DE3067925D1 - High-speed plating arrangement and stamper plate formed using such an arrangement - Google Patents

High-speed plating arrangement and stamper plate formed using such an arrangement

Info

Publication number
DE3067925D1
DE3067925D1 DE8080301255T DE3067925T DE3067925D1 DE 3067925 D1 DE3067925 D1 DE 3067925D1 DE 8080301255 T DE8080301255 T DE 8080301255T DE 3067925 T DE3067925 T DE 3067925T DE 3067925 D1 DE3067925 D1 DE 3067925D1
Authority
DE
Germany
Prior art keywords
arrangement
plate formed
speed plating
stamper plate
stamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080301255T
Other languages
English (en)
Inventor
William Soby
Samuel James Blair Johnston
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMI Ltd
Original Assignee
EMI Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10505585&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3067925(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by EMI Ltd filed Critical EMI Ltd
Application granted granted Critical
Publication of DE3067925D1 publication Critical patent/DE3067925D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Optical Record Carriers (AREA)
DE8080301255T 1979-06-01 1980-04-18 High-speed plating arrangement and stamper plate formed using such an arrangement Expired DE3067925D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7919209 1979-06-01

Publications (1)

Publication Number Publication Date
DE3067925D1 true DE3067925D1 (en) 1984-06-28

Family

ID=10505585

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080301255T Expired DE3067925D1 (en) 1979-06-01 1980-04-18 High-speed plating arrangement and stamper plate formed using such an arrangement

Country Status (4)

Country Link
US (1) US4269669A (de)
EP (1) EP0020008B2 (de)
JP (1) JPS569396A (de)
DE (1) DE3067925D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3010383C2 (de) * 1980-03-18 1986-11-06 Polygram Gmbh, 2000 Hamburg Anodenkasten für ein galvanisches Bad
NL8005427A (nl) * 1980-09-30 1982-04-16 Veco Beheer Bv Werkwijze voor het vervaardigen van zeefmateriaal, verkregen zeefmateriaal alsmede inrichting voor het uitvoeren van de werkwijze.
SE8101046L (sv) * 1981-02-16 1982-08-17 Europafilm Anordning vid anleggningar, serskilt for matrisering av grammofonskivor och dylikt
DE3114106A1 (de) * 1981-04-08 1982-10-28 Teldec Telefunken-Decca-Schallplatten Gmbh, 2000 Hamburg Verfahren zur galvanischen abscheidung von kupfer auf einem substrat
FR2510615A1 (fr) * 1981-07-31 1983-02-04 Exnii Metallorezh Stankov Procede de fabrication d'outils formants metalliques par galvanoplastie et outils formants obtenus par ledit procede
DE3272891D1 (en) * 1981-10-01 1986-10-02 Emi Ltd Electroplating arrangements
US4415423A (en) * 1982-09-09 1983-11-15 Rca Corporation Electroforming apparatus for use in matrixing of record molding parts
US4687554A (en) * 1986-02-03 1987-08-18 Omi International Corporation Electrolytic apparatus and process
EP0310401B1 (de) * 1987-10-01 1994-04-20 Furukawa Circuit Foil Co., Ltd. Unlösliche Elektrode
SE467976B (sv) * 1991-02-20 1992-10-12 Dcm Innovation Ab Anordning foer elektroplaetering, vid framstaellning av matriser foer tillverkning av t ex cd-skivor samt foerfarande foer tillverkning av matriser medelst anordningen
US5597460A (en) * 1995-11-13 1997-01-28 Reynolds Tech Fabricators, Inc. Plating cell having laminar flow sparger
EP0799908B1 (de) * 1996-04-01 1999-08-18 Sono press, PRODUKTIONSGESELLSCHAFT FÜR TON- UND INFORMATIONSTRÄGER mbH Galvanische Abscheidungszelle mit Leitblende
US5683564A (en) * 1996-10-15 1997-11-04 Reynolds Tech Fabricators Inc. Plating cell and plating method with fluid wiper
US5904827A (en) * 1996-10-15 1999-05-18 Reynolds Tech Fabricators, Inc. Plating cell with rotary wiper and megasonic transducer
DE29701092U1 (de) * 1997-01-23 1997-03-20 Technotrans GmbH, 48336 Sassenberg Galvanische Abscheidungsvorrichtung
US6217727B1 (en) * 1999-08-30 2001-04-17 Micron Technology, Inc. Electroplating apparatus and method
JP2002004076A (ja) * 2000-06-16 2002-01-09 Sony Corp 電鋳装置
US20040055873A1 (en) * 2002-09-24 2004-03-25 Digital Matrix Corporation Apparatus and method for improved electroforming
ITTO20070704A1 (it) * 2007-10-05 2009-04-06 Create New Technology S R L Sistema e metodo di placcatura di leghe metalliche mediante tecnologia galvanica
US10190232B2 (en) 2013-08-06 2019-01-29 Lam Research Corporation Apparatuses and methods for maintaining pH in nickel electroplating baths
US9732434B2 (en) 2014-04-18 2017-08-15 Lam Research Corporation Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA544340A (en) * 1957-07-30 N.V. Philips Gloeilampenfabrieken Method of electro-forming moulds for sound-carriers
US1019969A (en) * 1910-02-19 1912-03-12 Fernand Lacroix Electrolysis of metallic solutions.
US2675348A (en) * 1950-09-16 1954-04-13 Greenspan Lawrence Apparatus for metal plating
US3186932A (en) * 1962-12-10 1965-06-01 Audio Matrix Inc Apparatus for forming phonograph record masters, mothers, and stampers
FR1503553A (fr) * 1966-05-25 1967-12-01 Pathe Marconi Ind Music Cuve de travail pour la reproduction galvanique de surfaces métalliques, notamment pour l'industrie du disque phonographique
US3558455A (en) * 1968-03-04 1971-01-26 Kennecott Copper Corp Electrolyte-circulating,electrolytic cell
JPS49123131A (de) * 1973-03-31 1974-11-25
GB1423488A (en) * 1974-05-10 1976-02-04 Europa Film Ab Container for anode material in apparatus for electrolytic surface deposition
JPS5144568A (ja) * 1974-10-16 1976-04-16 Nippon Telegraph & Telephone Denkaikaseiso
JPS5243733A (en) * 1975-10-03 1977-04-06 Nippon Kokan Kk Method of forming jet stream of plating solution in horizontal type electroplating and apparatus for said method
US4062755A (en) * 1976-05-03 1977-12-13 Bell Telephone Laboratories, Incorporated Electroplating anode plenum
JPS5334633A (en) * 1976-09-14 1978-03-31 Toppan Printing Co Ltd High speed electrocasting device
JPS53119227A (en) * 1977-03-28 1978-10-18 Sankuesuto Kk Plating method

Also Published As

Publication number Publication date
JPS569396A (en) 1981-01-30
US4269669A (en) 1981-05-26
EP0020008B2 (de) 1987-04-15
EP0020008A1 (de) 1980-12-10
EP0020008B1 (de) 1984-05-23

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Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8366 Restricted maintained after opposition proceedings
8339 Ceased/non-payment of the annual fee