramo Corporation Cooling system for multiwafer high density circuit
US4298904A (en) * 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1006053A (en) * 1963-05-15 1965-09-29 Decca Ltd Improvements in or relating to the construction of electrical equipment
US3631325A (en) * 1970-06-15 1971-12-28 Sperry Rand Corp Card module and end wall treatment facilitating heat transfer and sliding
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
GB1484831A (en) * 1975-03-17 1977-09-08 Hughes Aircraft Co Heat pipe thermal mounting plate for cooling circuit card-mounted electronic components
GB1521464A (en) * 1975-10-15 1978-08-16 Thorn Automation Ltd Mounting of electrical equipment for cooling
US4283754A (en) * 1979-03-26 1981-08-11 Bunker Ramo Corporation Cooling system for multiwafer high density circuit
US4298904A (en) * 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3705881A1 (de) * 1986-02-25 1987-08-27 Amada Co Ltd Gaslasergenerator
DE4028003A1 (de) * 1990-09-04 1992-03-05 Messerschmitt Boelkow Blohm Klemmelement zur halterung von elektronik-karten
US5262587A (en) * 1990-09-04 1993-11-16 Messerschmitt-Bolkow-Blohm Gmbh Clamping element for holding electronic cards
DE4437971A1 (de) * 1994-10-24 1996-05-02 Siemens Ag Kühleinrichtung für elektrische Baugruppen
US5901036A (en) * 1994-10-24 1999-05-04 Siemens Aktiengesellschaft Cooling device for electrical assemblies
EP2190277A1 (de) * 2008-11-24 2010-05-26 Siemens Aktiengesellschaft Vorrichtung zur Befestigung einer elektronischen Baugruppe
EP2285199A1 (de) 2009-08-11 2011-02-16 Siemens Aktiengesellschaft Modulare Vorrichtung und Baugruppe

Also Published As

Publication number Publication date
DE3202271C2 (enrdf_load_stackoverflow) 1987-05-21

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee