DE3129568A1 - Verbindungssystem einer halbleiteranordnung und verfahren zu dessen herstellung - Google Patents

Verbindungssystem einer halbleiteranordnung und verfahren zu dessen herstellung

Info

Publication number
DE3129568A1
DE3129568A1 DE19813129568 DE3129568A DE3129568A1 DE 3129568 A1 DE3129568 A1 DE 3129568A1 DE 19813129568 DE19813129568 DE 19813129568 DE 3129568 A DE3129568 A DE 3129568A DE 3129568 A1 DE3129568 A1 DE 3129568A1
Authority
DE
Germany
Prior art keywords
solder
stem
connection system
connection
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19813129568
Other languages
German (de)
English (en)
Other versions
DE3129568C2 (https=
Inventor
Michiharu Honda
Ryohei Totsuka Yokohama Satoh
Koji Serizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE3129568A1 publication Critical patent/DE3129568A1/de
Application granted granted Critical
Publication of DE3129568C2 publication Critical patent/DE3129568C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
DE19813129568 1980-07-28 1981-07-27 Verbindungssystem einer halbleiteranordnung und verfahren zu dessen herstellung Granted DE3129568A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10250980A JPS5728337A (en) 1980-07-28 1980-07-28 Connecting constructin of semiconductor element

Publications (2)

Publication Number Publication Date
DE3129568A1 true DE3129568A1 (de) 1982-04-22
DE3129568C2 DE3129568C2 (https=) 1988-04-14

Family

ID=14329354

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813129568 Granted DE3129568A1 (de) 1980-07-28 1981-07-27 Verbindungssystem einer halbleiteranordnung und verfahren zu dessen herstellung

Country Status (2)

Country Link
JP (1) JPS5728337A (https=)
DE (1) DE3129568A1 (https=)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2622741A1 (fr) * 1987-11-04 1989-05-05 Nec Corp Structure pour connexion de substrats a coefficients de dilatation thermique differents
EP0432361A3 (en) * 1989-11-08 1991-10-16 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5490040A (en) * 1993-12-22 1996-02-06 International Business Machines Corporation Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc ELECTRICAL CONTACT STRUCTURE MADE OF FLEXIBLE WIRE
EP0729652A4 (en) * 1993-11-16 1998-06-24 Formfactor Inc CONTACT STRUCTURE FOR CONNECTIONS, INTERMEDIATE PIECE, SEMICONDUCTOR ARRANGEMENT AND METHOD
EP0792519A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc CONNECTING ELEMENTS FOR MICROELECTRONIC COMPONENTS
EP0792463A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc ASSEMBLY OF SPRING ELEMENTS ON SEMICONDUCTOR COMPONENTS AND WAFERTEST PROCEDURE
WO1998028793A1 (en) * 1996-12-23 1998-07-02 General Electric Company Interface structures for electronic devices
EP0859686A4 (en) * 1995-05-26 1998-11-11 Formfactor Inc MANUFACTURE OF INTERCONNECTION ELEMENTS AND END CAPS FOR SACRIFICIAL SUBSTRATES
US6046410A (en) * 1996-12-23 2000-04-04 General Electric Company Interface structures for electronic devices
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
US6945827B2 (en) 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US7122760B2 (en) 2002-11-25 2006-10-17 Formfactor, Inc. Using electric discharge machining to manufacture probes
US7601039B2 (en) 1993-11-16 2009-10-13 Formfactor, Inc. Microelectronic contact structure and method of making same
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133632U (ja) * 1984-02-14 1985-09-06 富士通株式会社 半導体素子の実装構造
JPH0669052B2 (ja) * 1985-09-12 1994-08-31 富士通株式会社 半導体素子の高密度実装方法
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US7200930B2 (en) 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US20100065963A1 (en) 1995-05-26 2010-03-18 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH431658A (de) * 1964-12-10 1967-03-15 Marbag Ag Elektrisches Gerät mit elektrischen Bauelementen, insbesondere für industrielle Steuerungsaggregate
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
US3959579A (en) * 1974-08-19 1976-05-25 International Business Machines Corporation Apertured semi-conductor device mounted on a substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH431658A (de) * 1964-12-10 1967-03-15 Marbag Ag Elektrisches Gerät mit elektrischen Bauelementen, insbesondere für industrielle Steuerungsaggregate
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
US3763404A (en) * 1968-03-01 1973-10-02 Gen Electric Semiconductor devices and manufacture thereof
US3871014A (en) * 1969-08-14 1975-03-11 Ibm Flip chip module with non-uniform solder wettable areas on the substrate
US3959579A (en) * 1974-08-19 1976-05-25 International Business Machines Corporation Apertured semi-conductor device mounted on a substrate

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DE-Z.: Elektronik, 1960, Nr. 6, S. 163-167 *
DE-Z.: Nachrichtentechnik, 12, 1962, H. 11, S. 404-408 *
US-Z.: IBM Techn. Discl. Bull. Vol. 22, No. 10, März 1980, S. 4518-4520 *

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2622741A1 (fr) * 1987-11-04 1989-05-05 Nec Corp Structure pour connexion de substrats a coefficients de dilatation thermique differents
EP0432361A3 (en) * 1989-11-08 1991-10-16 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5077598A (en) * 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US7601039B2 (en) 1993-11-16 2009-10-13 Formfactor, Inc. Microelectronic contact structure and method of making same
EP0729652A4 (en) * 1993-11-16 1998-06-24 Formfactor Inc CONTACT STRUCTURE FOR CONNECTIONS, INTERMEDIATE PIECE, SEMICONDUCTOR ARRANGEMENT AND METHOD
US7225538B2 (en) 1993-11-16 2007-06-05 Formfactor, Inc. Resilient contact structures formed and then attached to a substrate
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5490040A (en) * 1993-12-22 1996-02-06 International Business Machines Corporation Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
EP0792519A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc CONNECTING ELEMENTS FOR MICROELECTRONIC COMPONENTS
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc ELECTRICAL CONTACT STRUCTURE MADE OF FLEXIBLE WIRE
EP0792463A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc ASSEMBLY OF SPRING ELEMENTS ON SEMICONDUCTOR COMPONENTS AND WAFERTEST PROCEDURE
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
EP0859686A4 (en) * 1995-05-26 1998-11-11 Formfactor Inc MANUFACTURE OF INTERCONNECTION ELEMENTS AND END CAPS FOR SACRIFICIAL SUBSTRATES
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5938452A (en) * 1996-12-23 1999-08-17 General Electric Company Flexible interface structures for electronic devices
WO1998028793A1 (en) * 1996-12-23 1998-07-02 General Electric Company Interface structures for electronic devices
US6046410A (en) * 1996-12-23 2000-04-04 General Electric Company Interface structures for electronic devices
US6298551B1 (en) 1996-12-23 2001-10-09 General Electric Company Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas
US6092280A (en) * 1996-12-23 2000-07-25 General Electric Co. Flexible interface structures for electronic devices
US7122760B2 (en) 2002-11-25 2006-10-17 Formfactor, Inc. Using electric discharge machining to manufacture probes
US7488917B2 (en) 2002-11-25 2009-02-10 Formfactor, Inc. Electric discharge machining of a probe array
US6945827B2 (en) 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US7731546B2 (en) 2002-12-23 2010-06-08 Formfactor, Inc. Microelectronic contact structure

Also Published As

Publication number Publication date
JPS5728337A (en) 1982-02-16
DE3129568C2 (https=) 1988-04-14

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee