DE3134557C2 - - Google Patents
Info
- Publication number
- DE3134557C2 DE3134557C2 DE3134557A DE3134557A DE3134557C2 DE 3134557 C2 DE3134557 C2 DE 3134557C2 DE 3134557 A DE3134557 A DE 3134557A DE 3134557 A DE3134557 A DE 3134557A DE 3134557 C2 DE3134557 C2 DE 3134557C2
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- arrangement according
- components
- insulating layer
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000010453 quartz Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims description 2
- 239000012811 non-conductive material Substances 0.000 claims description 2
- 230000007613 environmental effect Effects 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55121624A JPS5745955A (en) | 1980-09-02 | 1980-09-02 | Sealing container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3134557A1 DE3134557A1 (de) | 1982-06-24 |
| DE3134557C2 true DE3134557C2 (en, 2012) | 1987-10-15 |
Family
ID=14815861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19813134557 Granted DE3134557A1 (de) | 1980-09-02 | 1981-09-01 | Hermetisch dichtes gehaeuse fuer eine schaltungsplatte |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4420652A (en, 2012) |
| JP (1) | JPS5745955A (en, 2012) |
| DE (1) | DE3134557A1 (en, 2012) |
| GB (1) | GB2086140B (en, 2012) |
| HK (1) | HK57085A (en, 2012) |
| SG (1) | SG33785G (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10236278A1 (de) * | 2002-08-08 | 2004-02-26 | Schott Glas | Hermetisches TO-Gehäuse mit Keramikanschluss für erhöhte Datenraten |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1281810C (en) * | 1984-02-20 | 1991-03-19 | Stephen P. Rogerson | Mounting of saw devices |
| US4577056A (en) * | 1984-04-09 | 1986-03-18 | Olin Corporation | Hermetically sealed metal package |
| US4654472A (en) * | 1984-12-17 | 1987-03-31 | Samuel Goldfarb | Electronic component package with multiconductive base forms for multichannel mounting |
| FR2587857B1 (fr) * | 1985-09-24 | 1987-12-24 | Centre Nat Rech Scient | Oscillateur thermostate miniature |
| US4945399A (en) * | 1986-09-30 | 1990-07-31 | International Business Machines Corporation | Electronic package with integrated distributed decoupling capacitors |
| JPS6386554A (ja) * | 1986-09-30 | 1988-04-16 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | 電子的パッケ−ジ |
| US4792880A (en) * | 1986-10-03 | 1988-12-20 | Westinghouse Electric Corp. | Terminal module |
| US4744008A (en) * | 1986-11-18 | 1988-05-10 | International Business Machines Corporation | Flexible film chip carrier with decoupling capacitors |
| US5032692A (en) * | 1989-05-09 | 1991-07-16 | Avx Corporation | Process for manufactoring hermetic high temperature filter packages and the products produced thereby |
| DE4014918A1 (de) * | 1990-05-10 | 1991-11-14 | Grundfos Int | Elektromotor |
| DE4217837B4 (de) * | 1991-05-29 | 2006-04-27 | Mitsubishi Denki K.K. | Hermetisch abgeschlossenes Gehäuse |
| JP2667104B2 (ja) * | 1993-08-04 | 1997-10-27 | 飯島精密工業株式会社 | 円筒の精度検査装置 |
| JPH0718381U (ja) * | 1993-09-06 | 1995-03-31 | 住友電装株式会社 | コネクタ |
| DE4419439C2 (de) * | 1994-06-03 | 1997-09-11 | Philips Patentverwaltung | Anordnung mit einem elektrische Bauelemente enthaltenden Behälter und einer weitere Bauelemente tragenden Leiterplatte |
| US5500628A (en) * | 1995-01-24 | 1996-03-19 | Motorola, Inc. | Double-sided oscillator package and method of coupling components thereto |
| US5620476A (en) * | 1995-11-13 | 1997-04-15 | Pacesetter, Inc. | Implantable medical device having shielded and filtered feedthrough assembly and methods for making such assembly |
| WO1998001297A1 (en) * | 1996-07-09 | 1998-01-15 | Panex Corporation | Quartz construction |
| US6121678A (en) * | 1997-12-19 | 2000-09-19 | Stmicroelectronics, Inc. | Wrap-around interconnect for fine pitch ball grid array |
| US6349025B1 (en) | 1999-11-30 | 2002-02-19 | Medtronic, Inc. | Leak testable capacitive filtered feedthrough for an implantable medical device |
| US6414835B1 (en) | 2000-03-01 | 2002-07-02 | Medtronic, Inc. | Capacitive filtered feedthrough array for an implantable medical device |
| US6590158B1 (en) * | 2002-03-15 | 2003-07-08 | Alstom Schilling Robotics | Pressure container with layered seal assembly |
| US8561712B2 (en) | 2004-01-14 | 2013-10-22 | Royce McKim | Automatic stove top fire suppression module |
| US6992251B1 (en) * | 2004-08-31 | 2006-01-31 | Sung Jung Minute Industry Co., Ltd. | Rectification chip terminal structure |
| US20110048770A1 (en) * | 2009-08-31 | 2011-03-03 | Medtronic Inc. | Injection molded ferrule for cofired feedthroughs |
| US8644002B2 (en) | 2011-05-31 | 2014-02-04 | Medtronic, Inc. | Capacitor including registration feature for aligning an insulator layer |
| US20130058004A1 (en) | 2011-09-01 | 2013-03-07 | Medtronic, Inc. | Feedthrough assembly including underfill access channel and electrically insulating material |
| US8644936B2 (en) | 2012-01-09 | 2014-02-04 | Medtronic, Inc. | Feedthrough assembly including electrical ground through feedthrough substrate |
| USD817376S1 (en) | 2015-12-08 | 2018-05-08 | Carl Zeiss Sports Optics Gmbh | Spotting scope |
| USD818512S1 (en) | 2015-12-08 | 2018-05-22 | Carl Zeiss Sports Optics Gmbh | Spotting scope |
| US10765428B2 (en) | 2016-08-15 | 2020-09-08 | Covidien Lp | Hermetic force sensors for surgical devices |
| US10345165B2 (en) | 2016-09-08 | 2019-07-09 | Covidien Lp | Force sensor for surgical devices |
| EP3381510A1 (en) | 2017-03-27 | 2018-10-03 | Greatbatch Ltd. | Feedthrough assembly and flexible substrate assembly therefor |
| US10667408B2 (en) | 2017-05-18 | 2020-05-26 | Covidien Lp | Fully encapsulated electronics and printed circuit boards |
| US10588231B2 (en) | 2017-05-18 | 2020-03-10 | Covidien Lp | Hermetically sealed printed circuit boards |
| US10973142B2 (en) | 2017-05-18 | 2021-04-06 | Covidien Lp | Hermetically sealed printed circuit boards |
| US12232771B2 (en) | 2021-06-10 | 2025-02-25 | Covidien Lp | Mechanical compression hermetic force sensors for surgical devices |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3339117A (en) * | 1965-03-18 | 1967-08-29 | Cons Electronics Ind | Printed circuit board forming closure for electrical relay |
| US3828210A (en) * | 1973-01-22 | 1974-08-06 | Motorola Inc | Temperature compensated mounting structure for coupled resonator crystals |
| US4152671A (en) * | 1977-07-25 | 1979-05-01 | Atari, Inc. | Oscillator-modulator apparatus and method therefor |
| DE2936715C2 (de) * | 1979-09-11 | 1983-11-24 | Siemens AG, 1000 Berlin und 8000 München | Geschirmte Baugruppe |
-
1980
- 1980-09-02 JP JP55121624A patent/JPS5745955A/ja active Granted
-
1981
- 1981-08-27 GB GB8126170A patent/GB2086140B/en not_active Expired
- 1981-08-28 US US06/297,411 patent/US4420652A/en not_active Expired - Fee Related
- 1981-09-01 DE DE19813134557 patent/DE3134557A1/de active Granted
-
1985
- 1985-05-02 SG SG337/85A patent/SG33785G/en unknown
- 1985-08-01 HK HK570/85A patent/HK57085A/xx unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10236278A1 (de) * | 2002-08-08 | 2004-02-26 | Schott Glas | Hermetisches TO-Gehäuse mit Keramikanschluss für erhöhte Datenraten |
Also Published As
| Publication number | Publication date |
|---|---|
| SG33785G (en) | 1986-05-02 |
| HK57085A (en) | 1985-08-09 |
| DE3134557A1 (de) | 1982-06-24 |
| JPS5745955A (en) | 1982-03-16 |
| GB2086140B (en) | 1984-05-10 |
| GB2086140A (en) | 1982-05-06 |
| JPS6119116B2 (en, 2012) | 1986-05-15 |
| US4420652A (en) | 1983-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |