JPS6222531B2 - - Google Patents

Info

Publication number
JPS6222531B2
JPS6222531B2 JP82500649A JP50064982A JPS6222531B2 JP S6222531 B2 JPS6222531 B2 JP S6222531B2 JP 82500649 A JP82500649 A JP 82500649A JP 50064982 A JP50064982 A JP 50064982A JP S6222531 B2 JPS6222531 B2 JP S6222531B2
Authority
JP
Japan
Prior art keywords
chip
temperature
alloy
contact
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP82500649A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58501648A (ja
Inventor
Yabanchu Kei Hatsusan
Sebujin Okutai
Jon Ei Paibanasu
Kurarensu Jei Supekutaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS58501648A publication Critical patent/JPS58501648A/ja
Publication of JPS6222531B2 publication Critical patent/JPS6222531B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/258—
    • H10W40/774—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/877—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP82500649A 1981-12-29 1981-12-29 冷却手段を備えた半導体組立体 Granted JPS58501648A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1981/001754 WO1983002363A1 (en) 1981-12-29 1981-12-29 Cooling means for integrated circuit chip device

Publications (2)

Publication Number Publication Date
JPS58501648A JPS58501648A (ja) 1983-09-29
JPS6222531B2 true JPS6222531B2 (enExample) 1987-05-19

Family

ID=22161583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP82500649A Granted JPS58501648A (ja) 1981-12-29 1981-12-29 冷却手段を備えた半導体組立体

Country Status (4)

Country Link
EP (1) EP0097157B1 (enExample)
JP (1) JPS58501648A (enExample)
DE (1) DE3176475D1 (enExample)
WO (1) WO1983002363A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190106837A (ko) * 2019-08-05 2019-09-18 엘지전자 주식회사 다수의 사용자가 포함된 사용자 그룹을 운송하는 자율 주행 차량 및 이의 제어 방법과, 상기 자율 주행 차량을 제어하는 제어 서버

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4462462A (en) * 1981-11-17 1984-07-31 International Business Machines Corporation Thermal conduction piston for semiconductor packages
USRE35721E (en) * 1983-12-14 1998-02-03 Hitachi, Ltd. Cooling device of semiconductor chips
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
JPS6115353A (ja) * 1984-06-29 1986-01-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション チツプ冷却装置
DE19802117C1 (de) * 1998-01-21 1999-06-02 Fne Gmbh Thermisch steuerbare Anordnung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271638A (en) * 1963-11-04 1966-09-06 Emil M Murad Encased semiconductor with heat conductive and protective insulative encapsulation
US3536460A (en) * 1966-12-28 1970-10-27 Great Lakes Carbon Corp Connections between electrical conductors and carbon bodies and method of making same
US3449818A (en) * 1967-05-16 1969-06-17 North American Rockwell Superconductor joint
US3996447A (en) * 1974-11-29 1976-12-07 Texas Instruments Incorporated PTC resistance heater
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
US4193445A (en) * 1978-06-29 1980-03-18 International Business Machines Corporation Conduction cooled module
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
US4254431A (en) * 1979-06-20 1981-03-03 International Business Machines Corporation Restorable backbond for LSI chips using liquid metal coated dendrites

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190106837A (ko) * 2019-08-05 2019-09-18 엘지전자 주식회사 다수의 사용자가 포함된 사용자 그룹을 운송하는 자율 주행 차량 및 이의 제어 방법과, 상기 자율 주행 차량을 제어하는 제어 서버

Also Published As

Publication number Publication date
EP0097157A4 (en) 1985-03-08
DE3176475D1 (en) 1987-11-05
EP0097157A1 (en) 1984-01-04
EP0097157B1 (en) 1987-09-30
WO1983002363A1 (en) 1983-07-07
JPS58501648A (ja) 1983-09-29

Similar Documents

Publication Publication Date Title
US4607277A (en) Semiconductor assembly employing noneutectic alloy for heat dissipation
US7429502B2 (en) Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink
US6281573B1 (en) Thermal enhancement approach using solder compositions in the liquid state
KR100447867B1 (ko) 반도체 패키지
CN100421861C (zh) 焊料
EP0473929B1 (en) Method of forming a thin film electronic device
US20070013054A1 (en) Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages
US20080017975A1 (en) Capillary underflow integral heat spreader
JPS6238860B2 (enExample)
WO2002011504A2 (en) Thermal interface material on a mesh carrier
JP4809606B2 (ja) ヒートシンクおよびヒート・スプレッダ・アセンブリ
TWI484604B (zh) 金屬熱界面材料以及含該材料的構裝半導體
TWI329350B (en) Capacitor attachment method
JPS6222531B2 (enExample)
JP2005129886A (ja) 半導体装置およびその製造方法
JP6144440B1 (ja) 半導体封止用プリフォーム
JP2020518461A (ja) はんだ材及びダイアタッチメント方法
EP1601012A2 (en) Microelectronic assembly having variable thickness solder joint
JP3418164B2 (ja) 電子パッケージ及び電子パッケージの製造方法
JP7481285B2 (ja) 半導体装置およびその製造方法
JPS61171153A (ja) 半導体装置
JP2008270846A (ja) 半導体装置の製造方法
JPS58111354A (ja) 熱的結合装置
KR20040077893A (ko) 열적 인터페이스 물질 및 인듐과 아연을 함유한 조성물
JP2025069577A (ja) 半導体装置、および、半導体装置の製造方法