DE3137408A1 - Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung - Google Patents
Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlungInfo
- Publication number
- DE3137408A1 DE3137408A1 DE19813137408 DE3137408A DE3137408A1 DE 3137408 A1 DE3137408 A1 DE 3137408A1 DE 19813137408 DE19813137408 DE 19813137408 DE 3137408 A DE3137408 A DE 3137408A DE 3137408 A1 DE3137408 A1 DE 3137408A1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor component
- power semiconductor
- component according
- ceramic substrate
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims description 41
- 238000001816 cooling Methods 0.000 title claims description 21
- 239000007788 liquid Substances 0.000 title claims description 9
- 239000000919 ceramic Substances 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 7
- 239000002826 coolant Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000002781 deodorant agent Substances 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 3
- 238000009429 electrical wiring Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813137408 DE3137408A1 (de) | 1981-09-19 | 1981-09-19 | Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung |
DE8282108080T DE3276980D1 (en) | 1981-09-19 | 1982-09-02 | Power semiconductor component for evaporation cooling or liquid cooling |
EP82108080A EP0075154B1 (de) | 1981-09-19 | 1982-09-02 | Leistungshalbleiterbauelement für Siedekühlung oder Flüssigkeitskühlung |
US06/419,398 US4520384A (en) | 1981-09-19 | 1982-09-17 | Power semiconductor component for cooling by boiling or liquids |
JP57162082A JPS58121655A (ja) | 1981-09-19 | 1982-09-17 | 気化冷却式または液冷式電力用半導体素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813137408 DE3137408A1 (de) | 1981-09-19 | 1981-09-19 | Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3137408A1 true DE3137408A1 (de) | 1983-04-07 |
Family
ID=6142181
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19813137408 Withdrawn DE3137408A1 (de) | 1981-09-19 | 1981-09-19 | Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung |
DE8282108080T Expired DE3276980D1 (en) | 1981-09-19 | 1982-09-02 | Power semiconductor component for evaporation cooling or liquid cooling |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282108080T Expired DE3276980D1 (en) | 1981-09-19 | 1982-09-02 | Power semiconductor component for evaporation cooling or liquid cooling |
Country Status (4)
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202018003992U1 (de) | 2018-08-26 | 2018-09-13 | Hochschule Mittweida (Fh) | Siedekühlbares Substrat mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten |
DE102018006806B4 (de) | 2018-08-26 | 2023-01-19 | Hochschule Mittweida (Fh) | Verwendung wenigstens eines Lasers zur Strukturierung mindestens eines Bereichs einer Oberfläche eines Substrats mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
JP3124513B2 (ja) * | 1997-06-18 | 2001-01-15 | 三菱電機株式会社 | 電力半導体スイッチ装置 |
DE102004060898B3 (de) * | 2004-12-17 | 2006-06-01 | Tyco Electronics Amp Gmbh | Selbstjustierender berührungsloser Positionsaufnehmer |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL208177A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1957-05-01 | |||
CH442502A (de) * | 1965-04-23 | 1967-08-31 | Siemens Ag | Gleichrichteranlage |
DE2160302C3 (de) * | 1971-12-04 | 1975-07-17 | Siemens Ag | Kühldose zum Einbau in Scheibenzellenstapel |
DE2705476A1 (de) * | 1977-02-10 | 1978-08-17 | Bbc Brown Boveri & Cie | Fluessigkeitsgekuehltes leistungs-halbleiterbauelement in scheibenzellenbauweise |
JPS54155774A (en) * | 1978-05-30 | 1979-12-08 | Toshiba Corp | Gas insulating thyristor bulb on water cooling system |
US4327370A (en) * | 1979-06-28 | 1982-04-27 | Rca Corporation | Resilient contact ring for providing a low impedance connection to the base region of a semiconductor device |
JPS5949709B2 (ja) * | 1979-10-13 | 1984-12-04 | 三菱電機株式会社 | 光点弧サイリスタ装置 |
-
1981
- 1981-09-19 DE DE19813137408 patent/DE3137408A1/de not_active Withdrawn
-
1982
- 1982-09-02 EP EP82108080A patent/EP0075154B1/de not_active Expired
- 1982-09-02 DE DE8282108080T patent/DE3276980D1/de not_active Expired
- 1982-09-17 JP JP57162082A patent/JPS58121655A/ja active Granted
- 1982-09-17 US US06/419,398 patent/US4520384A/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE202018003992U1 (de) | 2018-08-26 | 2018-09-13 | Hochschule Mittweida (Fh) | Siedekühlbares Substrat mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten |
DE102018006806B4 (de) | 2018-08-26 | 2023-01-19 | Hochschule Mittweida (Fh) | Verwendung wenigstens eines Lasers zur Strukturierung mindestens eines Bereichs einer Oberfläche eines Substrats mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten |
Also Published As
Publication number | Publication date |
---|---|
US4520384A (en) | 1985-05-28 |
JPS633457B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-01-23 |
DE3276980D1 (en) | 1987-09-17 |
EP0075154A2 (de) | 1983-03-30 |
EP0075154A3 (en) | 1985-04-03 |
EP0075154B1 (de) | 1987-08-12 |
JPS58121655A (ja) | 1983-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0149232B1 (de) | Halbleiterbauelement mit einem metallischen Sockel | |
DE4430047C2 (de) | Leistungs-Halbleitermodul mit verbessertem Wärmehaushalt | |
DE3643288C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
EP1592063B1 (de) | Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul | |
EP0368143A2 (de) | Elektronisches Steuergerät | |
EP0111659A1 (de) | Leistungstransistor-Modul | |
DE10013255A1 (de) | Harzgekapselte elektronische Vorrichtung zur Verwendung in Brennkraftmaschinen | |
DE3241508A1 (de) | Leistungstransistor-modul | |
EP1445799B1 (de) | Kühleinrichtung für Halbleiter auf Leiterplatte | |
EP0889526A2 (de) | Leistungshalbleitermodul mit geschlossenen Submodulen | |
DE1079205B (de) | Starkstrom-Gleichrichter | |
EP3226269B1 (de) | Leistungshalbleitereinrichtung | |
DE2632154C2 (de) | Kombinierte Trag- und Wärmeabstrahlplatte für ein angelötetes Halbleiterbauelement | |
DE3137408A1 (de) | Leistungshalbleiterbauelement fuer siedekuehlung oder fluessigkeitskuehlung | |
EP1825511B1 (de) | Halbleiterschaltmodul | |
EP1642334B1 (de) | Elektronisches leistungsmodul mit gummidichtung und entsprechendes herstellungsverfahren | |
DE102022101789A1 (de) | Halbleitervorrichtung | |
DE3444699C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
EP1309998B1 (de) | Verfahren zur elektrischen verbindung eines halbleiterbauelements mit einer elektrischen baugruppe | |
EP1455391B1 (de) | Leistungshalbleitermodul mit Sensorikbauteil | |
DE102019213956A1 (de) | (Leistungs-)Elektronikanordnung mit einer effizienten Kühlung | |
EP0491389B1 (de) | Leistungshalbleiterbauelement | |
WO2005106954A2 (de) | Leistungshalbleiterschaltung und verfahren zum herstellen einer leistungshalbleiterschaltung | |
DE102017211336A1 (de) | Leistungsmodul mit oberflächenmontierten elektrischen Kontaktierungselementen | |
WO2004100259A2 (de) | Halbleiterbauelement und verfahren zum herstellen eines halbleiterbauelements |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8127 | New person/name/address of the applicant |
Owner name: BBC BROWN BOVERI AG, BADEN, AARGAU, CH |
|
8139 | Disposal/non-payment of the annual fee |