DE3046192A1 - Traegerelement fuer ic-bausteine - Google Patents

Traegerelement fuer ic-bausteine

Info

Publication number
DE3046192A1
DE3046192A1 DE19803046192 DE3046192A DE3046192A1 DE 3046192 A1 DE3046192 A1 DE 3046192A1 DE 19803046192 DE19803046192 DE 19803046192 DE 3046192 A DE3046192 A DE 3046192A DE 3046192 A1 DE3046192 A1 DE 3046192A1
Authority
DE
Germany
Prior art keywords
windows
film
connection points
window
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19803046192
Other languages
German (de)
English (en)
Other versions
DE3046192C2 (cs
Inventor
Yahya Dipl.-Ing. 8000 München Haghiri-Tehrani
Joachim Hoppe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GAO Gesellschaft fuer Automation und Organisation mbH
Original Assignee
GAO Gesellschaft fuer Automation und Organisation mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GAO Gesellschaft fuer Automation und Organisation mbH filed Critical GAO Gesellschaft fuer Automation und Organisation mbH
Priority to DE19803046192 priority Critical patent/DE3046192A1/de
Priority to US06/317,873 priority patent/US4549247A/en
Priority to NLAANVRAGE8105002,A priority patent/NL189937C/xx
Priority to IT25059/81A priority patent/IT1139726B/it
Priority to CH7364/81A priority patent/CH661816A5/de
Priority to SE8106889A priority patent/SE457677B/sv
Priority to FR8121783A priority patent/FR2494908B1/fr
Priority to GB8135224A priority patent/GB2088630B/en
Publication of DE3046192A1 publication Critical patent/DE3046192A1/de
Application granted granted Critical
Publication of DE3046192C2 publication Critical patent/DE3046192C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Credit Cards Or The Like (AREA)
DE19803046192 1980-11-21 1980-12-08 Traegerelement fuer ic-bausteine Granted DE3046192A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE19803046192 DE3046192A1 (de) 1980-12-08 1980-12-08 Traegerelement fuer ic-bausteine
US06/317,873 US4549247A (en) 1980-11-21 1981-11-03 Carrier element for IC-modules
NLAANVRAGE8105002,A NL189937C (nl) 1980-11-21 1981-11-05 Inrichting met geintegreerde schakelingscomponent.
IT25059/81A IT1139726B (it) 1980-11-21 1981-11-13 Elemento di supporto per moduli a circuito integrato (ic) a forma compatta della grandezza del modulo
CH7364/81A CH661816A5 (de) 1980-11-21 1981-11-16 Traeger mit einem ic-baustein.
SE8106889A SE457677B (sv) 1980-11-21 1981-11-19 Anordning vid ett en ic-komponent uppbaerande folieelement, saerskilt foer identifieringskort
FR8121783A FR2494908B1 (fr) 1980-11-21 1981-11-20 Element support pour modules de circuit integre
GB8135224A GB2088630B (en) 1980-11-21 1981-11-23 A carrier element for ic modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803046192 DE3046192A1 (de) 1980-12-08 1980-12-08 Traegerelement fuer ic-bausteine

Publications (2)

Publication Number Publication Date
DE3046192A1 true DE3046192A1 (de) 1982-07-15
DE3046192C2 DE3046192C2 (cs) 1990-05-23

Family

ID=6118602

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803046192 Granted DE3046192A1 (de) 1980-11-21 1980-12-08 Traegerelement fuer ic-bausteine

Country Status (1)

Country Link
DE (1) DE3046192A1 (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3616494A1 (de) * 1985-05-20 1986-11-27 Tektronix, Inc., Beaverton, Oreg. Integrierte schaltungspackung und verfahren zur herstellung einer integrierten schaltungspackung
WO1997044823A1 (de) * 1996-05-17 1997-11-27 Siemens Aktiengesellschaft Trägerelement für einen halbleiterchip
WO2011047792A1 (de) * 2009-10-22 2011-04-28 Mühlbauer Ag Verfahren zum herstellen von durchkontaktierungen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
FR2456390A1 (fr) * 1979-05-11 1980-12-05 Thomson Csf Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
FR2456390A1 (fr) * 1979-05-11 1980-12-05 Thomson Csf Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP-PS Abstract 52-69564 *
Siemens "bauteile report" 16, 1978, H. 2, S. 40-44 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3616494A1 (de) * 1985-05-20 1986-11-27 Tektronix, Inc., Beaverton, Oreg. Integrierte schaltungspackung und verfahren zur herstellung einer integrierten schaltungspackung
WO1997044823A1 (de) * 1996-05-17 1997-11-27 Siemens Aktiengesellschaft Trägerelement für einen halbleiterchip
US6326683B1 (en) 1996-05-17 2001-12-04 Siemens Aktiengesellschaft Carrier element for a semiconductor chip
WO2011047792A1 (de) * 2009-10-22 2011-04-28 Mühlbauer Ag Verfahren zum herstellen von durchkontaktierungen

Also Published As

Publication number Publication date
DE3046192C2 (cs) 1990-05-23

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee