DE3102015C2 - - Google Patents

Info

Publication number
DE3102015C2
DE3102015C2 DE3102015A DE3102015A DE3102015C2 DE 3102015 C2 DE3102015 C2 DE 3102015C2 DE 3102015 A DE3102015 A DE 3102015A DE 3102015 A DE3102015 A DE 3102015A DE 3102015 C2 DE3102015 C2 DE 3102015C2
Authority
DE
Germany
Prior art keywords
coating
weight
copper powder
anthracene
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3102015A
Other languages
German (de)
English (en)
Other versions
DE3102015A1 (de
Inventor
Yamahiro Hachioji Tokio/Tokyo Jp Iwasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Research Laboratory Co Ltd
Original Assignee
Asahi Chemical Research Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Research Laboratory Co Ltd filed Critical Asahi Chemical Research Laboratory Co Ltd
Publication of DE3102015A1 publication Critical patent/DE3102015A1/de
Application granted granted Critical
Publication of DE3102015C2 publication Critical patent/DE3102015C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Paints Or Removers (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
DE19813102015 1980-01-22 1981-01-22 Elektrisch leitendes beschichtungsmaterial und leiterplatte unter verwendung eines solchen beschichtungsmaterials Granted DE3102015A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP660980A JPS56103260A (en) 1980-01-22 1980-01-22 Conductive paint containing copper powder

Publications (2)

Publication Number Publication Date
DE3102015A1 DE3102015A1 (de) 1981-12-10
DE3102015C2 true DE3102015C2 (US08124317-20120228-C00009.png) 1991-06-20

Family

ID=11643087

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813102015 Granted DE3102015A1 (de) 1980-01-22 1981-01-22 Elektrisch leitendes beschichtungsmaterial und leiterplatte unter verwendung eines solchen beschichtungsmaterials

Country Status (6)

Country Link
US (1) US4353816A (US08124317-20120228-C00009.png)
JP (1) JPS56103260A (US08124317-20120228-C00009.png)
DE (1) DE3102015A1 (US08124317-20120228-C00009.png)
FR (1) FR2474045A1 (US08124317-20120228-C00009.png)
GB (1) GB2068976B (US08124317-20120228-C00009.png)
NL (1) NL191351C (US08124317-20120228-C00009.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10065540A1 (de) * 2000-12-28 2002-03-28 Infineon Technologies Ag Leiterbahn und Verfahren zur Herstellung

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4434084A (en) 1981-09-23 1984-02-28 E. I. Du Pont De Nemours And Company Base metal conductor cathode coating for tantalum capacitors
US4603162A (en) * 1983-06-17 1986-07-29 Matsushita Electric Industrial Co., Ltd. Radiation curable resin, paint or ink vehicle composition comprising said resin and magnetic recording medium or resistor element using said resin
JPS604552A (ja) * 1983-06-23 1985-01-11 Mitsubishi Gas Chem Co Inc 導電性組成物
US4535012A (en) * 1983-09-30 1985-08-13 Electro Materials Corp. Of America Fast curing solderable conductor
DE3466118D1 (en) * 1983-11-30 1987-10-15 Nissan Chemical Ind Ltd Electrically conductive composition
US4548879A (en) * 1984-05-21 1985-10-22 Rohm And Haas Company Solderable polymer thick films
US4663079A (en) * 1984-07-31 1987-05-05 Mitsubishi Petrochemical Co., Ltd. Copper-type conductive coating composition
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
JPS6276600A (ja) * 1985-09-29 1987-04-08 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
US4724040A (en) * 1986-01-14 1988-02-09 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electric circuits on a base boad
US4735676A (en) * 1986-01-14 1988-04-05 Asahi Chemical Research Laboratory Co., Ltd. Method for forming electric circuits on a base board
US4837050A (en) * 1986-09-30 1989-06-06 Asahi Chemical Research Laboratory Co., Ltd. Method for producing electrically conductive circuits on a base board
JPH01214100A (ja) * 1988-02-21 1989-08-28 Asahi Chem Res Lab Ltd 電磁波シールド回路及びその製造方法
US4999135A (en) * 1989-04-17 1991-03-12 Hiroshi Matsuda Rust-proof sealing composition
US4975221A (en) * 1989-05-12 1990-12-04 National Starch And Chemical Investment Holding Corporation High purity epoxy formulations for use as die attach adhesives
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
EP0651602B1 (en) 1993-10-29 1999-04-07 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
AU2002236606A1 (en) * 2000-12-15 2002-06-24 Omg Americas, Inc. Irregular shaped copper particles and methods of use
US20060108567A1 (en) * 2002-07-23 2006-05-25 Charati Sanjay G Conductive poly (arylene ether) compositions and methods of making the same
US8999200B2 (en) * 2002-07-23 2015-04-07 Sabic Global Technologies B.V. Conductive thermoplastic composites and methods of making
EP1837383B1 (en) * 2006-03-06 2008-06-04 Umicore AG & Co. KG Die-attach composition for high power semiconductors
CN101919005A (zh) 2007-09-13 2010-12-15 汉高股份两合公司 导电组合物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2564823A (en) * 1948-02-27 1951-08-21 Oneida Ltd Electropolish interrupter
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
US3983075A (en) * 1974-06-21 1976-09-28 Kennecott Copper Corporation Copper filled conductive epoxy
DE2614840A1 (de) * 1976-04-06 1977-10-20 Electro Kinetic Systems Inc Elektrisch leitfaehige harzmassen und verfahren zu ihrer herstellung
US4247594A (en) * 1979-04-30 1981-01-27 Marshall & Pike Enterprises Inc. Electrically conductive resinous composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10065540A1 (de) * 2000-12-28 2002-03-28 Infineon Technologies Ag Leiterbahn und Verfahren zur Herstellung

Also Published As

Publication number Publication date
GB2068976B (en) 1984-02-29
US4353816A (en) 1982-10-12
DE3102015A1 (de) 1981-12-10
GB2068976A (en) 1981-08-19
JPS56103260A (en) 1981-08-18
JPS6136796B2 (US08124317-20120228-C00009.png) 1986-08-20
FR2474045B1 (US08124317-20120228-C00009.png) 1983-12-30
NL191351C (nl) 1995-06-01
NL191351B (nl) 1995-01-02
FR2474045A1 (fr) 1981-07-24
NL8100286A (nl) 1981-08-17

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8181 Inventor (new situation)

Free format text: IWASA, YAMAHIRO, HACHIOJI, TOKIO/TOKYO, JP

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee