DE3024748C2 - Kühlkörper für Halbleiterbauelemente - Google Patents

Kühlkörper für Halbleiterbauelemente

Info

Publication number
DE3024748C2
DE3024748C2 DE3024748A DE3024748A DE3024748C2 DE 3024748 C2 DE3024748 C2 DE 3024748C2 DE 3024748 A DE3024748 A DE 3024748A DE 3024748 A DE3024748 A DE 3024748A DE 3024748 C2 DE3024748 C2 DE 3024748C2
Authority
DE
Germany
Prior art keywords
cooling
heat sink
cooling fins
profile insert
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3024748A
Other languages
German (de)
English (en)
Other versions
DE3024748A1 (de
Inventor
Uwe 7700 Singen Bock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Constellium Singen GmbH
Original Assignee
Aluminium Walzwerke Singen GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aluminium Walzwerke Singen GmbH filed Critical Aluminium Walzwerke Singen GmbH
Priority to DE3024748A priority Critical patent/DE3024748C2/de
Priority to SE8103779A priority patent/SE457584B/sv
Priority to GB8120125A priority patent/GB2079052B/en
Priority to FR8112876A priority patent/FR2485807A1/fr
Publication of DE3024748A1 publication Critical patent/DE3024748A1/de
Application granted granted Critical
Publication of DE3024748C2 publication Critical patent/DE3024748C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE3024748A 1980-06-30 1980-06-30 Kühlkörper für Halbleiterbauelemente Expired DE3024748C2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (de) 1980-06-30 1980-06-30 Kühlkörper für Halbleiterbauelemente
SE8103779A SE457584B (sv) 1980-06-30 1981-06-16 Kylkropp foer halvledare
GB8120125A GB2079052B (en) 1980-06-30 1981-06-30 Cooling bodies for semiconductors or the like
FR8112876A FR2485807A1 (fr) 1980-06-30 1981-06-30 Dissipateur de chaleur pour semi-conducteurs ou dispositifs analogues

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3024748A DE3024748C2 (de) 1980-06-30 1980-06-30 Kühlkörper für Halbleiterbauelemente

Publications (2)

Publication Number Publication Date
DE3024748A1 DE3024748A1 (de) 1982-02-04
DE3024748C2 true DE3024748C2 (de) 1986-09-04

Family

ID=6106046

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3024748A Expired DE3024748C2 (de) 1980-06-30 1980-06-30 Kühlkörper für Halbleiterbauelemente

Country Status (4)

Country Link
DE (1) DE3024748C2 (cg-RX-API-DMAC7.html)
FR (1) FR2485807A1 (cg-RX-API-DMAC7.html)
GB (1) GB2079052B (cg-RX-API-DMAC7.html)
SE (1) SE457584B (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9319259U1 (de) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Kühlkörper
DE19806978A1 (de) * 1998-02-19 1999-08-26 Behr Gmbh & Co Kühlvorrichtung, insbesondere zur Kühlung elektronischer Bauelemente durch Konvektion

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3518310A1 (de) * 1985-05-22 1986-11-27 Aluminium-Walzwerke Singen Gmbh, 7700 Singen Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung
DE8703604U1 (de) * 1987-03-11 1988-07-21 Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen Kühlkörper mit Halbleiterschalter
DE59106364D1 (de) * 1990-10-24 1995-10-05 Alusuisse Lonza Services Ag Kühlkörper für Halbleiterbauelemente.
GB2333353A (en) * 1998-01-16 1999-07-21 Kuo Ching Sung Heat dissipating device
DE102004040557A1 (de) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Elektronikkühlkörper
DE102009037259B4 (de) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul
US20160369995A1 (en) * 2015-06-16 2016-12-22 Posco Led Company Ltd. Optical semiconductor lighting apparatus
EP3403937B1 (en) * 2017-05-19 2021-01-13 Goodrich Lighting Systems GmbH Exterior aircraft light unit
DE102019107280A1 (de) * 2019-03-21 2020-09-24 apt Extrusions GmbH & Co. KG Kühleinrichtung zur Kühlung eines zu kühlenden Drittgegenstands
WO2020244727A1 (en) * 2019-06-03 2020-12-10 Huawei Technologies Co., Ltd. An apparatus for transferring heat from a heat source to air

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1959193A1 (de) * 1969-11-25 1971-05-27 Leonhard Roesch Vorrichtung zum Ermitteln der Maschen- und Reihenzahl bei Strickwaren
DE7913126U1 (de) * 1979-05-07 1979-08-23 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kuehlkoerper aus stranggepresstem aluminium fuer leistungshalbleiter

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9319259U1 (de) * 1993-12-15 1994-03-24 Siemens AG, 80333 München Kühlkörper
DE19806978A1 (de) * 1998-02-19 1999-08-26 Behr Gmbh & Co Kühlvorrichtung, insbesondere zur Kühlung elektronischer Bauelemente durch Konvektion
DE19806978B4 (de) * 1998-02-19 2008-08-21 Behr Gmbh & Co. Kg Kühlvorrichtung zur Kühlung durch Konvektion

Also Published As

Publication number Publication date
SE457584B (sv) 1989-01-09
FR2485807B3 (cg-RX-API-DMAC7.html) 1983-07-18
SE8103779L (sv) 1981-12-31
FR2485807A1 (fr) 1981-12-31
GB2079052A (en) 1982-01-13
DE3024748A1 (de) 1982-02-04
GB2079052B (en) 1984-10-24

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ALUSINGEN GMBH, 7700 SINGEN, DE

8339 Ceased/non-payment of the annual fee