DE3175451D1 - Electrically erasable mosfet storage device - Google Patents

Electrically erasable mosfet storage device

Info

Publication number
DE3175451D1
DE3175451D1 DE8181301080T DE3175451T DE3175451D1 DE 3175451 D1 DE3175451 D1 DE 3175451D1 DE 8181301080 T DE8181301080 T DE 8181301080T DE 3175451 T DE3175451 T DE 3175451T DE 3175451 D1 DE3175451 D1 DE 3175451D1
Authority
DE
Germany
Prior art keywords
storage device
electrically erasable
mosfet
mosfet storage
erasable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181301080T
Other languages
English (en)
Inventor
William Milton Gosney
Vernon George Mckenney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
Mostek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mostek Corp filed Critical Mostek Corp
Application granted granted Critical
Publication of DE3175451D1 publication Critical patent/DE3175451D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
    • H01L29/7886—Hot carrier produced by avalanche breakdown of a PN junction, e.g. FAMOS
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
DE8181301080T 1980-03-17 1981-03-16 Electrically erasable mosfet storage device Expired DE3175451D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/130,853 US4331968A (en) 1980-03-17 1980-03-17 Three layer floating gate memory transistor with erase gate over field oxide region

Publications (1)

Publication Number Publication Date
DE3175451D1 true DE3175451D1 (en) 1986-11-13

Family

ID=22446666

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181301080T Expired DE3175451D1 (en) 1980-03-17 1981-03-16 Electrically erasable mosfet storage device

Country Status (7)

Country Link
US (1) US4331968A (de)
EP (1) EP0037201B1 (de)
JP (1) JPH0368542B2 (de)
CA (1) CA1166353A (de)
DE (1) DE3175451D1 (de)
GB (1) GB2085228B (de)
WO (1) WO1981002810A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498095A (en) * 1978-05-02 1985-02-05 International Business Machines Corporation Semiconductor structure with improved isolation between two layers of polycrystalline silicon
US4561004A (en) * 1979-10-26 1985-12-24 Texas Instruments High density, electrically erasable, floating gate memory cell
DE3175125D1 (en) * 1980-11-20 1986-09-18 Toshiba Kk Semiconductor memory device and method for manufacturing the same
EP0054355B1 (de) * 1980-12-08 1986-04-16 Kabushiki Kaisha Toshiba Halbleiterspeicheranordnung
US4479203A (en) * 1981-11-16 1984-10-23 Motorola, Inc. Electrically erasable programmable read only memory cell
FR2517864A1 (fr) * 1981-12-07 1983-06-10 Telecommunications Sa Dispositif d'enregistrement et de lecture d'images
US4545035A (en) * 1982-07-20 1985-10-01 Mostek Corporation Dynamic RAM with nonvolatile shadow memory
US4527258A (en) * 1982-09-30 1985-07-02 Mostek Corporation E2 PROM having bulk storage
US5095344A (en) * 1988-06-08 1992-03-10 Eliyahou Harari Highly compact eprom and flash eeprom devices
US5168465A (en) * 1988-06-08 1992-12-01 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
US5268319A (en) * 1988-06-08 1993-12-07 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
US4962326B1 (en) * 1988-07-22 1993-11-16 Micron Technology, Inc. Reduced latchup in precharging i/o lines to sense amp signal levels
KR940006094B1 (ko) * 1989-08-17 1994-07-06 삼성전자 주식회사 불휘발성 반도체 기억장치 및 그 제조방법
US5343063A (en) * 1990-12-18 1994-08-30 Sundisk Corporation Dense vertical programmable read only memory cell structure and processes for making them
US5512505A (en) * 1990-12-18 1996-04-30 Sandisk Corporation Method of making dense vertical programmable read only memory cell structure
US6222762B1 (en) * 1992-01-14 2001-04-24 Sandisk Corporation Multi-state memory
US5712180A (en) * 1992-01-14 1998-01-27 Sundisk Corporation EEPROM with split gate source side injection
US5313421A (en) * 1992-01-14 1994-05-17 Sundisk Corporation EEPROM with split gate source side injection
US7071060B1 (en) * 1996-02-28 2006-07-04 Sandisk Corporation EEPROM with split gate source side infection with sidewall spacers
KR100192430B1 (ko) * 1995-08-21 1999-06-15 구본준 비휘발성 메모리 및 이 비휘발성 메모리를 프로그램하는 방법
KR0172831B1 (ko) * 1995-09-18 1999-03-30 문정환 비휘발성 메모리를 프로그램하는 방법
KR100192476B1 (ko) * 1996-06-26 1999-06-15 구본준 다중 비트 메모리 셀의 데이타 센싱장치 및 방법
KR100215883B1 (ko) * 1996-09-02 1999-08-16 구본준 플래쉬 메모리 소자 및 그 제조방법
KR100226746B1 (ko) * 1996-12-30 1999-10-15 구본준 다중비트셀의데이타센싱장치및방법
KR100244271B1 (ko) 1997-05-06 2000-02-01 김영환 반도체소자 구조 및 제조방법
FI981301A0 (fi) 1998-06-08 1998-06-08 Valtion Teknillinen Prosessivaihtelujen eliminointimenetelmä u-MOSFET-rakenteissa
US7541638B2 (en) 2005-02-28 2009-06-02 Skymedi Corporation Symmetrical and self-aligned non-volatile memory structure
US7439133B2 (en) * 2006-01-02 2008-10-21 Skymedi Corporation Memory structure and method of manufacturing a memory array
US7508028B2 (en) * 2006-10-26 2009-03-24 Episil Technologies Inc. Non-volatile memory
US7450424B2 (en) * 2007-01-31 2008-11-11 Skymedi Corporation Method for reading a memory array with a non-volatile memory structure
CN108695332B (zh) * 2018-05-18 2021-05-07 上海华虹宏力半导体制造有限公司 分栅式闪存及其形成方法、控制方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3755721A (en) * 1970-06-15 1973-08-28 Intel Corp Floating gate solid state storage device and method for charging and discharging same
US3996657A (en) * 1974-12-30 1976-12-14 Intel Corporation Double polycrystalline silicon gate memory device
NL7500550A (nl) * 1975-01-17 1976-07-20 Philips Nv Halfgeleider-geheugeninrichting.
JPS52106275A (en) * 1976-03-03 1977-09-06 Nec Corp Floating type nonvoltile semiconductor memory element
US4115914A (en) * 1976-03-26 1978-09-26 Hughes Aircraft Company Electrically erasable non-volatile semiconductor memory
FR2354152A1 (fr) * 1976-06-08 1978-01-06 Michelin & Cie Procede pour fabriquer par laminage un ruban en acier, et ruban resultant de ce procede
US4119995A (en) * 1976-08-23 1978-10-10 Intel Corporation Electrically programmable and electrically erasable MOS memory cell
US4099196A (en) * 1977-06-29 1978-07-04 Intel Corporation Triple layer polysilicon cell
US4203158A (en) * 1978-02-24 1980-05-13 Intel Corporation Electrically programmable and erasable MOS floating gate memory device employing tunneling and method of fabricating same
JPS5513901A (en) * 1978-07-17 1980-01-31 Hitachi Ltd Fixed memory of semiconductor
DE2908796C3 (de) * 1979-03-07 1982-04-01 Siemens AG, 1000 Berlin und 8000 München Umprogrammierbarer Halbleiter-Festwertspeicher vom Floating-Gate-Typ

Also Published As

Publication number Publication date
GB2085228A (en) 1982-04-21
JPS57500398A (de) 1982-03-04
US4331968A (en) 1982-05-25
WO1981002810A1 (en) 1981-10-01
EP0037201A3 (en) 1983-05-18
GB2085228B (en) 1984-05-23
EP0037201A2 (de) 1981-10-07
EP0037201B1 (de) 1986-10-08
JPH0368542B2 (de) 1991-10-28
CA1166353A (en) 1984-04-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SGS-THOMSON MICROELECTRONICS, INC. (N.D.GES.DES ST

8328 Change in the person/name/address of the agent

Free format text: DERZEIT KEIN VERTRETER BESTELLT

8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE REICHEL UND REICHEL, 60322 FRANKFURT

8339 Ceased/non-payment of the annual fee