DE3176475D1 - Cooling means for integrated circuit chip device - Google Patents

Cooling means for integrated circuit chip device

Info

Publication number
DE3176475D1
DE3176475D1 DE8282900586T DE3176475T DE3176475D1 DE 3176475 D1 DE3176475 D1 DE 3176475D1 DE 8282900586 T DE8282900586 T DE 8282900586T DE 3176475 T DE3176475 T DE 3176475T DE 3176475 D1 DE3176475 D1 DE 3176475D1
Authority
DE
Germany
Prior art keywords
pref
chip
heat transfer
transfer element
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282900586T
Other languages
German (de)
English (en)
Inventor
Javathu K Hassan
Sevgin Oktay
John A Paivanas
Clarence J Spector
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3176475D1 publication Critical patent/DE3176475D1/de
Expired legal-status Critical Current

Links

Classifications

    • H10W40/258—
    • H10W40/774—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/877—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8282900586T 1981-12-29 1981-12-29 Cooling means for integrated circuit chip device Expired DE3176475D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1981/001754 WO1983002363A1 (en) 1981-12-29 1981-12-29 Cooling means for integrated circuit chip device

Publications (1)

Publication Number Publication Date
DE3176475D1 true DE3176475D1 (en) 1987-11-05

Family

ID=22161583

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282900586T Expired DE3176475D1 (en) 1981-12-29 1981-12-29 Cooling means for integrated circuit chip device

Country Status (4)

Country Link
EP (1) EP0097157B1 (enExample)
JP (1) JPS58501648A (enExample)
DE (1) DE3176475D1 (enExample)
WO (1) WO1983002363A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4462462A (en) * 1981-11-17 1984-07-31 International Business Machines Corporation Thermal conduction piston for semiconductor packages
USRE35721E (en) * 1983-12-14 1998-02-03 Hitachi, Ltd. Cooling device of semiconductor chips
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
JPS6115353A (ja) * 1984-06-29 1986-01-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション チツプ冷却装置
DE19802117C1 (de) * 1998-01-21 1999-06-02 Fne Gmbh Thermisch steuerbare Anordnung
KR102228516B1 (ko) * 2019-08-05 2021-03-16 엘지전자 주식회사 다수의 사용자가 포함된 사용자 그룹을 운송하는 자율 주행 차량 및 이의 제어 방법과, 상기 자율 주행 차량을 제어하는 제어 서버

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271638A (en) * 1963-11-04 1966-09-06 Emil M Murad Encased semiconductor with heat conductive and protective insulative encapsulation
US3536460A (en) * 1966-12-28 1970-10-27 Great Lakes Carbon Corp Connections between electrical conductors and carbon bodies and method of making same
US3449818A (en) * 1967-05-16 1969-06-17 North American Rockwell Superconductor joint
US3996447A (en) * 1974-11-29 1976-12-07 Texas Instruments Incorporated PTC resistance heater
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
US4254431A (en) * 1979-06-20 1981-03-03 International Business Machines Corporation Restorable backbond for LSI chips using liquid metal coated dendrites

Also Published As

Publication number Publication date
EP0097157A4 (en) 1985-03-08
EP0097157A1 (en) 1984-01-04
JPS6222531B2 (enExample) 1987-05-19
EP0097157B1 (en) 1987-09-30
WO1983002363A1 (en) 1983-07-07
JPS58501648A (ja) 1983-09-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee